Santa Clara, CA (GLOBE NEWSWIRE) - PDF Solutions® (NASDAQ: PDFS), a leading provider of data and analytics solutions for the semiconductor industry, announced today the commercial deployment of its second generation Design-for-Inspection™ solution, which includes the eProbe® 250. The system is currently being prepared for shipment.
The Exensio® platform for big data unlocks relevant, actionable information buried in wafer fabrication, process control, and test data – as well as ECD – through four key components: Yield, Control, Test, ALPS and Char. The Exensio platform is available either on-premise or via software as a service (SaaS). The Design-for-Inspection™ solution generates differentiated data through e-beam measurement of extremely dense test structures, or DFI™ cells, across an entire fabrication process. Characterization Vehicle® (CV®) electrical test chip infrastructure provides core modeling capabilities, and is used by more leading manufacturers than any other test chips in the industry.