YSCM parallel splices cULus listed for grounding and bonding
BURNDY's YSCM type HYLINK seamless copper parallel splice connectors are now cULus listed for grounding and bonding per Underwriters Laboratories 467 and rated for direct burial in earth and concrete.
RIA CONNECT ASM01 spring contact is a single pole, vibration resistant SMD that allows for a solderless termination.