Asymtek announces collaborative effort to support microelectronics packaging and encapsulation research
Asymtek, a Nordson company and leader in dispensing, conformal coating, and jetting technologies, and the Fraunhofer Institut für Zuverlässigkeit und Mikrointegration Berlin announce their ongoing collaborative effort to support microelectronics packaging and encapsulation research using Asymtek's advanced dispensing and coating technology.
Scientists at Rice University and North Carolina State University have found a method of attaching molecules to semiconducting silicon that may help manufacturers reach beyond the current limits of Moore's Law as they make microprocessors both smaller and more powerful.