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Heatsink Fan Tech Moving Forward A new technology in heat sinks and fans has been developed by US government lab Sandia National Laboratories in Livermore, California. The idea? To make the fan into a heatsink and vice versa. These could be utilised in CPU and GPU coolers soon enough; so perhaps we’ll actually get a different looking graphics card HSF soon. “We describe breakthrough results obtained in a feasibility study of a fundamentally new architecture for air-cooled heat exchangers,” wrote Jeffrey Koplow; making things as wordy as possible. The main problem with traditional coolers is that traditional coolers have a layer of air that covers the heatsink. Combine this with dust build up and you have a lot of insualtion between the highly heat conducting heatsink fins and the cool air blown over it by the fan. This new design eliminates the former and massively reduces the latter. “The tension in the market place between the need for energy efficiency and logistical considerations such as equipment size, cost and operating noise has resulted in a compromise that is far from ideal,” Koplow wrote. What Sandia created was originally known as the “Air Bearing Heat Exchanger”, though they quickly rebranded it as the “Sandia Cooler” before releasing it for licensing. This new cooler is built with a an aluminum base plate, a finned heatsink impeller and a brushless motor that rotates the impeller. Interesting that he didnt’ use copper with its improved heat conductivity. The heat sink spins, pulling in cool air from the surrounding area, then using centrifugal force is flung away from the centre point. One interesting thing with this design beyond its low energy usage is also the low profile of the cooler. I’m certainly looking forward to seeing this show up on my GPU. Looks like it could be heavy too. Read the full article at: http://www.theregister.co.uk/2011/07/12/air_bearing_heat_exchanger/
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Tech Fan heatsink Bogadh ar Aghaidh Tá teicneolaíocht nua i sinks teasa agus lucht leanúna curtha le chéile ag an rialtas SAM saotharlainne Sandia Saotharlanna Náisiúnta i Livermore, California. An smaoineamh? Chun an lucht leanúna i heatsink agus vice versa. D'fhéadfaí iad seo a úsáid i LAP agus fuaraitheoirí GPU go luath go leor; mar sin b'fhéidir beidh orainn a fháil i ndáiríre difriúil ag lorg cárta HSF grafaicí go luath. "Cur síos a dhéanamh againn torthaí cinn a fuarthas i staidéar féidearthachta ar ailtireacht bunúsach nua le haghaidh malartóirí teasa aer-cooled," a scríobh Jeffrey Koplow; rudaí a dhéanamh chomh wordy agus is féidir. Is í an fhadhb is mó le fuaraitheoirí traidisiúnta go bhfuil fuaraitheoirí traidisiúnta sraith de aer a chlúdaíonn an heatsink. Chomhcheangail seo le deannaigh a thógáil suas agus tá a lán de insualtion idir an teas an-i mbun eití heatsink agus an t-aer fionnuar blown thar sé leis an lucht leanúna. Eliminates an dearadh nua agus iar-massively laghdaíonn an dara ceann. "Tá an teannas sa mhargadh idir an gá atá le héifeachtacht fuinnimh agus cúrsaí lóistíochta, amhail méid trealamh, costas agus oibriúcháin torann mar thoradh ar chomhréiteach go bhfuil i bhfad ó idéalach," a scríobh Koplow. Cad Sandia cruthaithe raibh aithne ar dtús mar "malartóra teasa Air Bearing" an, cé go athbhrandáil siad go tapa é mar "with Sandia" an roimh scaoileadh é do cheadúnú. Tá an with nua a tógadh le pláta a bonn alúmanam, a impeller heatsink finned agus mótair brushless ar a rothlaítear an impeller. Suimiúil nach raibh sé 'a úsáid copar seoltacht teasa lena feabhsaithe. An spins doirteal teasa, ag tarraingt i aer fionnuar ón gceantar máguaird, ansin ag baint úsáide as bhfeidhm lártheifeacha bhfuil thangadar ar shiúl ó na lárphointe. Rud amháin atá suimiúil leis an dearadh níos faide ná a úsáid fuinnimh íseal chomh maith le próifíl íseal ar an with. Táim ag lorg cinnte tnúth le feiceáil seo a thaispeáint suas ar mo GPU. Breathnaíonn mhaith d'fhéadfadh sé a bheith ró-throm. Léigh an t-alt iomlán ag: http://www.theregister.co.uk/2011/07/12/air_bearing_heat_exchanger/