Newsgroups: sci.electronics Path: cantaloupe.srv.cs.cmu.edu!crabapple.srv.cs.cmu.edu!fs7.ece.cmu.edu!europa.eng.gtefsd.com!emory!swrinde!zaphod.mps.ohio-state.edu!sol.ctr.columbia.edu!madvlsi.columbia.edu!seema From: seema@madvlsi.columbia.edu (Seema Varma) Subject: IC Packages Message-ID: <1993Apr16.142715.12613@sol.ctr.columbia.edu> Sender: nobody@ctr.columbia.edu Organization: Columbia University Date: Fri, 16 Apr 1993 14:27:15 GMT X-Posted-From: britain.madvlsi.columbia.edu NNTP-Posting-Host: sol.ctr.columbia.edu Lines: 28 Hi, I am looking for some help in choosing a package for a high-speed silicon ADC (100Mhz) currently being fabricated. This is a PhD research project and I have to test the chip at speed on a PCB. I expect to have roughly 100 packaged circuits and will do DC, low-speed and high-speed testing using 3 different set-ups for the test chip. I know for sure that a DIP will not work (the long lead lines have too high an inductance). Getting a custom-made package is too expensive, so I am trying to choose between a flatpak and a leadless chip carrier. The flatpack would be hard to test since it has to be soldered on to the test setup and I would spend loads of time soldering as I kept changing the test chip. The leadless chip carrier sockets also have long lead lines and may not work at high speeds. Does anyone out there have experience/knowledge of this field ? I would greatly appreciate help! Any ideas/ names of companies manufacturing holders/sockets/packages would help. P.S. The multi-layer fancy GaAs packages seem like a bit of overkill(?) --- Seema Varma