I have been at APEX all week, and just flew back this morning. Many people are at APEX. Maybe someone who works in the automotive design discipline can answer all of your questions. However, I would start doing my own homework, as dumping this load on Technet requires a large amount of work. Get it down to a few questions you cannot determine yourself.
Is there someone who wants to answer my questions?
1- Main copper thickness used in Automotive market?
2- Does Automotive market is asking for copper thickness reduction?
3- What is the standard maximum and minimum bow and twist for Pcbs with BGA components?
4- What is the standard tolerance for press-fit PTH?
5- When is panel plating suggested and When is pattern plating suggested?
6- What is the standard value for annular ring for Pcbs with high copper thicknes (more than 3 oz)?
7- Is AOI detecting all the PCB defects? What defects are not detected?
8- Is the automotive market requesting 100% AOI in internal and external layers?
9- What the is the maximum offset between copper and solder mask requested in the automotive market?
10- What the is the maximum offset between copper,solder mask and holes requested in the automotive market?
11- What is the main surface finish for Automotive?
12- What product application is used OSP for?
13- What product application is used ENIG for?
14- What product application is used Immersion Silver for?
15- Is Screen printing in use for Automotive market?
16- Is Screen printing used to mark code matrix?
18- Are customers requesting Ioni chromatography or any other similar analysis?
19- Is the automotive market requesting PEA packaging (Electrostatic Protected Area)?
20- Is Pollution gas test required for Automotive market?
21- What are the Significant Characteristics defined by Automotive market?
22- What are the main characteristics for satndard FR4 base material?
23- What are the main characteristics for lead free base material?