Appendix https://www.nxp.com/company/our-company/about-nxp/corporate-responsibility/environmental-compliance-organization/product-content-search:ENV-PRODUCT-COMPOSITION and STMicroelectronics) NXP formed a consortium, known as the DA5 (Die-Attach 5), to jointly investigate and standardize the acceptance of alternatives for high-lead solder for attaching die to semiconductor packages during manufacturing.