High density rectangular connector enhances retention, solderability
CW INDUSTRIES High density rectangular connector with enhanced retention and solderability, meets the requirements of MIL-DTL-28804 and NAVSEA 3164341 and 3164342 specifications.
BURNDY's YSCM type HYLINK seamless copper parallel splice connectors are now cULus listed for grounding and bonding per Underwriters Laboratories 467 and rated for direct burial in earth and concrete.