The present invention relates to the field of folding doors with flexible door leaves. More specifically, the invention relates to a door comprising a door leaf which is at least partly made of a flexible cloth material and which is movable between a closed position and an open, folded position, in which the door leaf is folded around a plurality of folding lines extended between opposite side edges of the door leaf, a plurality of guide members which are connected to the opposite side edges in a spaced-apart relationship along the same, and two side frames which extend adjacent to a respective side edge for guiding the guide members. Such a door is known from e.g. EP 0 113 634. The invention also relates to a method for assembling such a door.
Since the 1970s there has been a great need to use rapidly moving doors in buildings for industrial use. This applies to openings indoors as well as in external walls, where the door provides shielding between different activities or prevents draughts/heat losses. Presently, rolling doors with flexible door leaves are used for this purpose, which doors are rolled up on an overhead drive shaft and which can be provided with transverse wind reinforcements on the door leaf to counteract wind load. For security reasons, rolling doors can be provided with a safety edge protection, a drop protection, etc.
Alongside the development of rolling doors, there has been a development in foldable doors according to the introductory paragraph, in which the door leaf is instead folded as it is lifted during the opening process. These door leaves, too, are often provided with transverse wind reinforcements, comprising beams or sections which are suitably connected to the flexible door leaf. The wind reinforcements also contribute to the lateral stability of the door leaf.
The lifting arrangements of known folding doors vary from case to case, but usually the door leaf is lifted with the aid of at least one pair of belts/wires in the lowermost section, so that the transverse sections are gradually gathered in a bundle when the door is opened.
EP 0 113 634 describes a folding door with transverse reinforcement sections. Every other section, beginning with the lowermost one, is extended into the side frames and supports guide rollers which are guided by the side frames in the depth direction, i.e. perpendicular to the door opening. The intermediate sections are shorter and have no guide rollers. Three lifting belts, which run vertically along the door leaf, are each connected to the bottom section. When the belts are rolled up on a transverse overhead shaft, they pull the bottom section upwards, which in turn successively pulls the other sections upwards so that the door leaf is folded in horizontal folds. Since every other section lacks guide rollers and consequently is not guided by the side frames, in the open position these non-guided sections will hang like a cradle by the intermediary of two superjacent guided sections, so that the door leaf is folded like a concertina. By virtue of the fact that the belts run on the exterior of the door leaf and on one and the same side thereof, all the non-guided sections are forced to fall out on the opposite side of the door leaf during the opening motion. Thus, in this known door, the lifting belts ensure that the non-guided sections fall out in one and the same direction.
FR-A1-2,706,941 describes a folding door which, in conformity with the door in EP 0 113 634, has transverse reinforcement sections of which only every other section is guided by the side frames, and where the intermediate sections are non-guided in order to fall out sideways when the door is being closed. However, edge guide members are lacking, and the two side edges of the door leaf hang essentially completely unguided in the depth direction, received in the side frames. In this door, too, the lifting belts are used to ensure that the non-guided sections fall out on one and the same side of the door leaf. The lifting belts are located adjacent to the side frames.
FR-A1-2,722,531 describes a door in which all the transverse reinforcement sections run in one and the same relatively wide guide track in the side frames and where the lifting belts are attached to the second lowest section and run through special belt loops in every other section. These loops result in the sections with loops gathering in a first bundle during lifting, while the sections without loops gather in a second bundle, hanging from the first bundle. The loops ensure that the sections without loops fall out on one and the same side of the door leaf in connection with lifting. Extra safety belts begin operating if the regular belts should break. All belts are located in the door opening between the side frames.
SE 454,526 describes a technique for achieving forced folding of a door leaf, which is divided into horizontal, mutually foldable sections. In an embodiment shown in that document, the door leaf is designed in the form of a unitary, flexible piece of cloth, where every other section beginning with the lowermost is stiffened at its vertical side edges by means of rigid side borders. Every such rigid side border is provided with an upper and a lower guide pulley, which guide pulleys have a constant vertical relative position. These two pulleys run in an associated vertical guide track formed in the stationary side frame of the door. The guide track opening facing the door opening is provided with flanged edges for retaining the guide pulleys in the guide tracks. Thus, there is a plurality of guide tracks in each side frame. The number of guide tracks in each frame equals the number of sections provided with rigid side edges. Thus, only two guide pulleys run in each guide track, and, as a result of the stiffening, the stiffened sections are always vertically orientated in line with their associated guide track, and no folding takes place of these sections in connection with lifting. More specifically, the stiffened sections function as essentially completely rigid sections. In one example, the door leaf has three stiffened and three non-stiffened door leaf sections; and consequently three parallel guide tracks in each side frame.
In SE 454,526 mentioned above, two wires or the like are fastened to the lowermost, stiffened section for lifting and folding the door leaf. During lifting, the non-stiffened sections will be folded in between the stiffened sections, which assume a position beside each other like books on a shelf. When the door leaf has been lifted completely, a concertina-like bundle is obtained where the vertical, stiffened sections stand next to each other in a respective guide track and each intermediate, flexible section is extended obliquely downwards from the top of a stiffened section to the bottom of an adjacent stiffened section. In the lifted position, the whole bundle hangs from the section to which the wires are fastened.
Known folding doors of the type mentioned above exhibit various drawbacks depending upon the design chosen.
In the cases where the lifting belts and any associated loops are placed on the door leaf itself, there is a risk that individuals and vehicles will get caught in and lifted with the door leaf during opening. Moreover, such a placement is not aesthetically pleasing. Making holes for the lifting loops results in indication of fracture/weakening of the door leaf and additional manufacturing costs. In addition, centrally located lifting belts require a horizontal drive shaft or the like above the door.
Another drawback of the prior art doors is that the folding of the door leaf is effected in a non-reliable manner, or in a manner resulting in undesired wear of the door leaf. For example, the door leaf can be folded either inwards or outwards depending on the current pressure difference. This may, for example, result in the door leaf wearing against the upper edge of the door opening and/or the belts.
Any pressure differences are absorbed by the transverse reinforcement sections, which, consequently, are squeezed against the side frames. In that way, in some known doors, the side edges of the door leaf are squeezed between the sections and the frames, resulting in the door leaf wearing out.
Most known folding doors of the type described by way of introduction have a relatively wide side frame in the depth direction (i.e. transversely of the door opening) for receiving the side edge of the door leaf. Such a wide side frame is required to prevent the door leaf from jamming in the side frame during opening and closing. One drawback of having a wide side frame is that the door leaf can move in the depth direction in an undesired manner in connection with pressure differences, resulting in an undesired ability to move in the depth direction in the closed position, a poor aesthetic impression, and incomplete sealing. Moreover, a wide frame requires a large installation area and is expensive and heavy to make and assemble. A particular drawback of the door according to SE 454 526, wherein each stiffened section runs in its own guide track, is precisely that the side edges become very wide and costly as the height of the door and the number of sections increase, since a separate guide track is required for every other section of the door leaf.
These and other drawbacks of the prior art will appear clearly below in connection with the description of the invention.
In order to reduce the above-mentioned drawbacks of the prior art, according to the invention a door is provided of the type stated by way of introduction, i.e. a door comprising a door leaf which is at least partly made of a flexible cloth material and which is movable between a closed position and an open, folded position, in which open position the door leaf is folded about a plurality of folding lines extended between opposite side edges of the door leaf, a plurality of guide members which are connected to the opposite side edges in a spaced-apart relationship along the same; and two side frames which are extended adjacent to a respective side edge for guiding the guide members. The door according to the invention is characterised in that each side frame defines at least a first and a second guide groove, that said guide members comprise, at each side frame, a first set of guide members running in the first groove only of the side frame, and a second set of guide members running in the second groove only of the side frame, and that the first and the second guide members are connected to the door leaf in such a way that the side edges, in the folded position of the door leaf, run back and forth between the first and the second guide groove with said folding lines defined by the guide members.
A xe2x80x9cflexible cloth materialxe2x80x9d could be any suitable kind of cloth, fabric or sheet of a flexible, foldable material, which can be coated or uncoated.
When the door according to the invention is being opened or closed, the first guide members run in the first groove only and the second guide members run in the second groove only. In each groove, the associated guide members will be successively brought together during the opening motion. As a result, the mutual distance between the first guide members as well as the mutual distance between the second guide members will decrease when the door opens. Although, at present, it is probably preferable to have two guide grooves only in each side frame, it is within the scope of the invention to add one or more supplementary guide tracks, but in such variants it is still the case that the guide members in the first and the second guide groove are mutually brought together during the opening motion.
The expression xe2x80x9cguide groovexe2x80x9d can refer to a physical channel or the like, but it can also be interpreted as an abstract term and shall be considered to include all variants where the side edges are provided with special guide devices or means for defining two separate, predetermined movement paths or tracks for the guide members. Usually, the two guide grooves, which are defined by the side frames, are juxtaposed transversely of the door opening, but it is also possible that this distribution in the side frame itself is in a direction parallel to the door opening. In the latter case, there must be special connection members between the guide members and the edges of the door leaf, so that the attachment points in the edges of the door leaf run along two parallel lines or paths spaced from each other transversely of the door opening. In one embodiment, the first and the second guide groove can, for example, each be formed as a physical channel, whose side walls achieve the guiding of the guide members. These channels can be open towards the door opening but, with suitable connection members between the guide members and the door leaf edges, it is possible to turn the openings of the channels away from each other, so that one opening faces the front of the door and the other opening faces the rear of the door. As an alternative to physical channels, each guide groove can instead be defined by a rod or the like fixedly arranged in the side frame with which the guide members engage slidably in a suitable manner.
Usually, the door according to the invention would be orientated with vertical side frames and a vertically guided door leaf. However, it is within the scope of the invention to place the door horizontally instead, but to facilitate the description and definition of the invention, terms such as xe2x80x9cliftingxe2x80x9d, xe2x80x9cvertical side framesxe2x80x9d, etc. are used throughout this specification. Accordingly, if the door is to be placed lying down, these orientation-determining expressions should be interpreted to include the horizontal case as well.
It should be noted that the above-mentioned xe2x80x9cplurality of guide membersxe2x80x9d can comprise xe2x80x9cfurther guide membersxe2x80x9d in addition to said first guide members and said second guide members, for example special guide members at the closing edge of the door leaf. Even if the first and the second guide members are normally located alternatingly in the first and the second guide groove, there may be portions of the door leaf where two adjacent guide members are located in the same guide groove.
Several advantages are achieved by the invention by the provision of the double guide tracks in the side frames, as well as by the distribution of the guide members in the same:
1. A first advantage of double guide tracks is that the folding of the door leaf becomes much more exact and controlled in comparison with how the folding takes place in the known doors. A controlled folding in the side frames in turn leads to generally safer functioning with a reduced risk of a breakdown, and to a considerable improvement in the appearance of the door leaf during operation. Moreover, no special pre-folding members or wear protection is necessary.
2. As mentioned above, the side frames of the prior art doors must often be wide in the depth direction of the door opening in order to prevent the door leaf from jamming during lifting. The door according to the invention does not have that problem. Accordingly, a second advantage of double guide tracks is that the depth of the frame can be reduced considerably. The depth of the frame is mainly determined by the size of the guide elements in the depth direction of the door, but also by the amount of space required for the side edge itself of the door leaf.
3. A third advantage of double guide tracks and of the side frames actively influencing the folding in the direction desired is that all lifting members, such as belts or wires, can be located protected within the side frames. Unlike in known doors, the lifting members need not be mounted on the surface of the door leaf for guiding the folding, but can be located protected in the side frames. This in turn means that both the lifting members and the environment are protected. The general appearance of the door also becomes more attractive with concealed lifting members. The driving can be achieved with two lifting points only, and if a variant with a transverse drive axle is used, it can be made with a less substantial dimension. Placing all the lifting members in the side frames also yields the advantage that no transverse drive shaft is needed above the door since belt drums can be attached directly to the side frames. However, it should be noted that, for example, in connection with very wide and/or heavy doors, it might be necessary to provide supplementary safety belts/lifting belts in the middle to prevent deflection. However, unlike in the prior art, it is not necessary to use such an additional belt for guiding the folding, but only for reducing the stress on any fall-out-preventing means in the side frame.
4. A fourth advantage of double guide tracks is that, in its closed position, the door leaf can be positioned centrally in the depth direction between the guide tracks. This results in improved sealing and appearance, reduces wear and provides a more compact frame. In particular, the side edges of the door leaf can be guided in separate sections in the depth direction for obtaining an exceedingly compact door in the depth direction.
Normally, the transverse folding lines, or extensions thereof, of the door leaf, will intersect the guide grooves. Accordingly, if the door leaf is provided with a plurality of transverse reinforcement members, each of which is extended between an associated pair of guide members, extensions of these reinforcement members can intersect the guide grooves for defining the folding lines of the door leaf. In order to obtain a straighter door leaf in the closed position, all the reinforcement members, or at least the majority of them, can lie alternatingly on the one and on the other side of the door leaf. In a special case, the two lowermost reinforcement members can be located in the same guide groove.
With respect to the space requirement at the upper part of the door, it will be appreciated that, in principle, the space required in the depth direction for the reinforcement members, when these are piled on top of each other according to the invention in two guide grooves, is only half as large as in the prior art where they are piled up in one and the same channel.
In a preferred embodiment of the invention, the first guide groove and the second guide groove in each side frame comprise a first physical guide channel and a second physical guide channel respectively, which are open in the direction of the door opening and have a width in the depth direction which is adapted to the dimensions of the guide members in the same direction. In this connection, the guide members can consist of non-rotatable sliding members or rollers. However, it is essential that no large play is required in the depth direction between the guide members and the side walls of the guide channels.
Each guide channel can be provided with a fall-out-preventing means for retaining the guide members. The guide members can be designed themselves to prevent a fall if a lifting member breaks.
According to a first embodiment, each side frame is provided with a U-section, whose bottom wall partly covers the two guide channels in order to form fall-out-preventing means, extended along the frame and open towards the door opening. In this connection, this U-section can have a double function since the side edge of the door leaf can be inserted in and seal against the U-section. One part of this U-section can be detachable for installation and maintenance. This embodiment yields the advantage that both the guide members and the side edges of the door leaf have a limited ability to move in the depth directionxe2x80x94i.e. they have good guiding in the depth direction and that the door leaf is centred in the depth direction relative to the guide tracks.
According to a second embodiment, each side frame comprises a bottom wall, a first outer side wall and a first partition which both extend from the bottom wall for defining said first guide channel, and a second outer side wall and a second partition which both extend from the bottom wall for defining said second guide channel, wherein said first and second partitions define therebetween a space which receives the side edge of the door leaf. In this embodiment, the partitions serve two purposes: they define the guide channels and they receive therebetween the side edge of the door leaf in order to guide it along the side frame. In this embodiment, said partitions and said outer side walls can be provided with fall-out-preventing flanges adapted to retain the guide members in the guide channels.
The door leaf can be formed optionally as a continuous piece or divided into sections held together with e.g. transverse reinforcement sections. The door leaf can be formed entirely of a flexible cloth material, but the invention will also work if some door leaf sections are rigid. More specifically, the door leaf can be lifted in such a way that every other section is not folded, and these section can be made of a more rigid or a completely rigid material, while the other sections which are folded must be made of a flexible material.
Preferably, there is at least a first flexible pulling member, such as a belt, a wire, a chain or the like, in each side frame for guiding the movement of the door leaf. If the guide grooves are physical channels, the pulling members can suitably be located in the same. In one embodiment, a direct lifting force is applied to only a single guide member in each side frame, called a driven guide member. If the door leaf runs alternatingly between the two guide tracks all the way down to its closing edge, the lifting can be effected in the lowermost guide member. However, in some cases, there may be a special safety arrangement with a bottom section having a reduced weight. In such a case, the lifting be effected in the second lowest guide member instead. If, however, there is only one pulling member in each side frame, these members can consist of a continuous pulling member. Moreover, there can be double pulling members or more in each side frame.
In principle, the lifting force applied to the driven guide members can be transmitted to superjacent guide members in two different ways. Either the design is such that the guide members strike against each other during the lifting, so that the lifting force is transmitted directly in the side frame. Alternatively, transverse reinforcement sections are used which are of such thickness that they will strike against each other before the guide members strike against each other. In this case, the lifting forces are instead transmitted by the intermediary of the reinforcement sections and, specifically, in this connection, guide members in the form of rotatable rollers can be used, which may be problematic if the guide members are to abut against each other.
In one embodiment of the invention there may also be a further pulling member in each side frame which applies a direct lifting force to a second driven guide member, the first and the second driven guide members running in different grooves. If, for example, the second driven guide member is located closer to the closing edge of the door leaf, its pulling member can be driven a somewhat longer distance than the first pulling member for achieving an xe2x80x9cextra liftxe2x80x9d of the second driven pulling member during the opening motion of the door. This can, for example, be achieved by the use of larger diameters in the winding drums for the second pulling members and/or greater thickness in the latter. Another possibility is to lift the last section more at the end of the lifting motion by virtue of only the lower part of the pulling member having a substantially greater thickness or to mount a member on the lower part of the pulling member which gives it an extra lifting motion at the end of the opening motion. The advantage of such an extra lift is that the vertical dimensions of the door leaf in the open position can be further reduced.
For easy transportation and installation of the door, each side frame can be divided into a shorter top part and a longer bottom part. The top parts are made with such a length that all guide members, which are connected to the side edges of the door leaf, can be received in the top parts simultaneously. In this way, the whole door leaf, all the reinforcement sections, all the lifting members, the upper part of the frames as well as the drive unit can be pre-assembled at the factory and be delivered to the installation site as a single unit. The top parts with the guide members inserted therein are mounted to the bottom parts only at the location where the door is to be installed. In assembling the frame parts, the guide grooves are likewise assembled, and the guide members and the pulling member can then be inserted into the side frames and the door can be used directly.
These and other embodiments and advantages of the invention will appear from the claims and from the following detailed description of preferred embodiments.


1. Technical Field
The present disclosure generally relates to testing devices and, particularly, to a probe for testing a printed circuit board.
2. Description of Related Art
Developments in electronic technology have brought increases in the number of components arranged on the printed circuit boards. A printed circuit board having components thereon requires quality testing of electronic properties before release. In a commonly used testing method, a plurality of welding portions is formed on the conductive wires of the printed circuit board. However, each welding portion is wider than the conductive wire, whereby signal transmission of the conductive wires and, correspondingly, the testing precision may be compromised.
In another testing method, a weld bead is applied on the conductive wire, and then contacted with a probe. However, the probe often has a flattened surface or a plurality of protrusions with tips. The contact area between the probe and the weld bead may be relatively small, because the weld bead is substantially spherical, which decreases the testing precision. Furthermore, the tips of the probe may cause damage or break the weld bead or the conductive wire easily, which also decreases the testing precision.
Therefore, there is room for improvement within the art.


1. Field of the Invention
The present invention relates to a device and a method for controlling a substrate processing apparatus that performs a specified process on a substrate, and to a storage medium that stores the control program. More particularly, the present invention relates to a method for controlling the transfer of the substrate.
2. Description of the Related Art
The recent substrate processing apparatuses installed in the semiconductor factory mostly include a transfer mechanism transferring a substrate and two or more processing chambers performing a specified process on the substrate. In the substrate processing apparatus including a plurality of processing chambers, it is important to transfer a large number of substrates to the processing chambers in a way to increase the throughput of the substrate process and increase the productivity of the products.
Some of the conventional substrate processing apparatuses operate as follows. Different substrates are processed in different processing chambers at the same time. The processing is done after sequentially transferring the different substrates to the different processing chambers through different transfer paths for the different substrates (hereinafter this transfer method is also referred to as “OR transfer”). Alternatively, the transfer paths for the different substrates are controlled so that the substrates are sequentially processed via two or more processing chambers (see, for example, Japanese Patent Laid-Open Application No. 63-133532). The substrates may thus be processed efficiently.
Others of the conventional substrate processing apparatuses refer to a signal indicating which processing chamber is operatable, and transfer the substrate only to a group of the operatable processing chambers (see, for example, Japanese Patent Laid-Open Application No. 11-067869). If any of the processing chambers cannot operate due to a failure or the like, other processing chambers may be used to process the substrate efficiently.


Thanks to success of long term evolution (LTE)/LTE-advanced (LTE-A) for 4G mobile communication, interest in future mobile communication, that is, 5G mobile communication, is increasing and studies thereon are continuing.
In next-generation mobile communication, that is, 5G mobile communication, a data service having a minimum speed of 1 Gbps seems to be realized.
In 5G mobile communication, a turbo code, a polar code, a low density parity check (LDPC) code, etc. are considered as a channel coding method. Thereamong, the polar code is used by combining successive cancelation (SC) decoding and list decoding. However, in the list decoding, there is no method of excluding an erroneous decoding path through error correction before final decoding ends. Accordingly, the erroneous decoding path finally remains, thereby increasing an error probability and decreasing list gain.


With increasing needs to wirelessly identify and capture data related to physical objects, there has been an increased use of radio-frequency identification (RFID) and barcode technologies. RFID technologies offer the promise of non-line-of-sight identification, reading of many objects simultaneously with a single reader and the promise of supporting greater functionality including sensor inputs and large amounts of rewritable memory. For these reasons RFID has emerged as a preferred automatic identification and data capture technology.
RFID readers or interrogators are used for communicating with and optionally powering tags affixed to objects. Readers can be found in fixed or mobile configurations and may be embedded in a variety of devices, including mobile phones. A unique ID code stored in the tag is communicated to the reader and associated with information in a database. At minimum an RFID tag consists of an electronic circuit attached to an antenna on some substrate. The electronic circuit may be chipless, containing only passive elements (e.g. inductors, capacitors, resistors, diodes), or may contain an integrated circuit containing active electronic devices such as transistors. A reader consists of an RF transceiver unit attached to one or more antennas.
At lower operating frequencies (such as 125 KHz or 13.56 MHz) where the wavelength of the electromagnetic field is large compared to the operating distance, the coupling between the reader and the tag is often described as “near-field” coupling. In this case, the reader antenna and the tag antennas are coupled together either inductively with coils or capacitively with planar electrodes, in which the tag antenna can be resonant or non-resonant.
At higher operating frequencies (such as 915 MHz or 2.45 GHz) where the wavelength of the electromagnetic field is small compared to the operating distance (generally 1 meter or more), the interaction between the reader and the tag is known as “far-field.” In this case, the tag communicates information to the reader by reflecting or scattering back some of the electromagnetic field that is incident on the tag. The amount of power that the tag is able to scatter back to the reader is dependent on the antenna shape, size, and tuning, and is generally described by a normalized parameter known as the scattering cross section.
The form of electromagnetic communication between a tag and a reader is important, since it influences the shape and form of the tag and reader antennas. Capacitively coupled antennas may be untuned or tuned and require two electrically disconnected electrodes (see e.g. U.S. Pat. No. 6,611,199). Inductively coupled antennas generally require tuned antennas in the form of a coil. Far-field antennas can employ either one or two electrodes, but also require tuning as well, in order to maximize the scattering cross-section.
RFID tags of all forms present unique challenges to integration with products both electromagnetically and mechanically. Because RFID tags communicate with RFID readers via electromagnetic fields and waves, the product packaging materials and contents can strongly affect communications between reader and tag. Liquid and metallic materials are known to both absorb and reflect electromagnetic energy.
The physical integration of RFID tags with product packaging is generally challenging because many production processes have been well established and are unforgiving to significant changes or additions. Thus, there exists a need for innovative manufacturing methods as well as antenna designs to better integrate RFID tags into existing packaging materials and existing manufacturing methods at a low cost.
In the pharmaceutical industry, blister packages have emerged as a preferred method of packaging items for such reasons as security, product protection, display aesthetics, child-resistance, and medication compliance. Due to the increasing need to provide improved product tracking and tracing capabilities and additional security benefits there is a need to integrate RFID tags with blister packages.
Blister packages have been in use since at least the 1960s for packaging of a variety of products, including items such as toys, tools, chewing gum, and medication. A large body of prior art exists which cover various blister package designs and packaging materials (see e.g. U.S. Pat. No. 3,054,502, U.S. Pat. No. 2,503,493, U.S. Pat. No. 3,380,578, and U.S. Pat. No. 5,954,204).
Due to the existence of electrically conductive lidding film as a key component of the package, however, blister packages present unique challenges to integration of RFID tags. The lidding film typically consists of thin metal foil (0.6-1 mil=10 to 25 microns) and may incorporate additional laminated layers, such as paper or PET, and other coatings, for purposes such as heat sealing and printing. If RFID tag labels are applied to the lidding film, the electrical conductivity of the lidding film can detune RFID tag antennas and reflect electromagnetic fields and waves preventing necessary power transfer and communications—ultimately leading to poor RFID performance.
One solution to this problem is to add spacing or ferrite materials between the RFID tag and the blister package lidding film; however, this can add significant cost to overall package materials and production, while providing only a minor improvement in RFID performance.
Additionally, because the lidding film is designed to seal the contents in the package and act as a protective barrier, simply replacing the lidding film with any RFID tag label is not a viable option. The tag antenna must be designed so that the protective barrier is not compromised. Although various non-metallic non-conductive films have been developed as an alternative to metal foil lidding materials, the metal foils remain the most attractive in terms of cost.
Since the blister seal must not be compromised and also since the surface area between adjacent blisters is limited, an additional challenge is to create an RFID antenna that will fit within the limited available area in between adjacent blisters.
In the case of the tuned coil antenna employed for inductive coupling, it is desirable to maximize the enclosed area of the coil as well as the number of turns in order to maximize the mutual inductance between the tag and reader and also achieve the proper inductance value to enable resonant tuning. In addition, since the thickness of the blister pack foil lidding is generally 30 microns or less, it is necessary to maintain the width of the metal coil traces to a few hundred microns or greater in order to prevent excessive resistive loss in the tag antenna coil. As a result of all these factors, it is a great challenge to create an antenna that will fit within the limited surface area of the blister pack and also avoid cutting the portions of the foil which seal the blisters.
Although there have been several attempts to integrate blister packaging with RFID functionality, these prior inventions rely on antennas and electronic devices that are external to the blister package, and are not an integral part of the blister pack materials themselves. U.S. Pat. No. 6,244,462, for example, describes an external paper box or sleeve, with conductive traces, monitoring circuit, and transceiver into which a conventional blister package is inserted. Other prior art is specifically intended for monitoring the dispensing of medication in unit-dose blister packages, incorporate conductive traces located above the enclosed contents, which when broken, provide an indication that the contents have been removed. U.S. Pat. No. 6,574,166, for example, describes a package for monitoring medication compliance, where the conductive traces for sensing are integrated within the blister package, but the monitoring circuit and transceiver with antenna are located either external to the package or added as extra components to the package itself. The use of external devices or high-conductivity printed layers adds undesirable cost and complexity to the process of blister pack manufacture.
In order to achieve low-cost and large-scale manufacture of blister packages with RFID functionality, there still exists a need for innovative package designs and manufacturing methods which can enable better integration of an RFID circuit and antenna with the existing materials and processes used in blister pack manufacture.


Current methods of controlling transmitters, e.g. prototype, system under test, or experimental transmitters, in lab testing consist of an operator manually activating a control button, which provides a transmitter a required input to begin a transmission sequence. An operator would then observe a standard multi-meter output and record, by hand, a date/time a receive event occurred. This method of testing is both wasteful and inaccurate. A need presently exists for a way to automate and monitor a transmission sequence and receiver event. Another aspect is providing a monitoring and automation system which is flexible enough and capable of monitoring a variety of transmission sequence and/or receiver events to include particular types of timing or signal events.


1. Field of the Invention
The present invention relates to an optical disk and a method for producing the same. In particular, the present invention relates to an optical disk in which a substrate on an incident side of laser light is thinner, and a method for producing the same.
2. Description of the Related Art
In recent years, various studies have been conducted on the recording of optical information in the field of information recording. Recording of optical information can be conducted at higher density, and optical information can be recorded/reproduced in a non-contact manner; therefore, as a method for realizing the recording/reproducing of optical information at a low cost, applications for use in a wide range are being realized. Examples of current optical disks include those having a structure in which an information layer is provided on a transparent resin substrate with a thickness of 1.2 mm and protected by an overcoat or those having a structure in which an information layer is provided on one side or both sides of a transparent resin substrate with a thickness of 0.6 mm, and two substrates are attached to each other.
Recently, in order to increase the recording density of an optical disk, a method for increasing a numerical aperture (NA) of an objective lens, a method for shortening a wavelength of the laser to be used, and the like have been considered. As the thickness of a recording/reproducing side substrate (i.e., substrate on an incident side of laser light) becomes smaller, the influence of aberration on a laser spot can be decreased, and an allowable value of a tilt of a disk can be increased. Because of this, it is proposed that the thickness of a recording/reproducing side substrate, a NA, and a laser wavelength are prescribed to be about 0.1 mm, about 0.85, and about 400 nm, respectively.
In a current DVD (digital versatile disk), mainly, a method is used in which two transparent resin substrates (thickness: 0.6 mm), on which film formation and the like are conducted, are attached, with radiation curable resin. Even when the thickness of a recording/reproducing side substrate becomes about 0.1 mm for the purpose of achieving high density, it is desirable to attach substrates to each other by the same method using the same facility as those currently used.
However, with an optical disk in which two substrates are attached to each other, it is necessary to enhance durability. Furthermore, when the centers of two substrates are shifted from each other, deflections occur when the optical disk is rotated. Therefore, it is required to align the centers of two substrates with each other with high precision. There also is a demand for a method for easily producing such optical disks.
Therefore, with the foregoing in mind, it is an object of the present invention to provide an optical disk that is recordable at high density by attaching two substrates to each other, and a method for producing the same.
In order to achieve the above-mentioned object, an optical disk of the present invention includes a first substrate having a signal area on a principal plane and a central hole A and a second substrate that is transparent and attached to the first substrate, wherein the second substrate is thinner than the first substrate and has a central hole B whose diameter is larger than that of the central hole A, and the first substrate and the second substrate are attached to each other with an adhesive member disposed therebetween so as to extend at least from an inner peripheral edge of the second substrate to an outer peripheral edge thereof.
According to the above-mentioned configuration, an easy-to-handle optical disk is obtained that is capable of conducting high-density recording. Because of this, when a disk is handled, cracking or peeling of a contact portion can be prevented. The term xe2x80x9cradiationxe2x80x9d used herein includes a particle wave such as an electron beam and ultraviolet-rays and an electromagnetic wave.
In the above-mentioned optical disk, the adhesive member may be radiation curable resin. According to this configuration, an optical disk can be produced easily.
In the above-mentioned optical disk, a thickness of the second substrate may be in a range of 0.03 mm to 0.3 mm. According to this configuration, in particular, an optical disk that is recordable at high density can be obtained.
In the above-mentioned optical disk, the central hole B may be larger than a clamp area of the optical disk. According to this configuration, an optical disk can be fixed stably. Furthermore, when an optical disk is clamped, the second substrate can be prevented from peeling.
In the above-mentioned optical disk, the adhesive member may be disposed on an outer peripheral side of a clamp area or disposed so as to cover the entire clamp area. According to this configuration, since a thickness of the clamp area can be rendered uniform, a tilt is prevented from occurring during recording/reproduction.
In the above-mentioned optical disk, a thickness of a clamp area of the first substrate may be in a range of 1.1 mm to 1.3 mm.
In the above-mentioned optical disk, the first substrate includes, on the principal plane, at least one selected from the group consisting of a convex portion formed in a circular shape so as to surround the central hole A and having an outer diameter equal to or smaller than a diameter of the central hole B, and a concave portion formed in a circular shape so as to surround the central hole A and having a diameter equal to or smaller than the diameter of the central hole B.
In the above-mentioned optical disk, a height of the convex portion may be larger than a sum of a thickness of the second substrate and a thickness of the adhesive member.
In the above-mentioned optical disk, an average thickness of the adhesive member may be in a range of 0.5 xcexcm to 30 xcexcm.
In the above-mentioned optical disk, the optical disk is adapted for reproduction of information by application of a laser having a wavelength of 450 nm or less. According to this configuration, in particular, information can be recorded at high density.
Furthermore, a first method for producing an optical disk of the present invention including a first substrate having a central hole A and a second substrate that is transparent and has a central hole B whose diameter is larger than that of the central hole A includes the processes of: (a) bringing the first substrate having a signal area on a principal plane and the second substrate that is thinner than the first substrate into contact with each other with radiation curable resin interposed therebetween so that the principal plane faces inside; and (b) irradiating the radiation curable resin with radiation to cure the radiation curable resin, thereby attaching the first substrate to the second substrate, wherein, in the process (a), the radiation curable resin is disposed so as to extend at least from an inner peripheral edge of the second substrate to an outer peripheral edge thereof.
According to the first production method, an easy-to-handle optical disk that is recordable at high-density can be produced easily.
In the first production method, a thickness of the second substrate may be in a range of 0.03 mm to 0.3 mm.
In the first production method, the process (a) may include interposing the radiation curable resin between the first and second substrates, and rotating the first and second substrates to draw the radiation curable resin. According to this configuration, the thickness of resin easily can be rendered uniform.
In the first production method, the process (a) may include pouring the radiation curable resin onto the first substrate, rotating the first substrate to coat the first substrate with the radiation curable resin, and bringing the first substrate and the second substrate into contact with each other with the radiation curable resin interposed therebetween.
In the first production method, in the process (a), the first substrate and the second substrate are brought into contact with each other in a vacuum atmosphere. According to this configuration, air bubbles can be prevented from entering between the first substrate and the second substrate. The term xe2x80x9cvacuum atmospherexe2x80x9d as used here refers to an atmosphere with a reduced pressure (e.g., an atmosphere of 1000 Pa or less).
In the first production method, the first substrate may include, on the principal plane, at least one selected from the group consisting of a convex portion formed in a circular shape so as to surround the central hole A and having an outer diameter equal to or smaller than a diameter of the central hole B, and a concave portion formed in a circular shape so as to surround the central hole A and having a diameter equal to or smaller than that of the central hole B.
In the first production method, a height of the convex portion may be larger than a sum of a thickness of the second substrate and a thickness of the radiation curable resin.
Furthermore, a second method for producing an optical disk of the present invention includes the processes of: (A) bringing a first substrate having a signal area on a principal plane and a central hole A and a second substrate that is transparent and thinner than the first substrate into contact with each other with radiation curable resin interposed therebetween so that the principal plane faces inside; (B) irradiating the radiation curable resin with radiation to cure the radiation curable resin, thereby attaching the first substrate to the second substrate; and (C) removing a part of the second substrate to form a central hole B whose diameter is larger than that of the central hole A in the second substrate, wherein, in the process (A), the radiation curable resin is disposed so as to extend at least from an outer periphery of a position where the central hole B is formed to an outer peripheral edge of the second substrate.
According to the second production method, an easy-to-handle optical disk that is recordable at high density can be produced.
In the second production method, a thickness of the second substrate may be in a range of 0.03 mm to 0.3 mm.
In the second production method, the process (A) may include interposing the radiation curable resin between the first and second substrates, and rotating the first and second substrates to draw the radiation curable resin.
In the second production method, the process (A) may include pouring the radiation curable resin onto the first substrate, rotating the first substrate to coat the first substrate with the radiation curable resin, and bringing the first substrate and the second substrate into contact with each other with the radiation curable resin interposed therebetween.
In the second production method, in the process (A), the first substrate and the second substrate are brought into contact with each other in a vacuum atmosphere.
Furthermore, a third method for producing an optical disk of the present invention includes the processes of: (i) opposing a first substrate in which a central hole A with a diameter dA is formed to a second substrate in which a central hole B with a diameter dB is formed with radiation curable resin interposed therebetween so that a center of the first substrate is aligned with a center of the second substrate; and (ii) irradiating the radiation curable resin with radiation to cure the radiation curable resin, wherein dA less than dB, and a thickness of the second substrate is in a range of 0.03 mm to 0.3 mm.
According to the above-mentioned configuration, an optical disk that is recordable at high density can be produced with good precision.
In the third production method, in the process (i), the center of the first substrate is aligned with the center of the second substrate by using a pin that fits in the first and second central holes A and B. According to this configuration, it is easy to align the center of the first substrate with the center of the second substrate. As a result, an optical disk can be obtained in which deflections are unlikely to occur even when the optical disk is rotated at a high speed during recording/reproduction.
In the third production method, the process (i) may include the processes of: (i-1) fixing the second substrate on a table in which the pin is disposed so that the pin is inserted into the central hole B; (i-2) pouring the radiation curable resin onto the second substrate; (i-3) moving the first substrate so that the pin is inserted into the central hole A, thereby opposing the first substrate to the second substrate with the radiation curable resin interposed therebetween; and (i-4) rotating the first and second substrates to draw the radiation curable resin. According to this configuration, the thickness of the radiation curable resin can be rendered uniform. Therefore, an optical disk with good productivity and reliability can be produced.
In the third production method, the pin may include a first pin that fits in the central hole A and a second pin that fits in the central hole B, in the process (i-1), the second substrate may be fixed with the second pin, and in the process (i-3), the first substrate may be fixed with the first pin.
The third production method may include, after the process (i-1) and before the process (i-2), lowering an upper surface of the second pin below an upper surface of the second substrate.
In the third production method, the second pin may have a cylindrical shape, and the first pin may be inserted into the second pin.
Furthermore, a fourth method for producing an optical disk of the present invention is a method for producing an optical disk including a first substrate in which a central hole A with a diameter dA is formed and a second substrate in which a central hole B with a diameter dB is formed, including the processes of: (I) coating at least one substrate selected from the group consisting of the first substrate and the second substrate with radiation curable resin; (II) opposing the first substrate to the second substrate with the radiation curable resin interposed therebetween in a vacuum atmosphere so that a center of the first substrate is aligned with a center of the second substrate; and (III) irradiating the radiation curable resin with radiation to cure the radiation curable resin, wherein dA less than dB, and a thickness of the second substrate is in a range of 0.03 mm to 0.3 mm.
According to the fourth production method, an optical disk that is recordable at high density can be produced. Furthermore, the first substrate and the second substrate are opposed to each other in vacuum, so that air bubbles can be prevented from entering therebetween.
In the fourth production method, in the process (II), the center of the first substrate is aligned with the center of the second substrate by using a pin that fits in the first and second central holes A and B. According to this configuration, it is easy to align the center of the first substrate with the center of the second substrate.
In the fourth production method, the process (II) may include the processes of: (II-1) fixing the second substrate on a table in which the pin is disposed so that the pin is inserted into the central hole B; and (II-2) in a vacuum atmosphere, moving the first substrate so that the pin is inserted into the central hole A, thereby opposing the first substrate to the second substrate with the radiation curable resin interposed therebetween. According to this configuration, by fixing a second thin substrate on a table, the surface of the second substrate can be rendered flat; as a result, the thickness of the radiation curable resin can be rendered uniform. Furthermore, according to this configuration, air bubbles can be prevented from entering between the first substrate and the second substrate.
In the fourth production method, the pin may include a first pin that fits in the central hole A and a second pin that fits in the central hole B, in the process (II-1), the second substrate may be fixed with the second pin, and in the process (II-2), the first substrate may be fixed with the first pin.
The fourth production method further may include, after the process (II-1) and before the process (II-2), lowering an upper surface of the second pin below an upper surface of the second substrate.
In the fourth production method, the second pin may have a cylindrical shape, and the first pin may be inserted into the second pin.
Furthermore, a production apparatus of the present invention is an apparatus for producing an optical disk including a first substrate in which a central hole A is formed and a second substrate in which a central hole B is formed, including: a coating member for coating at least one substrate selected from the group consisting of the first substrate and the second substrate with radiation curable resin; a disposing member for disposing the first substrate and the second substrate so that a center of the first substrate is aligned with a center of the second substrate; and an irradiating member for irradiating the radiation curable resin with radiation.
According to the above-mentioned apparatus for producing an optical disk, the third and fourth production methods of the present invention can be conducted easily.
In the above-mentioned production apparatus, the disposing member may include a pin that fits in the first and second central holes A and B.
In the above-mentioned production apparatus, the pin may include a first pin that fits in the central hole A and a second pin that fits in the central hole B.
In the above-mentioned production apparatus, the second pin may have a cylindrical shape, and the first pin may be inserted into the second pin.
In the above-mentioned production apparatus, the disposing member may include a table for fixing the at least one substrate.
In the above-mentioned production apparatus, the disposing member further may include a container surrounding the table and an exhaust member for exhausting the container.
These and other advantages of the present invention will become apparent to those skilled in the art upon reading and understanding the following detailed description with reference to the accompanying figures.


The redox balance of cells is key to normal cell physiology. It is maintained by 3 systems: GSH/GSSG, NADPH/NADP; Thioredoxin (red)/Thioredoxin (oxd). Of these 3 systems, GSH/GSSG is the most widely studied for its implication in diseased states and for the development of rational therapeutic approaches (Townsend, A. J., Leone-Kabler, S., Haynes, R. L., Wu, Y., Szweda, L., and Bunting, K. D. (2001). Selective protection by stably transfected human ALDH3A1 (but not human ALDH1A1) against toxicity of aliphatic aldehydes in V79 cells. 130-132, 261-273). The diseased states associated with an imbalance in GSH/GSSG include major pathologies like cancers (Estrela, J. M., Ortega, A., and Obrador, E. (2006). Glutathione in cancer biology and therapy. Crit. Rev. Clin. Lab. Sci. 43, 143-181; O'Brien, M. L., and Tew, K. D. (1996). Glutathione and related enzymes in multidrug resistance. Eur. J. Cancer Oxf. Engl. 1990 32A, 967-978). Their one common aetiology is oxidative stress brought about by ROS and/or Reactive Nitrogen Species (RNS) that first cause a decrease in GSH due to the direct detoxification of ROS and RNS. This initial decrease in GSH is followed subsequently by a compensatory increase in GSH synthesis that cells bring into play in order to continue the detoxification of ROS/RNS and of newly formed electrophilic products such as 4-hydroxynonenal (HNE) and malondialdehyde (MDA)) produced by ROS attack on cellular lipids (Esterbauer, H., Schaur, R. J., and Zollner, H. (1991). Chemistry and biochemistry of 4-hydroxynonenal, malonaldehyde and related aldehydes. 11, 81-128).
The GSH paradox in cancer cells is that instead of the deficit in intracellular GSH that would have been expected, it is precisely the opposite that was found experimentally in many different cancer cells (Estrela, J. M., Ortega, A., and Obrador, E. (2006). Glutathione in cancer biology and therapy. Crit. Rev. Clin. Lab. Sci. 43, 143-181). But this increase in GSH has negative therapeutic repercussions as it protects cancer cells from chemo and radio therapies (Carretero, J., Obrador, E., Esteve, J. M., Ortega, A., Pellicer, J. A., Sempere, F. V., and Estrela, J. M. (2001). Tumoricidal activity of endothelial cells. Inhibition of endothelial nitric oxide production abrogates tumor cytotoxicity induced by hepatic sinusoidal endothelium in response to B16 melanoma adhesion in vitro. J. Biol. Chem. 276, 25775-25782).
In addition, if low levels of GSH must be obtained in cancer cells for chemotherapy to be effective, this is not the case for normal cells for not inducing collateral damage thereto.
The therapeutic approaches that are presently being used to lower cellular GSH in order to combat the chemoresistance of cancer cells, target GSH itself or the enzymes involved in GSH synthesis, GSH degradation and GSH efflux. There are already 10 GSH-lowering compounds that are in phases I, II and III of clinical trials as anticancer agents (Tew, K. and Townsend D (2011) Redox platforms in cancer drug discovery and development. Curr. Opin. Chem. Biol. 15, 156-161). They all have to be administered in combination with standard anti-cancer drugs, e.g. cyclophosphamide, taxol, vincristine, melphalan, etc.
Furthermore, the enzymes targeted by these GSH-lowering drugs are those involved in GSH synthesis (gamma glutamyl cysteine ligase), GSH degradation (gamma-glutamyl transpeptidase) and GSH efflux (GSH-S-transferase). These same enzymes are however essential for protecting normal cells from ROS attack. Hence, there is a strong possibility of collateral damage to normal cells as the drugs cannot be delivered selectively to cancer cells and to cancer cells only.
In view of this, there is a need to find other therapeutic solutions which specifically and selectively target GSH in cancer cells.
The inventors of the present invention have unexpectedly found that a combination comprising an aminothiolester compound or a pharmaceutically acceptable salt thereof, in particular the S-methyl 4-(dimethylamino)-4-methylpent-2-ynethioate or a pharmaceutically acceptable salt thereof, and more particularly the 4-(Dimethylamino)-4-methyl-2-pentynethioic acid S-methyl ester fumarate, and a compound able to increase the H2O2 level in cancer cells of a subject, is useful as a medicament and able to treat cancer in a subject, wherein cancer cells of said subject do not overproduce H2O2. In particular, they found that a combination comprising an aminothiolester compound or a pharmaceutically acceptable salt thereof, in particular the S-methyl 4-(dimethylamino)-4-methylpent-2-ynethioate or a pharmaceutically acceptable salt thereof, and more particularly the 4-(Dimethylamino)-4-methyl-2-pentynethioic acid S-methyl ester fumarate, and a compound able to increase the H2O2 level in cancer cells of a subject, is useful as a medicament and able to treat cancer in a subject, wherein cancer cells of said subject do not overproduce H2O2 and have a level of GSH below 0.5 nmol for 25 000 cells.
Without being bound by any theory, when the compound able to increase the H2O2 level in cancer cells of a subject would have induced an increase in H2O2 level in the cancer cells, then the aminothiolester compound or a pharmaceutically acceptable salt thereof, would increase the levels of intra cellular metabolites that are produced by H2O2 attack, and, at the same time, GSH would thus be consumed in the detoxification of these electrophilic metabolites. As a result, insufficient GSH would be available in cancer cells to act as a scavenger of H2O2. Hence, levels of H2O2 should increase and should trigger-off the H2O2-dependent mechanisms in the mitochondrial (intrinsic) pathway of apoptosis.
In normal cells that have not undergone initially an attack by H2O2, intracellular GSH levels are already high (due to the absence of H2O2) so that the levels of any H2O2-induced electrophiles are below those in their cancer counterparts. However, H2O2 levels in normal cells can concomitantly rise when a compound able to increase the H2O2 level in cancer cells of a subject is used, if this compound is able to increase the level of H2O2 in both normal and cancer cells. In this latter case, H2O2 levels in normal cells will however still be lower than those in cancer cells and will thus remain below their apoptotic threshold upon treatment with the aminothiolester compound according to the invention or a pharmaceutically acceptable salt thereof.


This invention relates in general to actuating switches and in particular to a new and useful switch particularly for compressed gases in which during contact breaking the two switch parts are maintained in contact for a period of time and then the separation is effected with a driving separation which forces one of the parts to an end position.
The invention relates to an autopneumatic compressed gas switch having a piston-cylinder unit as a compression system for the quenching gas, a first contact piece and an insulating bushing surrounding the latter, which are firmly connected with the movable part of the piston-cylinder unit, and a second (counter-) contact piece which upon breaking contact is at first held in engagement with the first contact piece and follows it and then runs back under spring force.
A similar compressed gas switch is known from German OS No. 29 18 145. In this compressed gas switch the second (counter-) contact piece is connected or latched directly with the first contact piece. A disadvantage in this solution is that the latch connection is arranged in a region in which the switching arc burns. It is therefore almost inevitable that the arc will impair the locking mechanism.


The present invention relates to a method for the closing, by laser, of packages of electronic circuits, notably hybrid circuit packages, said method minimizing mechanical stresses. It can be applied, more particularly, to the closing, by laser, of large-sized hybrid circuit packages, called macro-hybrid packages, where a metal lid is closed on a frame which is itself soldered to a ceramic substrate bearing screen-printed tracks and electronic components.
More generally, the invention can be applied to any hybrid circuit packages for which it is necessary to minimize the mechanical stresses related to closing by laser. These would be, for example, large-sized, all-metal solid packages.
The method of closing a metal package by laser is known to those skilled in the art. This method provides for tightly sealed soldering through the melting of the metal constituting the lid of the package. The parameters of the laser are determined as a function of the nature of the metals and the thickness of the lid. In the case of macro-hybrid packages for example, the substrate of which is constituted by a ceramic wafer supporting the hybrid electronic circuits, the frame is soldered to this ceramic substrate and not to a metal substrate. Experience has shown that any stress contributed by a solder made by means of a laser may prompt a fault at the solder joint between the frame and the ceramic. These stresses are actually related to the heating of the metals that get soldered to each other. The deformation thus created in the unit makes it impossible to obtain tight sealing in accordance with prevailing standards. Known methods consist, for example, in the soldering, transparently, of a lid made of an iron-nickel alloy to a frame made of an iron-nickel alloy or an iron cobalt-nickel alloy for example so that the laser beam, starting from a point of the perimeter of the macro-hybrid, travels along this perimeter and returns to the starting point. However, methods of this type lead to the above-mentioned deformations, prompted by the mechanical stresses exerted by the laser soldering. Indeed, before closing, the ceramic substrate of a macro-hybrid supporting the soldered frame generally displays a convexity of the order of 100 to 200 .mu.m due to the soldering with the frame whereas the macro-hybrid package, which has a surface area of the order of one dm.sup.2 once it is closed, displays a concavity of the order of 100 to 200 .mu.m corresponding to the stresses applied to the frame by the laser soldering. This results in defects of impervious sealing between the frame and the ceramic substrate, preventing any encapsulation in accordance with certain standards as laid down. Furthermore, when the laser soldering is done in the form of a continuous soldering, as described here above, the imperviousness between the lid and the frame is not acquired in a single pass: it is then necessary to double and even triple the seam of solder in the unsealed zones. This contributes greatly to increasing the stresses exerted by the soldering and increases manufacturing costs.


1. Field of the Invention
The present invention relates to photoelectric conversion apparatus and information processing apparatus, and more particularly to photoelectric conversion apparatus suitably applicable to input portions in facsimile devices, image readers, scanners, copiers, electronic blackboards, etc., which are information processing apparatus for reading image information while relatively moving the original or the like subjected to image reading in close contact on a primary line sensor, and the information processing apparatus therewith.
2. Related Background Art
Recently, in order to further decrease the size or further enhance the performance as to information processing apparatuses such as facsimile devices, image readers, etc., elongate line sensors that can be used in a 1:1 optical system have been developed as photoelectric conversion apparatuses for information processing apparatuses. In order to further decrease the size and the cost, photoelectric conversion apparatus and information processing apparatus have been developed for directly detecting reflected light from the original by a sensor without using a 1:1 fiber lens array but through a transparent spacer of glass or the like.
FIG. 1 is a diagrammatic, perspective view of a conventional photoelectric conversion apparatus, and FIG. 2 is a diagrammatic cross section thereof when the photoelectric conversion apparatus is cut along 2--2 in FIG. 1. In FIG. 1 and FIG. 2, reference numeral 1 designates a photosensor, 101 a sensor substrate, 102 photoelectric conversion elements, 103 a wiring part, 104 a mount plate, and 105 a transparent protection layer.
As shown in FIG. 1 and FIG. 2, a plurality of photoelectric conversion elements 102 are arranged in line on the sensor substrate 101, and the transparent protection layer 105 comprised of a thin glass plate or the like is provided on the photoelectric conversion elements 102 in order to protect the photoelectric conversion elements 102 and to act as a spacer between the photoelectric conversion elements 102 and the original Output signals from the photoelectric conversion elements 102 are arranged as capable of being output to the outside through the wiring part 103. These sensor substrate 101, photoelectric conversion elements 102, wiring part 103, and transparent protection layer 105 are incorporated with the mount plate 104, thus composing the photoelectric conversion apparatus 1. The mount plate 104 is made of an easily-moldable material such as a resin, and is molded except for an optically transparent portion of the member.
The structure of a photoelectric conversion element used in such a photoelectric conversion apparatus is next explained briefly referring to FIG. 3.
FIG. 3 is a diagrammatic cross section for illustrating an example of the photoelectric conversion element. In FIG. 3, reference numeral 170 is a substrate, 171 a light-shielding layer, for example, of aluminum or chromium, 172 an insulator layer, for example, of silicon nitride, 173 a semiconductor layer, for example, of i-type amorphous silicon, 174 an ohmic contact layer, for example, of n.sup.+ -type non-single-crystal silicon, 175 an electrode layer, for example, of aluminum, 176 a passivation layer, for example, of silicon nitride or polyimide, and 177 an adhesive layer, for example, of an epoxy resin.
As shown in FIG. 3, the sensor substrate 101 has a photoelectric conversion element having the light-shielding layer 171 provided on the substrate 170 in correspondence to a photoelectric conversion portion so as to prevent illumination light from the substrate side from entering the photoelectric conversion portion, the insulator layer 172 provided on the light-shielding layer 171, the semiconductor layer 173 provided on the insulator layer, and the electrode layer 175 provided through the ohmic contact layer 174 above the semiconductor layer with a space for an incident area of light, and the passivation layer 176 provided on the photoelectric conversion element; and the transparent protection layer 105 is provided through the adhesive layer 177 above the sensor substrate 101.
Light L emitted from a light source (not shown) passes through the sensor substrate 101, adhesive layer 177, and transparent protection layer 105 to reach the original P, and reflected light from the original P is incident to the space formed in the electrode layer 175 to be photoelectrically converted according to the incidence of light.
FIG. 4 is a diagrammatic, sectional, structural drawing for illustrating an example of a facsimile device with a communication function as an example of the information processing apparatus having the above photoelectric conversion apparatus.
In FIG. 4, reference numeral 180 denotes the facsimile device, 181 a feed roller, 182 a separator pawl, 183 a conveying roller, 184 a system control substrate, 185 a platen roller, 186 a recording head, 187 a power supply section, 188 the photoelectric conversion apparatus, 189 an operation panel, P the original, and W a recording medium.
As shown in FIG. 4, the facsimile device 180 supplies the original P to an image reading section by the feed roller 181 when the original P is inserted thereinto. In the original reading section the photoelectric conversion apparatus 188 is disposed and the original P is conveyed as urged against the reading portion by the conveying roller 183 opposed to the photoelectric conversion apparatus 188. This urging is effected by an urging device such as a spring, not shown. As urging the conveying roller 183 and/or the photoelectric conversion apparatus 188 against each other, the original P conveyed to between the conveying roller 183 and the photoelectric conversion apparatus 188 is further conveyed in a discharge direction. The separator pawl 182 is used for separating and feeding the originals P set in a pile one by one.
Further, the facsimile device 180 has the recording head 186 for recording an image received or information read by the above photoelectric conversion apparatus 188 in a recording medium W, and the platen roller 185 for conveying the recording medium W for recording information by the recording head 186.
The power supply 187 is a power-supply portion for driving the facsimile device 180, the system controller 184 is provided for controlling an image reading means including the photoelectric conversion apparatus 188 and the recording means including the recording head 186, and the operation panel 189 is a so-called control portion of the facsimile device 180.
The photoelectric conversion apparatus 188 is mounted, as shown, to a frame 4 (a main body frame in the drawing) provided in the facsimile device 180. This frame is normally provided in order to attain mainly the strength of the apparatus main body.
FIG. 5 is a diagrammatic, structural drawing for illustrating a mounting portion of the photoelectric conversion apparatus 188 and surroundings thereof.
In FIG. 5, reference numeral 191 represents a light source such as light-emitting diodes, 192 a sensor frame, 193 a light-source substrate, and 194 a connector. For using the light-emitting diodes as a light source 191, a plurality of light-emitting diodes are arranged at intervals on the light-source substrate 193. The photosensor 1 and light-source substrate 193 are mounted to the sensor frame 192 so as to be incorporated therewith, thereby composing the photoelectric conversion apparatus 188. The connector 194 is provided for supplying the power for driving the photoelectric conversion elements or the light-emitting diodes and/or for outputting electric signals carrying information output from the photoelectric conversion elements.
The photoelectric conversion apparatus 188 is mounted by unrepresented means in a recess formed in the frame 4.
FIG. 6 is a diagrammatic, perspective assembly drawing for illustrating the mounting portion of the photoelectric conversion apparatus 188 and surroundings thereof
In FIG. 6, reference numeral 195 stands for a flexible board for outputting signals from the photosensor 1, 196 a flexible board for outputting the signals from the photoelectric conversion apparatus 188 to the outside, and 197 an electric connection portion in FIG. 7 to be connected with the flexible board.
As shown in FIG. 6, the photoelectric conversion apparatus 188 is arranged so as to be dropped into the recess formed in the frame 4, and the flexible board 196 is connected to the electric connection portion on the apparatus body side, thereby electrically being connected with the apparatus body. The conveying roller 183 is disposed above the reading portion of the photoelectric conversion apparatus 188, as described above. The signal line from the photosensor 1 is first electrically connected through the flexible board 195 to the light-source substrate 193 and then electrically connected through a signal processing circuit provided in the light-source substrate 193 and through the flexible board 196 to a processing circuit on the apparatus body side.
FIG. 7 is a diagrammatic, structural drawing for illustrating an example of the connection relation between the photoelectric conversion apparatus 188 and the system control substrate 184 in the facsimile device 180.
As shown in FIG. 7, the flexible board 196 from the photoelectric conversion apparatus 188 is electrically connected with the connector 197 formed in the system control substrate 184.
However, with attempt to achieve further reductions of cost, size, and weight for the information processing apparatus constructed in the above structure, there was virtually no room for further reductions of cost, size, and weight, because the photoelectric conversion apparatus is constructed in a unit structure using the sensor frame. Another problem was that the limits of further reductions of size and weight would impose restrictions on freedom of engineering design of the apparatus main body or freedom of design thereof.


1. Field of the Invention
The present invention generally relates to a method for directly writing data into an optic disk without a computer system; and in particular to a method for directly writing data retrieved from an electronic data storage into an optic disk without a computer system interfacing therebetween.
2. The Related Art
With the rapid development and prevalence of electronic storages, such as compact flash memory, more and more data are stored in the electronic storage for portability and fast access. To more space-efficiently store the data, some people prefer to transfer the data from the electronic storage to optic disks for data backup purposes. Heretofore, the optic disk drive must be connected to a computer system for data writing operation. Thus, the data have to be read into the computer system and then written by the computer system into the optic disk accessed by means of the optic disk drive. This causes problems. For example, a computer system is a must in transferring data from a portable compact flash memory device to an optic disk. Thus, such a data transfer operation cannot be carried out without a computer system having proper data ports.
Thus, the present invention is aimed to solve the above problem by providing a method for directly transferring data from a compact flash memory device to an optic disk without a computer system interfacing therebetween.
Accordingly, an object of the present invention is to provide a method for writing data retrieved from an electronic storage to an optic disk without a computer system interfacing therebetween.
Another object of the present invention is to provide an optic disk drive capable to perform a direct writing operation to an optic disk without being controlled by a computer system.
To achieve the above objects, in accordance with the present invention, there is provided a method for directly writing data into an optic disk that is performed by an optic disk drive incorporating a control unit to which an external data storage device, such as compact flash memory device, is connected. The method comprises steps of (1) initiating a writing operation, (2) setting the optic disk drive to busy condition, (3) checking if an optic disk is properly loaded and if the external memory device is correctly connected, (4) checking if the optic disk is a UDF disk; (5) issuing a warning, if it is not, (6) creating a folder in the optic disk, (7) retrieving data from the external data storage device and writing the data into the folder of the optic disk, and (8) ending the writing operation. No computer-based interface is required between the optic disk drive and the external data storage device in performing the data writing operation.


1. Field of Use
The present invention relates to cache systems and, in particular, to cache systems includable within minicomputer and microprocessing systems.
2. Prior Art
It is well known in the art to provide cache systems within computer systems to improve overall system performance and provide for reliable operation. Examples of such systems are disclosed in U.S. Pat. No. 3,820,078 to John L. Curley, et al. and in IBM Technical Disclosure Bulletin titled "Removal of Failing Buffer Sections in a Buffer Backing Store" by M. W. Bee, et al., Vol. 13, No. 2, dated July 1970. In those systems, reliable operation is achieved by invalidating cache memory locations detected as having bad parity. This requires additional bits to be associated with the cache locations and can add considerably to the cost and complexity of the cache system. More importantly, it requires processing time for carrying out such invalidating operations.
Other prior art cache systems permit the cache to be bypassed upon the detection of fault conditions by the central processing unit (CPU) associated therewith. An example of this type of system is disclosed in U.S. Pat. No. 4,195,343 to Thomas F. Joyce which is assigned to the same assignee as named herein. In general, this type of cache system is designed to report two types of errors to the CPU, a memory "red" error condition indicative of an uncorrectable error and a memory "yellow" condition indicative of a correctable error. Upon the receipt of a "red" error signal or the detection of a byte data parity error in received memory data, the CPU switches the entire cache off-line, reports the error to the operating system and continues processing.
While the above systems allow disconnection of a cache unit as a consequence of a fault condition, it requires the CPU to process such fault conditions. This can prove time consuming and could also result in loss of valuable information since such diagnosis relies in part upon the types of error conditions reported by the cache system itself.
Accordingly, it is a primary object of the present invention to provide a reliable cache system which is low in cost and has minimal complexity.
It is still a further object of the present invention to provide a cache system which has improved maintainability thereby increasing system reliability.


The present invention relates to surgical systems and, in various arrangements, to grasping instruments that are designed to grasp the tissue of a patient, dissecting instruments configured to manipulate the tissue of a patient, clip appliers configured to clip the tissue of a patient, and suturing instruments configured to suture the tissue of a patient, among others.
Corresponding reference characters indicate corresponding parts throughout the several views. The exemplifications set out herein illustrate various embodiments of the invention, in one form, and such exemplifications are not to be construed as limiting the scope of the invention in any manner.


Solar energy generation is a rapidly growing technology worldwide and offers the potential of almost unlimited clean and sustainable energy. However, the use of solar electric technology has been limited by the costs associated with installing solar panels to existing and new structures and facilities.
When installing a solar module on a rail, various clamps must be utilized due to the varying sizes of the modules and various rail configurations. As a result, it is desirable to have a clamp that can be used to secure different types of modules to different types of rails.
The solar module is often installed on a roof or other surface for exposure to sunlight. As a result, the installed solar module can be viewed. Accordingly, it is desirable to have a clamp that is aesthetically pleasing and is preferably hidden under the module frames.
Because maintenance may be required for the solar modules and because the solar modules may be installed on a roof or other surface where access is often needed, safety is also an important consideration. Modules can be installed at a variety of heights, commonly about three to eight feet off the ground, and on a variety of surfaces, such as a roof of a building. When someone is walking next to a solar module, it is desirable that the rail does not extend past the edge of the module.


1) Field of the Invention
The present invention relates to an improved microwave-interactive cooking package. In particular, the present invention relates to high efficiency, safe and abuse-tolerant susceptor and foil materials for packaging and cooking microwavable food.
2) Description of the Related Art
Although microwave ovens have become extremely popular, they are still seen as having less than ideal cooking characteristics. For example, food cooked in a microwave oven generally does not exhibit the texture, browning, or crispness that are acquired when food is cooked in a conventional oven.
A good deal of work has been done in creating materials or utensils that permit food to be cooked in a microwave oven to obtain cooking results similar to that of conventional ovens. The most popular device being used at present is a plain, susceptor material, which is an extremely thin (generally 60 to 100 xc3x85) metallized film that heats under the influence of a microwave field. Various plain susceptors (typically aluminum, but many variants exist) and various patterned susceptors (including square matrix, xe2x80x9cshower flower,xe2x80x9d hexagonal, slot matrix and xe2x80x9cfusexe2x80x9d structures) are generally safe for microwave cooking. However, susceptors do not have a strong ability to modify a non-uniform microwave heating pattern in food through shielding and redistributing microwave power. The quasi-continuous electrical nature of these materials prevents large induced currents (so limiting their power reflection capabilities) or high electromagnetic (E-field) strengths along their boundaries or edges. Therefore their ability to obtain uniform cooking results in a microwave oven is quite limited.
Electrically xe2x80x9cthickxe2x80x9d metallic materials (e.g., foil materials) have also been used for enhancing the shielding and heating of food cooked in a microwave oven. Foil materials are much thicker layers of metal than the thin, metallized films of susceptors. Foil materials, also often aluminum, are quite effective in the prevention of local overheating or hot spots in food cooked in a microwave by redistributing the heating effect and creating surface browning and crisping in the food cooked with microwave energy. However, many designs fail to meet the normal consumer safety requirements by either causing fires, or creating arcing as a result of improper design or misuse of the material.
The reason for such safety problems is that any bulk metallic substance can carry very high induced electric currents in opposition to an applied high electromagnetic field under microwave oven cooking. This results in the potential for very high induced electromagnetic field strengths across any current discontinuity (e.g., across open circuit joints or between the package and the wall of the oven). The larger the size of the bulk metallic materials used in the package, the higher the potential induced current and induced voltage generated along the periphery of the metallic substance metal. The applied E-field strength in a domestic microwave oven might be as high as 15 kV/m under no load or light load operation. The threat of voltage breakdown in the substrates of food packages as well as the threat of overheating due to localized high current density may cause various safety failures. These concerns limit the commercialization of bulk foil materials in food packaging.
Commonly owned Canadian Patent No. 2196154 offers a means of avoiding abuse risks with aluminum foil patterns. The structure disclosed addresses the problems associated with bulk foil materials by reducing the physical size of each metallic element in the material. Neither voltage breakdown, nor current overheat will occur with this structure in most microwave ovens, even under abuse cooking conditions. Abuse cooking conditions can include any use of a material contrary to its intended purpose including cooking with cut or folded material, or cooking without the intended food load on the material. In addition, the heating effectiveness of these metallic materials is maximized through dielectric loading of the gaps between each small element that causes the foil pattern to act as a resonant loop (albeit at a much lower Q-factor (quality factor) than the solid loop). These foil patterns were effective for surface heating. However, it was not recognized that a properly designed metallic strip pattern could also act to effectively shield microwave energy to further promote uniform cooking.
Commonly owned U.S. Pat. No. 6,133,560 approaches the problem differently by creating low Q-factor resonant circuits by patterning a susceptor substrate. The low Q-factor operation described in U.S. Pat. No. 6,133,560 provides only a limited degree of power balancing.
The present invention relates to an abuse-tolerant microwave packaging material which both shields food from microwave energy to control the occurrence of localized overheating in food cooked in a microwave, and focuses microwave energy to an adjacent food surface.
Abuse-tolerant packaging according to the present invention includes one or more sets of continuously repeated microwave energy interactive/reflective segments disposed on a microwave-safe substrate. Each set of reflective segments defines a perimeter equal to a predetermined fraction of the effective wavelength in an operating microwave oven. Methodologies for choosing such predetermined fractional wavelengths are discussed in U.S. Pat. No. 5,910,268, which is incorporated herein by reference. The reflective segments can be metallic foil segments, or may be segments of a high optical density evaporated material deposited on the substrate. The terms xe2x80x9cfractionxe2x80x9d or xe2x80x9cfractionalxe2x80x9d as used herein are meant in their broadest sense as the numerical representation of the quotient of two numbers, i.e., the terms include values of greater than, equal to, and less than one (1).
In a first embodiment, the length of the perimeter defined by a first set of microwave energy interactive/reflective segments is preferably approximately equal to an integer multiple of the effective wavelength of microwaves in an operating microwave oven, such that the length of the perimeter is resonant with the effective wavelength. In a second embodiment, the length of the perimeter defined by the reflective segments is approximately equal to an integer multiple of one-half the effective wavelength of microwaves in an operating microwave oven, such that the length of the second perimeter is quasi-resonant with the effective wavelength.
Each segment in the first set is spaced from adjacent segments so as to create a (DC) electrical discontinuity between the segments. Preferably, each first set of reflective segments defines a five-lobed flower shape. The five-lobed flower shape promotes uniform distribution of microwave energy to adjacent food by distributing energy from its perimeter to its center.
Preferably, abuse-tolerant packaging according to the present invention includes a repeated second set of spaced microwave energy interactive/reflective segments that enclose each first set of reflective segments and define a second perimeter. In the first embodiment, this second perimeter preferably has a length approximately equal to an integer multiple of the effective wavelength of microwaves in an operating microwave oven, such that the length of the second perimeter is resonant with the effective wavelength. In the second embodiment, this second perimeter preferably has a length approximately equal to an integer multiple of one-half the effective wavelength of microwaves in an operating microwave oven, such that the length of the second perimeter is quasi-resonant with the effective wavelength.
A third embodiment of abuse-tolerant packaging according to the present invention includes, in addition to the second set of reflective segments, a repeated third set of spaced microwave energy interactive/reflective segments that enclose each second set of reflective segments and define a perimeter approximately equal to another predetermined fraction of the effective wavelength of microwaves in an operating microwave oven.
Further embodiments of the invention may be created by varying the shapes of the perimeters formed by the reflective segments, while maintaining the desired predetermined fraction of the effective wavelength for the length of the perimeters. Appropriate shapes within the scope of the present invention may be, for example, circles, ovals, and other curvilinear shapes, triangles, squares, rectangles, and other polygonal shapes. Curvilinear shapes are preferably symmetrical to aid in the assembly of shapes in an array. Similarly, polygonal shapes are preferably right and equilateral polygons to help in the formation of nested arrays of the shapes.


Field
Embodiments described herein relate to an electrically-rewritable nonvolatile semiconductor memory device.
Description of the Related Art
A NAND type flash memory has a memory cell array which is configured by arranging memory strings each including a plurality of memory cells connected in series. Both ends of each memory string are connected to a bit line and a source line through select transistors respectively. The control gate electrodes of the memory cells of each memory string are connected to different word lines respectively. In each memory string, the plurality of memory cells are connected in series with sources and drains shared between them. The NAND type flash memory can have a small unit memory cell size, because select transistors and their bit line contacts and source line contacts are shared among a plurality of memory cells. Further, the NAND type flash memory is suitable for miniaturization, because the word lines and the device regions of the memory cells have a shape that resembles a simple stripe shape, and hence a flash memory having a large capacity is realized.
As the miniaturization of NAND type flash memories progresses, interference between adjoining cells and influence due to elapse of time after data writing increase, which might change the memory cell data. For example, when data written in a memory cell remains un-accessed for a long time, there occurs a phenomenon that electrons are discharged from the charge accumulation layer of the memory cell, changing the threshold voltage of the memory cell to a lower value. Hereinafter, this phenomenon will be referred to as deterioration of data retention. If deterioration of data retention occurs, a data reading operation may fail.


The statements in this section merely provide background information related to the present disclosure and may not constitute prior art.
Casting processes for forming articles using molds and cores employ casting chambers including outer molds and inner core elements each having features and reliefs that form details, recesses, and cavities in a casting when molten material such as liquid metal is poured into the mold. One casting formed by such a casting process is an engine block formed from molten cast iron or molten aluminum alloys. Inner core elements can be constructed from bonded sand. The inner core elements are extracted from the casting subsequent to the forming process. Portions of the casting may be subject to high-stress in-use, and it may be desirable to impart varying metallurgical properties to those portions. For example, a time-rate of removal of thermal energy from liquid metal during casting affects grain structure, with increased cooling and solidification of the poured liquid metal leading to an improvement, in general, of material properties such as tensile strength, fatigue strength, and in some cases machinability.
Known casting processes use thermal chill devices in proximity to specific portions of a casting in place of or in conjunction with features on the mold and core elements. This includes using chill devices at bulkheads and crankshaft bearing surfaces on engine blocks.
Known casting processes can include quiescently feeding molten metal upwards into a casting chamber in a counter-gravity fill process. The casting process can include subsequently inverting the casting chamber to allow molten metal to gravity-feed into the inverted casting chamber to fully form the casting.