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Cooler Master GeminII M4 The Cooler The form factor is slightly different to the ‘tower type’ coolers that we are used to. As a low profile cooler, the heatsink is spread out horizontally, often known as a ‘top down design’. The fan is also thinner than standard 25mm ones a, coming in at 15mm. The 6mm heatpipes are laid out sensibly through the heatsink. With a slightly different layout on the other side. The base of the M4 is a heatpipe direct touch style base, which comes with some benefits – but a few downsides too. For example, having the heatpipe directly touching the CPU increases the efficiency of individual heatpipes. Instead of the heat having to travel through a base, then to the solder and then to the heatpipe. The downside is that because the actual CPU die is quite a bit smaller than the IHS (Integrated heat spreader, the top part you see of the CPU), the heat mostly comes from the middle of the IHS. This means the heatpipes nearest the core do most of the work, leaving the outside ones with less to do, decreasing overall performance. This is where a soldered on base helps to spread the work between heatpipes. The core was flat and well machined. This cooler is really thin, making it very useful for high end HTPC users.
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With Máistir GeminII M4 An with Is é an fachtóir fhoirm beagán difriúil leis an 'túr cineál' fuaraitheoirí go bhfuilimid úsáidtear chun. Mar with próifíl íseal, tá an heatsink scaipthe amach go cothrománach, go minic ar a dtugtar 'mbarr anuas a dhearadh'. Is é an lucht leanúna chomh maith thinner ná 25mm cinn caighdeánach a, ag teacht i ag 15mm. An heatpipes 6mm leagtha amach sensibly tríd an heatsink. Le leagan amach beagán difriúil ar an taobh eile. Is é an bonn ar an M4 ar heatpipe bonn stíl dhíreach teagmháil, a thagann le roinnt buntáistí - ach downsides roinnt freisin. Mar shampla, méadú ar a bhfuil an heatpipe díreach touching an LAP éifeachtacht na heatpipes aonair. In ionad an teas a bheith ag taisteal trí bhonn, ansin chun an solder agus ansin chun an heatpipe. Is é an downside gur toisc go bhfuil an bás LAP iarbhír go leor le beagán níos lú ná an IHS (leata teas Comhtháite, an chuid is fearr a fheiceann tú ar an LAP), a thagann an teas is mó ó lár an IHS. Ciallaíonn sé seo an heatpipes gaire croí an chuid is mó den obair, ag fágáil na cinn taobh amuigh le níos lú a dhéanamh, ag laghdú ar fheidhmíocht fhoriomlán. Tá sé seo nuair a chabhraíonn le soldered ar an mbonn a scaipeadh ar an obair idir heatpipes. An croí a bhí cothrom agus go maith machined. Is é seo an with i ndáiríre tanaí, rud a chiallaíonn sé a bheith úsáideach an-le haghaidh úsáideoirí deiridh ard HTPC.