1. Field of the Invention
The present invention relates to a xe2x80x9cchip-over-boardxe2x80x9d semiconductor assembly, a type of xe2x80x9cchip-on-boardxe2x80x9d (COB) semiconductor assembly. More specifically, the present invention relates to a method and apparatus for attaching a semiconductor device to a substrate for the subsequent wire bonding of the bond pads on the active surface of the semiconductor device to circuits of the substrate.
2. State of the Art
Definitions: The following terms and acronyms will be used throughout the application and are defined as follows:
BGAxe2x80x94Ball Grid Array: An array of minute solder balls disposed on an attachment surface of a semiconductor die wherein the solder balls are refluxed for simultaneous attachment and electrical communication of the semiconductor die to a printed circuit board. A BGA may also be disposed on the printed circuit board. Conductive polymer balls or bumps may also be employed.
COBxe2x80x94Chip-On-Board: The techniques used to attach semiconductor die to a printed circuit board or other suitable substrate. In this instance, COB also refers to a semiconductor die attached to a printed circuit board or substrate having an aperture therein for wire bonds to extend therethrough from the bond pads on the semiconductor die to circuits of the printed circuit board or substrate.
Flip-Chip: A semiconductor chip or semiconductor die having a pattern or array of terminations spaced around the active surface of the chip or die for face-down mounting of the chip or die to a substrate.
Flip-Chip Attachment: A method of attaching a semiconductor die to a substrate in which the die is inverted so that the connecting conductor pads on the face of the device are set on mirror-image pads on the substrate and bonded by solder reflux or a conductive polymer curing.
Wire Bonding: Conductive wires attached between the bond pads on the active surface of a semiconductor die and the circuits of a circuit board or lead frame to form an electrical connection therebetween.
TABxe2x80x94Tape-Automated-Bonding. Conductive traces are formed on a dielectric film such as a polyimide (the structure also being termed a xe2x80x9cflex circuitxe2x80x9d). The film is precisely placed to electrically connect a die and a circuit board or lead frame through the traces. Multiple connections are simultaneously effected.
Glob Top: A glob of encapsulant material (usually epoxy or silicone or a combination thereof) surrounding a semiconductor die in a COB assembly.
PGAxe2x80x94Pin Grid Array: An array of small pins extending substantially perpendicular from the major plane of a semiconductor die, wherein the pins conform to a specific arrangement on a printed circuit board or other substrate for attachment thereto.
SLICCxe2x80x94Slightly Larger than Integrated Circuit Carrier: An array of minute solder balls disposed on an attachment surface of a semiconductor die similar to a BGA, but having a smaller solder ball pitch and diameter than a BGA.
State-of-the-art COB technology generally consists of three techniques for attaching semiconductor die to a substrate: flip-chip attachment, wire bonding, and TAB.
Flip-chip attachment consists of attaching a semiconductor die, generally having a BGA, a SLICC or a PGA, to a printed circuit board. With the BGA or the SLICC, the solder ball arrangement on the semiconductor die must be aligned with the connecting bond pads on the printed circuit board such that precise connection is made. After proper alignment, the semiconductor die is bonded to the printed circuit board by reflowing the solder balls. With the PGA, the pin arrangement of the semiconductor die must be a mirror-image of the pin recesses on the printed circuit board. After insertion, the semiconductor die is generally bonded by soldering the pins into place. An underfill encapsulant is then generally disposed between the semiconductor die and the printed circuit board for environmental protection and to enhance the attachment of the die to the board.
Wire bonding, unlike flip-chip attachment, generally begins with attaching either the active surface or the back side of a semiconductor die to the surface of a printed circuit board with an appropriate adhesive, such as an epoxy. In wire bonding, a plurality of bond wires are attached, one at a time, to each bond pad on the semiconductor die and extend to a corresponding lead or trace end of a circuit on the printed circuit board. The bond wires are generally attached through one of three industry-standard wire bonding techniques: ultrasonic bondingxe2x80x94using a combination of pressure and ultrasonic vibration bursts to form a metallurgical cold weld; thermocompression bondingxe2x80x94using a combination of pressure and elevated temperature to form a weld; and thermosonic bondingxe2x80x94using a combination of pressure, elevated temperature, and ultrasonic vibration bursts. The semiconductor die may be oriented either face up or face down (with its active surface and bond pads either up or down with respect to the circuit board) for wire bonding, although face-up orientation has been more common.
In TAB semiconductor assemblies, ends of metal leads carried on an insulating tape, such as a polyimide, are attached to the bond pads on the semiconductor die and to corresponding lead or trace ends on the printed circuit board. An encapsulant, or plastic resin, is generally used to cover the bond wires and metal tape leads to prevent contamination, aid mechanical attachment of the assembly components, and increase long-term reliability of the electronics with reasonably low-cost materials.
A common manner of forming the encapsulant or plastic package about a semiconductor die assembly is molding and, more specifically, transfer molding. In this process (and with specific reference to COB die assemblies), after the semiconductor die is attached to the substrate (i.e., FR-4 printed circuit board), the semiconductor die assembly is placed in a mold cavity in a transfer molding machine. The semiconductor die assembly is thereafter encapsulated in a thermosetting polymer which, when heated, reacts irreversibly to form a highly cross-linked matrix no longer capable of being re-melted. In addition, another common manner of forming encapsulants for COB assemblages is xe2x80x9cglob topxe2x80x9d polymeric encapsulation. Glob top encapsulation can be applied by dispensing suitably degassed material from a reservoir through a needle-like nozzle onto the semiconductor die assembly.
The thermosetting polymer of transfer molding generally is comprised of three major components: an epoxy resin, a hardener (including accelerators), and a filler material. Other additives such as flame retardants, mold release agents and colorants are also employed in relatively small amounts. Furthermore, glob top encapsulation can comprise a nonlinear thixotropic material that also includes fillers to achieve the desired degree of thixotropy.
As previously set forth, bonding a semiconductor die to the surface of a substrate for wire bonding chip-on-board and TAB chip-on-board semiconductor assemblies is well known in the art. However, there are problems in the bonding process thereof, and specifically, problems associated with heating the adhesive between the semiconductor die and the substrate. In particular, the substrate is heated to a temperature so that the adhesive flows and then cures to thereby bond the die to the substrate with the cured adhesive therebetween. Some of the problems associated with heating the substrate at the temperature required to flow the adhesive are generally as follows: first, thermal stress exists in the interface between the adhesive and the semiconductor die and the adhesive and the substrate; and second, undesirable outgassing of a solder mask material layering a BGA on the substrate. These problems may result in health and contamination issues, and more importantly, potential detachment of the semiconductor die.
In U.S. Pat. No. 5,972,739, there is illustrated a semiconductor chip attached to a printed circuit board using a sheet of B-stage thermosetting resin having a filler therein, such as particles, fibers, or nonwoven fabric, wherein the active surface, or other surfaces, of the semiconductor chip is treated with a solution of a silane-coupling agent. The bumps on the active surface of the semiconductor chip extend through holes in the B-stage thermosetting resin to contact circuits on the printed circuit board.
In U.S. Pat. No. 5,348,607, a mixture for affixing dice to a substrate is illustrated. The mixture includes a thermoplastic polyimide, a solvent for the polyimide, and a solvent which does not dissolve the polyimide but adds thixotropicity to the mixture. The mixture is applied to the substrate, the dice are placed thereon, and the solvents are evaporated to bond the dice to the substrate. A poor solvent for the polyimide, spread over the dice and exposed portions of die attach material, causes some polyimide to precipitate out of the solution in the exposed portions of the die attach material to form a grid that extends between the dice and prevents the dice from xe2x80x9cswimming togetherxe2x80x9d during the high temperature processing. In a solvent die attachment method, the substrate is first coated with a mixture of die attach material and then the mixture is dried. Spraying a solvent over the die attach material causes the material to soften so that the dice applied thereto may adhere. The die attach material is then dried to form the bond.
U.S. Pat. Nos. 5,990,545 and 5,866,949 illustrates a semiconductor die in a chip-scale ball grid array having a nonpolymer layer or support structure positioned between a semiconductor die and a substrate.
U.S. Pat. Nos. 5,977,226 and 5,914,186 illustrate a vacuum dispensable silicone composition having low outgassing properties suitable for use in chip-scale packages and a high temperature antistatic pressure-sensitive adhesive tape.
In U.S. Pat. Nos. 5,994,772, 5,977,632, 5,929,521, and 5,892,277, various types of semiconductor attachments for attaching and electrically connecting a semiconductor die to a substrate are illustrated.
Based on the foregoing, it would be advantageous to develop a method for attaching a semiconductor die to a substrate at lower temperatures than that done conventionally, and thus, prevent the problems as discussed previously.
The present invention relates to a method and apparatus for bonding an active surface of a semiconductor die to the back surface of a substrate, the substrate having an aperture therethrough for the wire bonds between the bond pads on the active surface of the semiconductor die and the circuits on the front surface to pass through the aperture. Subsequently, the aperture is filled with an encapsulant material, as well as the portions of the wires of the wire bonds being encapsulated. The present invention is directed to a method and apparatus for bonding the active surface of the semiconductor die to the substrate using an adhesive tape therebetween. The method and apparatus includes pretreating the back surface of the substrate and/or the active surface of the semiconductor die with a wetting/adhesion promotion agent layer. The wetting/adhesion promotion agent layer is applied to at least a portion of the back surface of the substrate and/or portions of the active surface of the semiconductor die.
In the present invention, the wetting/adhesion promotion agent layer is directed to increase the surface tension thereof to promote adhesion of the substrate and/or semiconductor die. In addition, by increasing the surface tension, the substrate may be heated at a lower temperature in order for an adhesive on the adhesive tape to flow. In this manner, the present invention provides a decrease in thermal stress in the interface between the semiconductor die and substrate. Further, the lower temperature provides a decrease in the potential for out-gassing from the adhesive used on the tape for attaching the semiconductor die to the substrate during BGA attachment of the substrate and semiconductor die to another substrate. Accordingly, the present invention provides enhanced adhesion between a semiconductor die and a substrate than that provided conventionally.
In addition, the wetting/adhesion promotion agent layer in the present invention may comprise a silane-coupling agent, titanate-coupling agent, and/or a solvent. The wetting/adhesion promotion agent layer may comprise one or more layers and may be applied using a dispensing method, a brushing method, a spraying method, and/or a screen printing method.
In a preferred embodiment, the present invention is directed to bonding a semiconductor die to a substrate for the use of wire bonding chip-on-board semiconductor assemblies.
Alternately, the method and apparatus of the present invention may be directed to pretreating any type of semiconductor device, bare or packaged, and any type of substrate with a wetting agent layer to enhance bonding between multiple substrates, semiconductor devices, and/or a semiconductor die to a substrate, particularly where adhesive tape is used to secure the semiconductor device to a substrate.


Integrated circuits are generally formed on a substrate of semiconductor material out of a variety of active and passive devices. Active devices may include such devices as complementary metal oxide semiconductor (CMOS) transistors (either NMOS transistors or PMOS transistors) and may be formed from part of the semiconductor material within the substrate along with additional structures formed in conjunction with the semiconductor material. These active devices may then be interconnected using a series of conductive and insulative layers that may be formed over the active devices.
Passive devices may include such devices as resistors. These resistors may be formed to have a desired resistance to help control the desired path and functioning of the integrated circuit. The desired resistances for the resistors may be obtained by providing a desired amount of conductivities within the material of the resistors. For example, a precise amount of dopants may be introduced into a resistor that is made from a material such as polysilicon.
However, as integrated circuits and their active and passive devices have been reduced in size over the years (and as they are continuing to be miniaturized even further in the years ahead), the precision required for the manufacturing and operation of the resistors has increased. Additionally, the materials and processes used to manufacture the resistors has not kept up with the demand for high precision resistors as desired for further miniaturization while also maintaining the ease of integration for the manufacturing process that is desired for the mass production of integrated circuits.
Corresponding numerals and symbols in the different figures generally refer to corresponding parts unless otherwise indicated. The figures are drawn to clearly illustrate the relevant aspects of the embodiments and are not necessarily drawn to scale.


The conventional milling operation calls for the use of an upright milling machine and a horizontal milling machine. The upright milling machine is provided with an upright milling cutter to facilitate the longitudinal cutting of a metal workpiece. Upon completion of the process of the longitudinal cutting of the workpiece, the workpiece is transferred to the horizontal milling machine on which the horizontal cutting of the workpiece is done by a horizontal milling cutter of the horizontal milling machine. It is therefore readily apparent that the conventional milling machines are inefficient and uneconomical.


Currently, front-facing cameras are configured on many terminal devices such as a mobile phone, a notebook computer, and a tablet computer, and are configured to shoot a photograph or a video of a target in front of the terminal devices.
For example, FIG. 1 shows a camera layout of an existing common terminal device such as a mobile phone. A rear-facing camera 101 is generally placed on the top or back of a screen 102 of the terminal device, and a front-facing camera 103 is generally placed on the top of the screen 102 of the mobile phone, so that the front-facing camera 103 can shoot a photograph or a video of a target in front of the terminal device.
However, in an existing camera layout, relatively large space needs to be reserved at the top of a terminal device to place a front-facing camera, which causes a limited ratio of a screen to the entire terminal device.


In Fiber-to-the-Premises broadband network applications optical splitters are used to split the optical signals at various points in the network. Recent network specifications call for optical splitters to be incorporated in fiber distribution hubs (FDHs) which are re-enterable outdoor enclosures. These enclosures allow easy re-entry for access to optical splitters allowing splitter ports to be utilized effectively and for additional splitter ports to be added on an incremental basis.
In typical applications to date, optical splitters are provided prepackaged in optical splitter module housings and provided with splitter outputs in pigtails that extend from the module. The splitter output pigtails are typically connectorized with high performance low loss simple connector (SC) and/or LC connectors. This optical splitter module, or cassette, provides protective packaging for the optical splitter components in the housing and thus provides for easy handling for otherwise fragile splitter components. This approach allows the optical splitter modules to be added incrementally to the FDH, for example, as required.
A problem may arise due to the lack of protection and organization of the connectorized ends of the splitter output pigtails. For example, these pigtails can sometimes be left dangling in a cable trough or raceway within the enclosure. Leaving an optical component, such as a high performance connector, exposed in an open area leaves it susceptible to damage. These high performance connectors if damaged can cause delays in service connection while connectors are repaired. Leaving connectorized splitter output pigtails dangling in a cabling trough also exposes them to dirt and debris in the cabling trough. In current network deployments it may be important to maintain clean optical connectors to maximize the performance of the network.
In addition, fiber pigtails in the current art may be organized in a manner that is not conducive to rapid service delivery. In many cases splitters may have sixteen or thirty-two output pigtails bundled together making it difficult to find a particular pigtail. Also the bundle of loose hanging pigtails can easily become entangled and/or damaged causing further delays in service delivery. These tangles can cause congestion and, in some cases, result in bend induced loss on the pigtails, causing lower system performance.
To solve some of these issues a separate storage tray or enclosure has been utilized to take up slack and/or store and protect splitter output pigtail connectorized ends. However, these auxiliary devices tend to take up additional space and often obscure pigtails in an enclosure making it difficult for a linesman to locate a particular pigtail and/or connector. As a result, delays may occur in deployment of new subscriber connections depending on how much time is required to access the fiber pigtails in the enclosure. Thus, there is a need for a solution that provides convenient storage for fiber pigtails and/or connectors and does not take up additional space in the enclosure. The solution should provide direct access to and identification of fiber pigtails and/or connectors.
Finally current methods tend to result in a disassociation of the splitter module from the splitter output pigtail end. This usually results because the pigtail, once deployed, gets lost in the midst of other pigtails in the fiber jumper trough. When subscribers are taken out of service it is desirable to disconnect the splitter output and redeploy or store it for ready redeployment. It is further desirable for administrative purposes to maintain association of splitter module to splitter output pigtails so that resources are used effectively over time.
FDHs may benefit from devices and techniques that can be adapted to facilitate the organization of fiber pigtails and fiber pigtail terminations as well as protecting sensitive optical components when not in use. The devices and techniques should also facilitate easy access to pigtails and connectors so that subscribers may be efficiently connected and disconnected from the network. The devices and techniques should also group pigtails and connectors in a manner that allows them to be associated with a particular splitter module.


Web assets are requested by a variety of devices with different characteristics and with different configurations—for example, these characteristics include the screen size and/or resolution, the browser, the player software, etc. In addition, different users have different browsing priorities and preferences. A customized web asset can be delivered for each different device, configuration, and user type. However, this is difficult to maintain because of the ever evolving number of different assets that must be kept up to date.


As wireless telecommunication networks have evolved and expanded, there has been an ever-increasing need to manage the ways in which users are charged for their wireless device usage. With the advent of smart mobile devices that are capable of putting a much bigger burden on the telecommunications network through data access and streaming, there is a need to provide management of network usage that can control access to the network in real-time, particularly with regard to data consumption. This includes everything from always-on internet access to streaming of videos and applications like games.
Users may pay for their access to wireless networks in both prepaid and post-paid billing systems. The wireless network includes several logical functions to handle these systems. The vast majority of subscribers use post-paid billing which is handled by an Offline Charging System (OFCS) that transfers charging information to a Billing Domain (BD) where it is processed. Prepaid billing is handled by an Online Charging System (OCS) which may also forward charging information to the BD is a similar way.
With the increasing usage of network resources, service providers (SP) are actively pushing tiered data consumption limits. A tiered plan allows mobile device users to get their data at one rate up to a given quota limit, and at a different rate with a second quota limit. In some alternate cases, the SP may degrade the Quality of Service (QoS) after the first quota limit and provide unlimited data consumption with the degraded QoS till the end of the billing cycle.
While the QoS gating upfront with an OCS is relatively straightforward, there are no easy alternatives for the post-paid subscribers, as OCS is not in the call-control or data delivery path for them. Additionally, even with OCS, while QoS gating can be effectively applied on individual subscribers and sessions, there is no concept of applying it on a group basis. Examples of the group-based QoS gating would include enterprise users on a business usage plan, and members of a family on a personal usage plan.
Therefore, what is needed is a method and apparatus for QoS and gating control with an offline charging system (OFCS). There is also a need to QoS and gating control as a function of quota consumption by a group of users.


This invention relates generally to non-slip and non-skid surfaces and more specifically to a protective cover having a non-slip surface, and a method for making such a device, with application in many fields such as frame guards for motorcycles.
The invention relates to the field of non-slip surfaces. The product and process of this invention may be used in any industry in which a non-slip surface has utility. One specific industry is the motorcycle racing industry. Motorcycle drivers travel on challenging terrains which include obstacles such as sharp turns, jumps, and moguls. These conditions create varying extreme forces against the driver requiring him or her to continually maintain control of the bike and his or her body. Drivers maintain control of their cycles with their hands, legs and feet. The cyclist""s hands grip the steering handles while the cyclist""s feet push off against pegs, extending outward from the each side of the race bike. Cyclists maintain their stability by squeezing their legs against the sides of the cycle""s frame. Motorcycles for this application are generally available on the market and manufactured by companies that include Honda, Suzuki, Yamaha and Kawasaki.
Cyclists often attempt to improve their stability by improving the grip between the cyclist""s legs and the cycle""s frame. Traditionally, this was accomplished by the cyclist pressing his or her legs against the motorcycle""s frame. This method has several disadvantages. The cycle""s frame, usually made of metal, is slippery and not easily gripped. Repeated slippage and kicking of the cyclist""s legs and boots against the frame causes damage to the frame""s surface in the form of deformation and removal of paint and protective coatings. Consequently, the frame""s raw material is exposed to the elements resulting in a more rapid corrosion and deterioration of the motorcycle frame.
The prior art demonstrates that some motorcycle manufacturers and owners have attempted to solve this problem by placing a protective cover, known as a frame guard, over those areas of the frame that come into contact with the cyclist. These frame guards are ordinarily made of aluminum, carbon or plastic. While they solve the problem of protecting the frame from damage and deterioration, these frames are difficult to grip, provide little friction and hinder the ability of cyclists to maintain lower body support and control.
In response to this problem, many drivers alter the exterior surface of the frame guards in order to increase friction and prevent slippage. This is accomplished by applying a grip tape or bed liner coating to the exterior surface of the frame guard or directly to the motorcycle frame. Each of these methods increases friction and driver stability. However, they are very temporary solutions. Both methods quickly wear down and typically separate from the frame guard after two or less uses. Some cyclists replace the grip tape or bed liner several times during a single outing. Additionally, the appearance of partially removed grip tape and liners give the motorcycle an unkempt appearance.
As previously explained, the disclosed product and process provide beneficial use in any field of application where an anti-slip or anti-skid surface has application. The disclosure""s focus on this invention""s application to a frame guard for motorcycles is not intended as any limitation on the invention""s application to these other fields. Throughout this disclosure, the invention and process may be applied to any other type of surface or object capable of bonding according to the product and process described below.


The present invention generally relates to fabrication methods and resulting structures for semiconductor devices. More specifically, the present invention relates to a dual channel complementary metal-oxide-semiconductor (CMOS) having common gate stacks.
In contemporary semiconductor device fabrication processes, a large number of semiconductor devices, such as n-type metal-oxide-semiconductors (NMOS) and p-type metal-oxide-semiconductors (PMOS), are fabricated on a single wafer. In a CMOS integrated circuit (IC), complementary and symmetrical pairs of these NMOS and CMOS transistors are used for logic functions. Complementing every NMOS with a PMOS and connecting both gates and both drains together greatly reduces power consumption and heat generation relative to other logic families. For example, in a CMOS IC a high voltage on the gates will only cause the NMOS to conduct, while a low voltage on the gates causes only the PMOS to conduct.


The present invention relates to energetic atomic beam generation, and particularly to electrically neutral molecular or atomic beam devices and methods for mass spectrometry and surface analysis, often called fast-atom bombardment mass spectrometry (FABMS).
FABMS has several advantages over secondary-ion mass spectrometry (SIMS). The primary advantage is that FABMS allows the use of a liquid matrix, which simplifies sample preparation and maintains a reservoir of undamaged molecular sample species when subjected to an atomic beam under dynamic (intense particle flux) conditions. Secondly, the use of a neutral atom beam in the FABMS avoids the problem of floating the ion gun system above the accelerating voltage of the spectrometer. Finally, sample charge buildup is reduced with this neutral particle bombardment.
Molecular SIMS is invaluable for the analysis and characterization of bulk solid surfaces, their films and molecular overlayers. The static (low particle flux) used in molecular SIMS is desirable to avoid damage to the molecular solid sample. Although conventional ion sources are capable of operation under such static conditions, attempts to charge neutralize the sample with an electron flood gun to avoid sample charge buildup are often ineffective, and they can result in bombardment-induced radiation damage and electron-stimulated desorption. The dynamic (intense particle) flux of conventional atomic beam sources quickly destroys the molecular overlayers or thin molecular film samples associated with the molecular SIMS method.


The vascular endothelial growth factor (VEGF) proteins and their receptors (VEGFRs) play important roles in both vasculogenesis, the development of the embryonic vasculature from early differentiating endothelial cells, angiogenesis, the process of forming new blood vessels from pre-existing ones, and lymphangiogenesis, the process of forming new lymph vessels. The platelet derived growth factor (PDGF) proteins and their receptors (PDGFRs) are involved in regulation of cell proliferation, survival and migration of several cell types.
Dysfunction of the endothelial cell regulatory system is a key feature of cancer and various diseases associated with abnormal vasculogenesis, angiogenesis and lymphangiogenesis.
Angiogenesis occurs in embryonic development and normal tissue growth, repair, and regeneration, the female reproductive cycle, the establishment and maintenance of pregnancy, the repair of wounds and fractures. In addition to angiogenesis which takes place in the healthy individual, angiogenic events are involved in a number of pathological processes, notably tumor growth and metastasis, and other conditions in which blood vessel proliferation, especially of the microvascular system, is increased, such as diabetic retinopathy, psoriasis and arthropathies. Inhibition of angiogenesis is useful in preventing or alleviating these pathological processes or slowing progression of them.
Although therapies directed to blockade of VEGF/PDGF signaling through their receptors have shown promise for inhibition of angiogenesis and tumor growth, there remains a need for new or improved compounds and therapies for the treatment of such diseases.


1. Technical Field
The present invention relates to vertical free standing adjustable open frame to removably receive and hold venetian blinds and in particularly mini-blinds in an expanded xe2x80x9cdownxe2x80x9d position secured to the frame to stabilize the slats during cleaning.
2. Background Information
Cleaning venetian blinds is an onerous task because of the blind having a number of loosely connected slats that move easily during cleaning and due to the fact the long slender individual slats are easily bent.
In an attempt to ease the burden of cleaning a number of different types of blind support stands have been proposed. Most of the proposed support frames provide backing against which the slats can be pressed during wiping with a wash cloth. By way of example of known support stands for use in washing venetian blinds reference may be had to the following United States Patents: U.S. Pat. No. 3,197,797 issued Aug. 3, 1965 to U. Stanley; U.S. Pat. No. 2,996,747 issued Aug. 22, 1961 to J. Iori; U.S. Pat. No. 2,908,932 issued Oct. 20, 1959 to C. Shipp; U.S. Pat. No. 2,849,745 issued Sep. 2, 1958 to E. Madsen; U.S. Pat. No. 2,634,450 issued Apr. 14, 1953 to O Britton; U.S. Pat. No. 2,598,798 issued Jun. 3, 1952 to E. Kerr; U.S. Pat. No. 2,588,557 issued Mar. 11, 1952 to F. Morris et al.; U.S. Pat. No. 2,279,691 issued Apr. 14, 1942 to R. Long et al,; and U.S. Pat. No. 676,337 issued Jun. 11, 1901 to W. Nicholls.
None however, known to applicant, include a portion on the frame to counteract against forces exerted lengthwise of the slat during cleaning. Also very little, if any, attention has been given to providing a simple means of releasibly anchoring the blind to the support or to adjustably varying the frame size to suite different blind widths.
A vertical wash stand frame removably holds a mini-blind in an upright position so that the mini-blind is in the extended xe2x80x9cdownxe2x80x9d position above the floor surface for washing. The wash stand includes an adjustment for vertical height and horizontal width for holding blinds of different dimensions. It is particularly suitable for standing in the shower or bathtub and washing mini-blinds. One preferred embodiment is collapsible and portable. The open frame for supporting a venetian blind has a pair of spaced apart elongate side members each with a face plate and an end plate and are interconnected by a cross member. The cross member adjustably positions the spacing of the side members to suit blinds of various widths. A pair of saddles are adjustably mounted on the side members for releasibly supporting the top rail of the venetian blind Pins through the frame are insertable into opposed ends of the bottom rail of the venetian blind.
Although any type of standard blind having slats and a head rail could be used with the present invention, miniblinds such as described and set forth in U.S. Pat. No. 5,348,068 by Elsenheimer et al. and hereby incorporated by reference, are the focal point of the present invention. The wash stand frame includes at least two vertical longitudinal leg support members which may be extendible such as with telescoping means and at least one horizontal member connoting the two leg support members together including means for adjustable extending along the horizontal axis. Each leg is held steady by a base which may hold both legs or a pair of base members defining a pair of feet may hold each leg individually.
A principal object of the present invention is to provide a frame for holding the slats of a venetian blind captive during cleaning of the blind and a frame which is adjustable in width.
A further principal object of the present invention is to provide a simple anchoring mean to releasibly retain the blind to be washed on the frame.
It is an object of the present invention to hold a mini-blind secure and taut for cleaning.
It is an object to the present invention to provide a support structure which may only utilize eight pieces including two side members, a top member, a bottom member, and two brackets to hold two adjustable blind holders.
It is an object of the present invention to provide a top member and a bottom member which are adjustable in order to accommodate every average size blind, by moving to the desired notched opening and being locked in.
It is another object of the present invention to provide that the top and bottom member may be connected to the connecting side member by a hinge or means for attaching permitting folding of the members for storage.
In keeping with the forgoing there is provided in accordance with the present invention a variable width open frame for use in washing venetian blinds comprising a pair of elongate side members each having a face plate and an end plate engagable respectively with a face portion and an end edge portion of each slat of a venetian blind being cleaned thereon, a cross member adjustably interconnecting said side members at various selected different positions selectively to vary the width of the frame, saddle means on the frame for releasibly supporting the head rail of a venetian blind and movable pin means on said frame to releasibly anchor the bottom rail of the blind to said frame.


1. Field of the Invention
The present invention relates to a system for integration of foodstuff manipulating, filling and packing equipment operations and foodstuff information analysis and audio/video data as well as a method thereof; particularly, to a system which connects a foodstuff equipment and a remote server via network, such that the operational information on the foodstuff equipment and multimedia data on the remote server can be mutually transferred, facilitating information access during foodstuff equipment operation.
2. Description of Related Art
Currently known food/beverage manipulating, filling and packing equipments mostly provide functions of controlling foodstuff quantity manipulation, container position calibration, automatic tailoring or automatic ejection after package, which have been widely applied to commercial usage because of the simplicity during operation, and in particular extensively employed in the manipulation or cover-sealing operations for foodstuff service industry.
However, the presently available equipments are used merely on the applications of manipulating, filling or packing; as for the products that have been processed, the equipments have never performed any recording or statistic analysis. In case that users of the said foodstuff equipments need to do statistic analysis on the quantity or types of foodstuffs which have been manipulated, filled, packed, or else on the operation status of the foodstuff equipment, then it is inevitable to input alternatively by using other recording systems.
Furthermore, currently used equipments less frequently provide users with equipment status messages, or information related with the foodstuffs which have been manipulated, filled or packed therein; for the products manufactured, it is even rare to provide real-time advertisement channels. The promotion approaches that the users may adopt for the manipulated, filled or packed products by the equipments are usually restricted to merely print the product-related marketing propaganda or promotion contents onto the container or the plastic membrane for sealing.
To expand the application range of such foodstuff equipments, it needs to contemplate a working system for combining the manipulating, filling or packing operations in the foodstuff equipment as well as the information and data integration thereof, so as to enhance the its effect in industrial application, facilitating users to acquire richer and more practical information.


Increasingly, information is stored and processed in large data storage systems. At a base level, these data storage systems are configured with large amounts of memory to support the processing of the large amounts of data. However, the current designs limit the amount of memory that can be used by these systems.


1. Technical Field
The present invention relates generally to computer-aided diagnosis (CADx) and, in particular, to a computer-aided diagnosis (CADx) method for aiding diagnosis of three-dimensional digital image data.
2. Background Description
Computer-assisted diagnosis is an important technology in many clinical applications. In current clinical practice, cancer or other diseases may be missed during a physician's un-aided examination of medical image data, in part because of the large volume of data. This is particularly a problem for screening applications, since there is generally little time to devote to the examination of each patient's data, and the entire range of the data must be examined to make sure it is free from disease. Computer analysis that is performed silently in the background can greatly aid physicians in their work.
New technologies that offer three-dimensional (3D) scans of the human body, such as Magnetic Resonance Imaging (MRI) and Computed Tomography (CT), offer tremendous opportunities for improved detection of disease. However, the change from two dimensions to three means that there is a much larger amount of data for the physician to examine. Thus, the assistance of computer analysis becomes even more important.
The computer screen can only provide a two-dimensional (2D) view of a three-dimensional data set. There are many different approaches to presenting two-dimensional representations of such data, Traditional volume rendering algorithms sometimes produce satisfactory results, but they require pre-set thresholds to determine what types of tissue will be drawn as transparent and what types will be drawn as opaque. For complex anatomical structures, the volume rendering may be too cluttered for the physician to form a mental model of the underlying three-dimensional structure of the data, and how it corresponds to normal and abnormal anatomical structure. It would be useful for a CADx system to provide a visualization that helps the physician quickly build up the model, and easily distinguish abnormal structures from normal ones.
Unfortunately, many current CADx systems are not readily accepted by physicians, because their aid is seen as more of a distraction than a help. Many such systems present the results of the computer's diagnosis to the physician by marks, such as a red circle or arrow on the softcopy, which some physicians feel can create a bias in their interpretation of the data. Furthermore, many systems are perceived as a “black box”; that is, the physicians feel that they do not have any understanding of how the systems work and how they generate their diagnosis.
It would be more desirable to integrate physician's knowledge into the CADx process seamlessly, and without introducing marks onto the soft-copy that may be distracting or annoying to physicians.


A database system may include a relational database and multiple engines that are used to query the relational database. For example, the engines may include a structured query language (SQL) engine configured to query the relational database using standard SQL, and a calculation engine configured to query the relational database based on a calculation model. There may be benefits for using one type of engine over another type of engine. For example, the calculation model is a solution to express complex data flows and calculations within the database system. The calculation model is expressed in a format that allows non-relational operations and/or relatively more complex operations that are generally not possible with standard SQL. However, the SQL engine may be better suited for other types of operations such as join re-ordering or other relational operations. Both the calculation engine and the SQL engine are associated with their own optimizer. For example, the calculation engine's optimizer may be focused on filter push down, filter combination, attribute removal, etc., while the SQL engine's optimizer may be focused on relational optimizations.
Conventionally, the calculation models are not integrated with the execution model of the SQL optimizer. For example, if the query relates to a join involving a row store view and a calculation view, the SQL engine parses, compiles, and executes the SQL query for the row store view. After execution of the row store query, the query engine instantiates, optimizes, and then executes the calculation model for the calculation view, which is then combined with the row store view.


Detection system based on a substrate specific enzyme such as oxygenase and dehydrogenase is used for a measurement of a substrate such as glucose in a cell culture or a blood. In particular, the measurement system based on a dehydrogenase has highly valuable as it is hardly affected by oxygen in the atmosphere. Upon reacting the dehydrogenase with the substrate, a co-enzyme such as nicotine amide nucleotide (NAD) and nicotine amide dinucleotide phosphate (NADP) is reduced (NAD+→NADH, NADP+→NADPH). Concentration of the substrate can be determined from electric current or color intensity by transferring electron from the reduced form of the co-enzyme thus formed to an electrode or a reductive chromogenic dye via an electron mediator such as PMS (phenazine methosulfate), 1-Methoxy PMS (1-methoxy phenazine methosulfate) and PES (phenazine ethosulfate). Also, the concentration of the dehydrogenase can be determined using similar system by adding the substrate externally.
On the other hand, the electron mediator as mentioned above has a property to accept the electron from living cells. Various methods for measuring activities of living cells via the electron mediators that carry out electron transfer such as 1-Methoxy PMS and PES have been employed in a cell proliferation assay and cytotoxicity assay used in a drug screening in drug discovery and toxicity analysis for various substances. The method for evaluating the cytotoxicity by measuring the activity of the enzyme leaked out of the part of the dead cells into a culture medium via the electro mediators. However, the sample for the measurement has to be prepared by separating the living cells from the culture medium because the electron mediators as mentioned above also carries out the electron transfer with living cells (see F. K.-M. Chan et al., Methods Mol. Biol., 2013, 979, 65-70.). The method in which the living cells are not separated is also proposed, however, the influence of the living cells cannot be avoided, which requires to lower the reaction temperature and shorten the reaction time (see JPA 2005-523022).
In the cytotoxicity assay, the method in which the dehydrogenase from dead cells is assayed using diaphorase, an enzyme mediating electron transfer, instead of low molecular electron mediator to suppress the electron transfer from the living cells is proposed. However, a reagent solution is of poor solubility and not easy for handling because of the use of the enzyme.


Launching and recovering aircraft from ship flight decks is very challenging because of the small size of the flight deck and the movement (pitch, roll, etc.) of the ship as it travels through the water. This is especially true for smaller ships like frigates and destroyers that launch and recover rotary wing aircraft. In addition, most of these ships have superstructures, functioning has aircraft hangars, in front of the flight deck. The ship's geometry, along with the combined effect of prevailing winds and the forward motion of the ship, creates an air flow over and around the ship's superstructure resulting in an air wake behind the superstructure on the ship's flight deck. This air wake is often a turbulent and unsteady vortex on the flight deck creating difficulties with aircraft maneuverability on and around the flight deck.
The ship's superstructure is essentially a combination of bluff bodies. The air flow separates from the sharp edges of the hangar forming shear layers and low-speed recirculation zones leading to large spatial and temporal velocity gradients in the airflow over the flight deck. Vortical flow structures are shed from the hangar and other large-scale features on the superstructure. These vertical flow structures typically have length scales similar to a helicopter's fuselage and main rotor. Therefore, as the pilot moves the helicopter through the air wake during take-offs and landings, the highly unsteady airflow causes large fluctuations in the aerodynamic loading on the rotor and fuselage that adversely affect the helicopter's lift and thrust on take-offs and landings. The air vortex can also significantly disturb the aircraft's flight path as the aircraft responds to the influence of the ship's air wake. These factors, combined with poor visibility and water spray can significantly increase pilot workload. Consequently, the margins for pilot error can be significantly reduced, which increases the frequency and severity of accidents and crash landings.
The impact on flight decks and pilot workload, caused by these superstructure air wakes has not been fully appreciated in ship design. Although studies have shown benefits of placing flow control devices on ship superstructures to control the air flow around the vessel and increase aircraft maneuverability during takeoff and landing, these studies have only examined modifications applied to the rearmost edges of the ships hangar to mitigate the effect of superstructure vortices to the front of the carrier flight deck as shown in FIGS. 1 and 2. These types of flow control devices have had only a slight to moderately positive, and sometimes negative, effect on the reduction of flight deck air wake.
FIG. 1, shows several configurations, where air flow control structures extended upward from the top, aft edge of the hangar. In these locations, the structures obstruct views of the flight deck and also interfere with radar and radio communications signals to the aircraft. In other configurations, the flow control structures extend from the ends of each side of the hanger toward the flight deck. These configurations offer little to no airflow break-up and also reduce the usable area around the flight deck. Moreover, these structures are fixed in their positions, making them permanent obstructions to the radar and radio communications signals, as well as the usable flight deck area.
Flow control structures have also been placed along the top edge, starboard side of the superstructure, as shown in FIG. 2. These structures extend out parallel to the air flow along the side of the ship, offering little to no resistance as a streamlined airflow field passes over and around them. Therefore, air vortexes typically form on the ships flight deck with the same intensity as they would have without these flow control structures in place. Consequently, a more effective flow control device is desired.


Modern commercial aircraft make extensive use of computer systems to control aircraft behavior, plan and execute flights, and display information to the pilots during flight operations. FIG. 1 illustrates a flight deck 40 of a Boeing 777 aircraft having a forward instrument panel 46 and a control pedestal 45 configured in accordance with the prior art. Instruments 44 and display screens 20 are distributed over the forward instrument panel 46 and the control pedestal 45 for easy access by the pilots. The display screens 20 can include primary flight displays (PFDs) 21, an engine display 27, and three multi-function displays (MFDs) 22. The MFDs 22 can present additional aircraft flight information, including navigation displays 30, aircraft checklists, communication displays, and system status information.
Additional instrumentation is presented at a mode control panel (MCP) 41 positioned on a glare shield 42 of the flight deck 40, and at control and display units (CDUs) 47 positioned on the control pedestal 45. The glare shield 42 can also include a display select panel 48 having three display switches 59, one for each of the MFDs 22. A series of selector switches 60 each identify one type of available information to be displayed at the MFDs 22 (e.g., one selector switch 60 identifies the electronic checklist, another identifies the navigation display, and still another identifies the communications display).
In operation, the pilot first depresses one of the display switches 59 to select a particular one of the MFDs 22. Then the pilot presses one of the selector switches 60 to determine what type of information will be displayed at the-selected MFD 22. One drawback with this arrangement is that, on occasion, the pilot may press a selector switch 60 without realizing that a display switch 59 had previously been selected and that the previously selected display switch corresponds to an MFD 22 other than the one the pilot wishes to control. Accordingly, it may take additional time for the pilot to first determine that the appropriate display switch 59 must be pressed before pressing a corresponding one of the selector switches 60.
Another feature of the arrangement described above reference to FIG. 1 is that while the display screens 20 provide all the information the pilots require for flight operations, pilots are continually seeking additional information and additional flexibility and predictability in the way the information is presented. Accordingly, it may be desirable to provide the pilot with additional information and additional options for displaying the information.


This invention relates to short laser pulse generators of the type which pass the sidebands generated by a laser breakdown spark.
In the short history of the development of the laser art and its applications, which are only now beginning to unfold, laser-induced breakdown of gases has been an easily observed and dramatic effect. Recent experiments have shown that laser-induced breakdown of gases can be accompanied by substantial spectral broadening and self-phase modulation. Of more relevance for practical utilization is the observation that the breakdown plasma cuts off transmission of most of the incident beam in a time as short as 30 picoseconds.
The basic concept of short pulse generation from a laser spark is to employ a spectral filter that blocks the incident laser center wavelength but transmits a sideband produced by the sudden plasma growth. Among the types of spectral filters that have been suggested are the Michelson interferometer, the Fabry-Perot etalon and the grating monochromator. Of these only the grating monochromator can have sufficient rejection ratio to be of practical interest. Nevertheless, it is an expensive and inconvenient instrument to use and conventionally passes only one sideband yielded by the plasma.
It is desirable to obtain a more effective spectral filter, preferably a simpler one, for use in generation of short pulses by laser-induced breakdown in gases.


The surface configuration of a high-gain radio-frequency transmitting and/or receiving antenna (e.g., a large unfurlable antenna for deployment from a satellite or spacecraft in extraterrestrial space) ordinarily must conform to a precisely specified configuration, typically a parabolic configuration, in order to achieve diffraction-limited performance. However, the requirements of light-weight construction and thermal stability imposed by the constraints of typical applications in extraterrestrial space often preclude such an antenna from having the rigidity necessary to ensure that the actual surface configuration remains continuously in conformity with the specified surface configuration during an extended period of antenna operation.
Engineers involved in antenna technology customarily refer to the surface configuration of an antenna as the antenna's "figure". A system for monitoring the actual surface configuration (i.e., the figure) of an antenna, and for generating correction signals to change the actual surface configuration as required to maintain conformity with a specified surface configuration, is called a figure control system.
Proposals for figure control systems for use with large space-based unfurlable antennas have been described in the following documents:
1) C. C. Huang et al., "Structure Alignment Sensor Feasibility Demonstration", Lockheed Missiles & Space Company, Inc., Report No. D644951, 1978.
2) R. S. Neiswander, "Conceptual Design of a Surface Measurement System for Large Deployable Space Antennas", Proceedings: Large Space Systems Technology Conference, NASA Langley Research Center, 1981.
3) P. W. Collyer et al., "Electro-Optical System for Remote Position Measurement in Real Time", Proceedings: Large Space Systems Technology Conference, NASA Langley Research Center, 1981.
4) M. Berdahl, "Surface Measurement System Development", Proceedings: Large Space Systems Technology Conference, NASA Langley Research Center, 1981.
5) J. M. McLauchlan, "Spatial High-Accuracy Position-Encoding Sensor (SHAPES) for Large Space System Control Applications", Proceedings: Large Space Systems Technology Conference, NASA Langley Research Center, 1981.
Applications presently contemplated for large space-based unfurlable antennas require that the figure of the antenna be accurate to within 1/50 of the wavelength of the signal being transmitted and/or received, where the signal would have a frequency as high as 100 GHz. Such applications would require a measurement accuracy of about 0.06 mm in mapping the figure of the antenna at a measurement data rate of about 50 Hz. In contrast with such requirements, the measurement accuracies achievable with the antenna figure control systems previously proposed are from about 0.5 mm to about 0.15 mm (depending upon the particular system) at a measurement data rate of only about 10 Hz.


Rinse aid agents are applied in automatic car washes to promote the drying of wet surfaces after a vehicle is cleaned. Such compositions typically contain a hydrophobic substance, a cationic emulsifier (e.g., a dialkyl dimethyl quaternary ammonium compound, or imidazoline quaternary surfactant), solvents (usually glycol ethers and/or alcohols) and, optionally, coemulsifiers (mostly nonionic or amphoteric surfactants such as alcohol ethoxylates, amine ethoxylates, betaines, etc.). During washing of a vehicle, the use of surface-active agents in the washing water results in the formation of a continuous, firmly adhering film of water on the vehicle surface. This film has to be removed to promote drying and to avoid the formation of spots or streaks due to the presence of salts and other impurities in the water. To achieve this, surface-active quaternary ammonium compounds and hydrophobes are added to the water in the rinsing phase. Because of the adsorption of the cationic surfactant and the hydrophobe on the paint surface, the water film is opened up, and the drops of water can then easily be removed by means of a blower.
Many of the ingredients typically used in rinse aids have undesirable environmental and performance characteristics, such as poor biodegradability or even toxicity, unpleasant smell, flammability, and high volatile organic compound (VOC) content. In addition, these compositions are often in the form of emulsions that may go through a viscous gel phase upon dilution. This makes them difficult to apply in automated carwash operations since they may plug spray nozzles and interfere with the proper operation of metering pumps.
US application Ser. Nos 2005/0014672 is directed to a rinse aid additive and to rinse aid compositions containing the additive. The additive includes: an amidoamine quaternary ammonium component derived from a non-animal source; a first primary amine ethoxylate derived from a non-animal source; and a second primary amine ethoxylate derived from an animal source.
U.S. Pat. No. 6,235,914, U.S. Pat. No. 6,376,455 and U.S. Pat. No. 6,458,343 relate to quaternary ammonium compounds and formulations thereof that are useful as cleaning compositions, antistatic compounds, paper debonders, fabric softeners, hair conditioners, skin conditioners, paper deinking and ink floatation agents, asphalt emulsion agents, corrosion inhibitor agents, ore floatation agents, pesticide emulsion agents, car drying aid sprays, drilling fluid additives, and the like.
U.S. Pat. No. 5,703,029 is directed to a water-dilutable car drybright compositions which have a strong hydrophobicizing action and which are used in rinsing liquids at carwash installations. The disclosed compositions contain ester quats which are the reaction products of alkanolamines and fatty acids, a fatty amine coemulsifier and a glycol ether solvent.
U.S. Pat. No. 6,255,274 relates to soil release polymers in detergents, cleaning agents and fabric softeners. The latter may contain ester quats which are the reaction products of alkanolamines and fatty acids and further quaternized with customary alkylating or hydroxyalkylating agents. Triethanolamine and methyl diethanolamine type ester quaternaries are particularly preferred.
EP 1 323 817 B1 discloses cationic preparations for cleaning hard surfaces, that contain esterquats with acyl groups derived from unsaturated C8-C22 fatty acids with iodine values of 100 to 150 as cationic surfactants.
EP 1 840 197 A1 relates to a composition for rinsing and drying vehicles comprising at least one addition salt of an ester amine. The comparative examples disclose compositions comprising a triethanolamine oleic acid ester quat, a hydrophobe, an ethoxylated amine coemulsifier and a butyl glycol solvent.
U.S. Pat. No. 5,827,451 discloses isotropic oil-in water microemulsions containing an oil component of a fatty acid, fatty alcohol or ester thereof; a quaternary ammonium component; an ether component; and water. The microemulsions may be used to form hydrophobic films on hard surfaces, rendering them useful in carwashes.
EP 0 421 146 discloses biodegradable compositions that can be used as drying agents for paint surfaces. The compositions contain a cationic surfactant, an emulsifier, a solvent and an oily component.
U.S. Pat. No. 5,391,325 discloses compositions for rinsing and drying vehicles comprising a cationic emulsifier, a fatty acid ester of an alcohol having 1 to 5 carbon atoms and a solubilizer, which can be a glycol ether solvent or an amine oxide.
Although the prior art discloses compositions that are useful as rinse aids, known compositions containing biodegradable emulsifiers usually provide emulsions of inferior stability and are less efficient as rinse aids. Therefore, there is still a need for rinse aid compositions with biodegradable components that form stable emulsions and impart hard surfaces with a durable hydrophobic coating that promotes short drying times at low use concentrations. In addition, it would be highly desirable if these compositions do not form gels during dilution.


1. Field of the Invention
This invention relates to pressure-sensitive adhesives having the capacity to absorb moisture and therefore adhere to moist body surfaces for a prolonged period of time. More particularly, this invention relates to an improvement in such adhesives which affords them a combination of high plasticity and "wet-stick" adhesion at acceptable levels of moisture absorption over prolonged periods of time, which renders the adhesive particularly suitable for such applications as stoma seal adhesives. This invention also relates to surgical sheet materials such as adhesive tapes and to adhesive bandages and dressings, including plasters that are particularly suitable for use in connection with ostomy appliances as well as for coverings for cuts, abrasions and the like, which comprise a flexible backing member, one of whose major surfaces has adhered thereto a coating of a pressure-sensitive adhesive of the present invention.
Various types of pressure-sensitive adhesives have been proposed and utilized as the adhesive component in adhesive bandages, adhesive tapes and the like. Acrylate polymers, polyolefinic polymers and compounded systems based on natural or synthetic rubber polymers have all been tried or utilized as pressure-sensitive adhesives with varying degrees of success.
A pressure-sensitive adhesive must have certain characteristics to be useful. It must be sufficiently tacky, i.e., have sufficient "grab" or quick-stick," to adhere quickly to the surface to which it is to be adhered. It must also continue to adhere to that surface over extended periods of time. A pressure-sensitive adhesive composition should also have sufficient internal strength to prevent splitting and leaving particles of adhesive on a surface to which an article coated with the adhesive has been adhered when the article is removed. Where the pressure-sensitive adhesive is designed for application to the skin, the problems of adherence are substantially increased. Although the initial tack or stick may be good, adherence over an extended period of time for many pressure-sensitive adhesives requires relatively high shear adhesion to withstand movement of the underlying skin. Also, the adhesive must be tailored to accommodate the nature of the underlying skin surface, as where perspiration and other surface changes may occur. The problem is further complicated by the fact that any pressure-sensitive adhesive designed for application to the skin must release from the skin sufficiently readily to permit removal without skin damage. Where the adhesive is too strongly adhered to the skin and has substantial internal strength, small particles of the upper layer of skin are removed with the adhesive with resulting irritation to the skin. As a result, although many pressure-sensitive adhesives are available for various commercial uses, relatively few have been found which are suitable for articles for skin applications, particular in that many of those having desirable, high sheer adhesion, have an undesirably high resistance to removal, or peel adhesion. This problem is further complicated when the adhesive is intended in such applications as those involving ostomy appliances, where it is required to maintain adhesion for prolonged periods of time while in contact with body fluids, and at the same time to prevent leakage of such fluids therethrough.
A colostomy is the surgical creation of a new opening for the colon on the surface of the body, while an ileostomy is the surgical creation of an opening for the ileum. In an ileostomy the entire colon, the rectum, and sometimes a small portion of the ileum, is removed. In a colostomy the rectum, and sometimes a portion of the colon, is removed.
Both ileostomy and colostomy operations involve the creation of an artificial opening (stoma) in the abdomen to which the distal end of the healthy intestine is attached. Generally, the stoma is placed low on the abdomen and to one side. A related enterostomy for which the stoma seal adhesive of the present invention might be useful is the urinary diversion. It involves the formation of a permanent fistula through which the ureter may discharge its contents.
As a result of the ostomy procedure, means must be provided for conveniently and hygenically collecting human waste material from the resulting stoma. While there are many such ostomy appliances, a common problem experiences with them, as indicated above, is the establishment and maintenance of both good skin adhesion and an adequate seal to prevent waste material coming in contact with the patient's skin. This requires, inter alia, an adhesive material that has good adhesion to both dry and wet skin, adequate moisture absorptivity and sufficient elastic modulus or plasticity to prevent either inadvertent detachment from wet skin or inordinate difficulty or discomfort to the user when the device is intentionally removed.


The present invention relates to an emulsion for the treatment of cellulose filaments after spinning and a method for the preparation of cellulose filaments with use of the emulsion.
Usually, in the preparation of viscose rayon filaments by a centrifugal spinning process, the cake is treated with an emulsion, dehydrated and then dried in a tunnel drier for 70 to 100 hours. The cake should be dried at a low temperature under a high moisture to be dried uniformly throughout its inside and outside. Generally, the external part of the cake is wound densely under tension so that it is difficult to shrink during drying and tends to form internal strain when dried suddenly, while the internal part of the cake is wound under low tension so that it tends to shrink by drying and forms no internal strain. Accordingly, the quality of the filaments is largely affected by the drying temperature and the drying speed.
Accordingly, by a rapid drying method, the surface of the cake is easily dried to form a shrinking force. However, since the surface of the cake cannot shrink freely, it is dried under tension to form internal strain. Further, the shrinkage is uneven between the inside and the outside of the cake, and resultantly a difference in fineness between them occurs. In some cases, a high frequency heating system is used to dry uniformly the cake throughout its inside and outside, but it requires disadvantageously a high manufacturing cost.
Conventionally, a nonionic emulsion or a mixture of a nonionic emulsion and an anionic emulsion has been used for the emulsion treatment of cellulose filaments after spinning, and recently with the high development of surface active agents an anionic or a nonionic emulsion or their combination has been used as the base in many cases. However, no cationic surface active agent has been used.
An object of the present invention is to provide an emulsion for treatment of cellulose filaments such as viscose rayon filaments and acetate filaments after spinning, which reacts easily with cellulose molecule in the amorphous area of the fiber and thus lowers its swelling degree and makes free shrinkage possible along the progress of drying.
Another object of the present invention is to provide a method for preparation of an excellent filament having uniform fineness, smooth surface, naturally increased twist and increased tensile strength by using such an emulsion.


3D APIs includes common operations to resolve a multisample anti-aliased (MSAA) texture, copy resource, initialize a texture and generate mipmaps and perform other operations. In all such operations, graphics driver logic in control of a graphics processor can program a pixel shader to sample from source texture and write to a destination as render target. For texture initialization, the source is simply written to destination. For MSAA resolve and mipmap generation the graphics processor can output a simple average of the samples color into the non-MSAA destination or the next mip level. This approach enables color compression when writing to destination render target but does not utilize any cleared status that may be set for the source texture.


Pentasil-zeolites are defined by their structure type and more specifically by their XRD. ZSM-5 is one commercial pentasil-zeolite product.
As early as 1967, Argauer and Landolt (U.S. Pat. No. 3,702,886) worked out parameters for the synthesis of pentasil-zeolites, particularly those relating to the following molar ratios:
OH.sup.- /SiO.sub.2 =0.07-10 PA1 SiO.sub.2 /Al.sub.2 O.sub.3 =5-100 PA1 H.sub.2 O/SiO.sub.2 =1-240 PA1 SiO.sub.2 /Al.sub.2 O.sub.3 =20 to 60 PA1 OH.sup.- /SiO.sub.2 =0.10 to 0.20 PA1 H.sub.2 O/SiO.sub.2 =20 to 60;
However, the Argauer and Landolt procedure succeeded in synthesizing a reasonably pure phase ZSM-5 zeolite only if organic amines with a structure-giving function (i.e. template function), such as tetrapropyleneammonium compounds were used.
Subsequent to publication of the Argauer and Landolt patent, various publications have disclosed methods of conducting the synthesis of pentasil-zeolites without requiring the very expensive, toxic and easily inflammable organic amine templates. Still other subsequent publications have disclosed substitutes for these amines. In addition to their expense, toxicity and flammability, such amines are disfavored because they are subject to thermal decomposition which can destroy the zeolite structure. Further publications have disclosed modifications of the Argauer and Landolt process directed towards improving the reactivity of the SiO.sub.2 and Al.sub.2 O.sub.3 starting materials.
For example, German Offenlegungsschrift 34 02 842 discloses a method wherein a specially aged aluminosilicate (which is still, however, amorphous to X-rays) is used as a nucleating gel. The method avoids the use of organic amine templates.
EP 0 111 748 discloses aluminosilicates having a zeolite structure and methods for their preparation. The zeolite synthesis is carried out without the addition of an organic compound, but in the presence of aluminum phosphate. However, this method results in zeolites which contain phosphate.
Under normal conditions, the synthesis of zeolites without the use of organic compounds proceeds very slowly. Accordingly, there are no large-scale methods that do not use organic templates for the preparation of high-silica aluminosilicates having a pentasil structure (see Synthesis of High-Silica Aluminosilicate Zeolites, by P. A. Jacobs and J. A. Martens, Studies in Surface Science Catalysis 33, 1987, p.143; and Zeolites as Catalysts, Sorbents and Detergent Builders, H. G. Karge and J. Weithamp, Studies in Surface Science Catalysis, 46, 1989, p.654).
It is known that formation of aluminosilicates, build-up of the zeolite crystal lattice from SiO.sub.4.sup.- and AlO.sub.4.sup.- tetrahedra, nucleation of zeolites, and zeolite crystal growth all take place by way of reversible reactions. These processes depend on chemical equilibria, which can shift in different directions depending on the temperature, the hydrothermal pressure relationships and the concentrations of reactants (e.g. supersaturated or unsaturated). In synthesizing crystalline aluminosilicate materials, it is desirable to achieve as complete a conversion as possible to the crystalline aluminosilicate while avoiding both secondary phases (such as cristobalite) and an amorphous phase.
High temperatures (i.e., temperatures in excess of 200.degree. C.), and consequent high reaction rates, are advantageous for the formation of crystalline aluminosilicate. However, high temperatures (in excess of 200.degree. C.) increase the probability of forming secondary phases.


1. Technical Field
The present disclosure relates to diffusion devices, and more particularly, to diffusion devices for emitting more than one active material therefrom.
2. Description of the Background
A multitude of active material diffusion devices or diffusers exist in the marketplace. Many of such devices are passive devices that require only ambient air flow to disperse the liquid active material therein. Other devices are battery-powered or receive household power via a plug extending from the device. A cord may be coupled between the plug and the device, or the plug may be mounted directly on the device.
Various means for dispensing active materials from diffusion devices are also known in the art. For example, some diffusion devices include a heating element for heating an active material to promote vaporization thereof. Other diffusion devices employ a fan or blower to generate air flow to direct active material out of the diffusion device into the surrounding environment. In another type of diffusion device, active material may be emitted from the device using a bolus generator that delivers a pulse of air to eject a scent ring. Still other diffusion devices dispense active materials utilize ultrasonic means to dispense active materials therefrom.
In one example a diffusion device includes two heaters for dispersion of fragrances. The device includes a housing, a plug extending from the housing for insertion into an outlet, and two containers having fragrances therein and wicks extending therefrom to absorb fragrances from the containers. Each of the heaters is disposed adjacent one of the wicks to heat the respective wick to vaporize the fragrances therein. Optionally, a CPU controlled by internal software may first activate a first of the two heaters for a predetermined period of time. After the period of time expires, the CPU deactivates the first heater and thereafter activates the second heater.
Other diffusion devices include a housing having a cavity for receiving a cartridge. The cartridge generally has a plurality of scent elements disposed on a rotatable disk. A blower is mounted in the housing to generate airflow by passing air across a scent element and out an aperture in the housing. The housing further includes rotating means that rotate the rotatable disk, thereby rotating the scent elements thereon. The device diffuses a first scent for a predetermined time period and thereafter rotates the disk to a second scent and diffuses the second scent for the predetermined time period. This process repeats itself until the last scent element is diffused for the time period and then the disk is rotated to a home position.
Piezoelectrically actuated vibratory type liquid atomization apparatuses are described in Helf et al. U.S. Pat. No. 6,293,474, Martin et al. U.S. Pat. No. 6,341,732, Tomkins et al. U.S. Pat. No. 6,382,522, Martens, III et al. U.S. Pat. No. 6,450,419, Helf et al. U.S. Pat. No. 6,706,988, and Boticki et al. U.S. Pat. No. 6,843,430, all of which are assigned to the assignee of the present application and which are hereby incorporated by reference herein. These patents describe an apparatus comprising a piezoelectric actuating element coupled to a liquid atomization plate. The piezoelectric actuating element vibrates the liquid atomization plate in response to alternating electrical voltages applied to the actuating element. The vibration of the plate causes atomization of a liquid supplied to it by a liquid delivery system. An electrical circuit is provided to supply the alternating electrical voltages to conductive elements that are in electrical contact with opposite sides of the actuating element. The conductive elements may also serve to support the actuating element and the liquid atomization plate in a housing that contains the device.


1. Field of the Invention
The present invention relates to an antenna cover that protects an antenna of a plasma generating device.
2. Description of the Related Art
In a plasma generating device, for example, plasma electrons are accelerated by an RF electric field generated in the vicinity of an antenna in a plasma chamber and plasma is generated. At this time, if the antenna is exposed to the plasma, the antenna is sputtered, which results in becoming the pollution cause of the plasma. For this reason, a member for protecting the antenna from the generated plasma is provided. For example, a partition plate is provided between the plasma chamber and an antenna chamber to protect the antenna.
Because the protection member of the antenna is exposed to the plasma, the protection member is damaged by the plasma. If the protection member is abraded under an influence of the plasma and a hole is formed in the protection member, the antenna is exposed to the plasma and the plasma is polluted. If the protection member is formed thick or the antenna or the protection member is arranged to be distant from a generation position of the plasma, abrasion of the protection member can be decreased. However, generation efficiency of the plasma is deteriorated.


The present invention relates to the field of electro-optical signal processors. The inherent parallelism associated with optical signal processing techniques allows such systems to process a large image just as rapidly as a small one; whereas, for digital methods, the processing time tends to increase exponentially with image size. For example, a single liquid crystal television can be driven at 60 frames per second. Thus, 60 2D Fourier transforms (Fraunhofer diffraction patterns) could be formed per second. This is much faster than current state-of-the-art digital techniques. Moreover, other spatial light modulators such as ferro-electric devices, which are more expensive, can be driven at even faster rates of 2,000 frames per second.
Current optical signal processors, using spatial light modulators as programmable transparencies, process a single image at a time. Since very high resolution spatial light modulators are commercially available, often the images to be processed do not require the full TV screen. Hence the "single image" optical systems discussed above don't take full advantage of the inherent parallelism associated with optical processing signal processing. It is thus desirable to partition the TV screen or other SLM into separate regions so that several Fourier transforms can be optically computed in parallel to significantly increase the throughput rates for many optical signal processing applications.
Using lenslet arrays has been suggested for spatial multiplexing. However, using lenslet arrays suffer from serious disadvantages. Most importantly, for high resolution spatial light modulators, small diameter lenses must be used. Such small lenslets tend to be poor in quality and consequently have aberrations that significantly degrade the diffraction pattern. Moreover, even if perfect small lenslets could be manufactured, their small diameter, relative to the partitioned region to be optically processed, also causes serious degradation in the resulting diffraction patterns. In order to avoid this problem, the lenslet diameter would need to be several times larger than the partitioned region; but this severely limits the number of regions that can be partitioned and thus reduces the number of Fourier Transforms that can be computed in parallel. Secondly, each of the lenslets must be aligned and spaced very accurately to within a few microns. No such lenslet arrays exist and consequently, haven't been used to perform spatial multiplexing. Thirdly, lenslet arrays are very expensive. The present invention does not suffer from any of these drawbacks.


The present invention relates to an optical disk and a method of producing the same and more particularly to a stamper for molding an optical disk base highly compatible with commercially available CD (Compact Disk) players, a method of producing the stamper, a method of producing an optical disk base, a method of producing an optical disk, and an optical disk base, and an optical disk.
In parallel with the spread of optical disks, there is an increasing demand for the timely delivery of high quality optical disks to the market. Particularly, to enhance quantity production of optical disks, it is necessary to reduce a disk base molding cycle.
To produce an optical disk, a stamper formed with a transfer surface is positioned in one of a pair of mold parts forming a cavity therebetween. Molten resin is injected into the cavity and then cooled off. Subsequently, the mold parts are separated in order to remove the cooled resin. As a result, the transfer surface of the stamper is transferred to the resin, forming a recording surface.
It is a common practice with an optical disk to hold the mold parts at a temperature of about 200xc2x0 C. lower than the temperature of resin to be injected into the cavity. This promotes the cooling and solidification of the resin injected into the cavity. Such a mold temperature is determined by the tradeoff between transferability and an increase in the tact of a disk base molding cycle. Specifically, the mold temperature should be as low as possible for increasing the tact, but would degrade transferability if excessively low. On the other hand, a high mold temperature would enhance transferability, but would increase a period of time necessary for the resin to be cooled to a parting temperature and would thereby lower the yield of optical disks.
Japanese Patent Laid-Open Publication Nos. 7-178774, 10-149587 and 6-259815 each propose to provide a mold or a stamper with a heat insulating ability so as to enhance both the transferability and the tact of the disk base forming cycle. Specifically, Laid-Open Publication No. 7-178774 teaches a heat insulating body removably positioned in a mold in such a manner as to face the rear of a stamper. Laid-Open Publication No. 10-149587 teaches a heat insulating ceramic layer formed on a mold in such a manner as to face the rear of a stamper. Further, Laid-Open Publication No. 6-259815 teaches a stamper whose front (transfer surface) is plated with Ni (nickel) containing 20% to 30% of polytetrafluoroethylene by electroless plating. Polytetrafluoroethylene has a grain size of 1.0 xcexcm or less. The resulting Ni film is 50 nm to 70 nm thick.
However, none of the above conventional technologies can enhance both the transferability and the tact of a disk base molding cycle at a high level. Laid-Open Publication No. 6-259815 has a problem that the Ni film formed on the transfer surface of a stamper obstructs the fine patterning of the transfer surface. Laid-Open Publication No. 10-149587 has a problem that the mold itself must be redesigned or replaced, wasting existing molding equipment.
Spin coating has customarily been used to coat a molded disk base with an organic pigment which forms a recording layer because spin coating is desirable from the easy process and low cost standpoint. While the thickness distribution of the recording layer can be controlled on the basis of coating conditions, it is difficult to control the distribution of the pigment in guide grooves. Specifically, to form the recording layer, a disk base is caused to spin such that a pigment solution sequentially spreads outward over the entire disk base due to a centrifugal force. However, the centrifugal force differs from one position to another position in the radial direction of the disk base. This, coupled with the fact that the solvent evaporates while spreading outward, causes the pigment to fill outer guide grooves more easily than inner guide grooves.
It follows that if the guide grooves of the disk base have a uniform configuration from the inner circumference to the outer circumference, the configuration of the guide grooves filled with the pigment differs from one position to another position in the radial direction. This scatters reflectance and tracking error and other signal characteristics and makes it difficult to produce constant quality, reliable optical disks. In addition, the resulting optical disks are not satisfactorily compatible with commercially available CD players.
Japanese Patent Laid-Open Publication Nos. 5-198011 and 5-198012, for example, disclose implementations for correcting the above difference in configuration between the inner guide grooves and the outer guide grooves filled with the pigment. The implementations are such that the configuration (depth) of the guide grooves to be formed in a disk base or a stamper is intentionally varied beforehand. None of such implementations, however, gives consideration to the decrease in the fluidity of molten resin ascribable to temperature fall. Therefore, the implementations cannot realize desirable transferability alone when a high cycle is desired, aggravating the scattering of optical disks in signal characteristics.
It is therefore an object of the present invention to enhance both the transferability and the tact of a disk base molding cycle at the same time.
It is another object of the present invention to allow a transfer surface to be finely patterned.
It is yet another object of the present invention to make it needless for existing molding equipment to be redesigned or replaced.
It is a further object of the present invention to provide an optical disk sufficiently compatible with commercially available CD players by allowing guide grooves filled with a pigment by spin coating to have a substantially uniform configuration at any position in the radial direction.
In accordance with the present invention, a stamper for molding an optical disk base includes a transfer surface for molding the optical disk base, and a heat insulating material extending in parallel to, but not contacting, the transfer surface.
Also, in accordance with the present invention, a method of producing a stamper for molding an optical disk base includes the steps of electroforming on a photoresist master having a transfer surface pattern an Ni layer having a transfer surface to which the transfer surface pattern is transferred, forming a heat insulating layer on the Ni layer, and separating the photoresist master from the Ni layer.
Further, in accordance with the present invention, a method of producing an optical disk base includes the steps of injecting molten resin into a cavity formed by a pair of mold parts and accommodating a stamper having a transfer surface for molding the optical disk base and a heat insulating layer extending in parallel to, but not contacting, the transfer surface, and separating the pair of mold parts to thereby remove the resin cooled off.
Furthermore, in accordance with the present invention, a method of producing an optical disk includes the steps of injecting molten resin into a cavity formed by a pair of mold parts and accommodating a stamper having a transfer surface for molding the optical disk base and a heat insulating layer extending in parallel to, but not contacting, the transfer surface, separating the pair of mold parts to thereby remove the resin cooled off, coating a transfer surface of the resin with a recording material to thereby form a light absorption layer, forming a reflection film on the light absorption film, and forming a protection film on the reflection film.
Moreover, in a method of producing an optical disk base, a heat insulating material is positioned beneath a recording area formed on the surface of a stamper for molding an optical disk.


1. Field of the Invention
The present invention relates to imaging apparatuses and methods. More specifically, the invention relates to imaging apparatuses and methods for characterizing objects by emitting and receiving photons.
2. Description of Related Art
Three-dimensional image scanning has long been a desired tool in many technical fields. Fields such as manufacturing, military technology, and medical treatments have varying applications for this technology. Three dimensional images allow for close inspection and computer image manipulation of the imaged object. Further, objects that are scanned may be rapidly reproduced and manufactured by eliminating physical measuring and computer drafting time. Early applications of this technology were limited in effectiveness and practicality because of the extremely high number of data points that were required to be processed and the speed of computers to process the data.
These previous applications of three-dimensional imaging apparatuses and methods also employed various inefficient methods of collecting the data points of the object. Some of these methods included physically measuring a large number of points on the object with a stylus or other device to obtain the three axes coordinates for points along an image model. Other imaging devices bombarded the object with a large number of waves or particles.
The waves or particles were emitted at the target and collected as they return to the source. While these procedures allowed for a large number of data points to be taken along the object, the shear volume of data points collected in the imaging processes overwhelmed the accompanying computer. Additionally, the large number of data points created a significant amount of noise in the image results, causing variation and inaccuracies in the image. These drawbacks add to the time required to image an object and the cost of the equipment. Resultantly, three-dimensional imaging has not been fully employed to its maximum potential in many fields because of these limitations.
Therefore, what is needed is a three-dimensional imaging device and method that is capable of minimizing the number of data points required to image a three-dimensional object and that is capable of minimizing the analyzing time of the collected data.
The present invention has been developed in response to the current state of the art, and in particular, in response to these and other problems and needs that have not been fully or completely solved by currently available three-dimensional imaging technology. The present application discloses an imaging apparatus comprising a photon source, a photon receiver, and an analyzer. The photon source is configured to emit a photon at a target. Once the photon impacts the target, the photon reflects to the photon receiver. The photon receiver is configured to identify a reflection time of the photon and an arrival position of the photon on the photon receiver. Once the reflection time and arrival position are known, the information is transferred to the analyzer. The analyzer is configured to associate the arrival position with a position on an X-Y plane and to associate the reflection time with a Z-height of the X-Y position.
The imaging apparatus is capable of imaging the characteristics of two-dimensional objects, three-dimensional objects, and geographical features among other objects. The reflection time of the photon is determined from a voltage analog established by charging a voltage storage device during the interval between the photon emitting from the photon source and the photon being received by the photon receiver. In one embodiment the charging voltage is linear; in another embodiment the voltage charge is exponential.
An alternative embodiment of the imaging apparatus may comprise a photon source that emits a photon pulse at a target. The photons reflecting from the target impact on a photon receiver having an array of geometrically arranged pixels. The geometrically arranged array of pixels is configured to identify a plurality of photon arrival positions on the array. The imaging apparatus also has a plurality of timing circuits coupled to the geometrically arranged pixels. The timing circuits are configured to determine the reflection time of individual photons received by the photon receiver. The arrival position and reflection time are then transferred to an analyzer where the reflection times and the photon arrival position are analyzed to determine the geometric characteristics of the target.
In operational terms, the apparatus emits a photon pulse at a target and a plurality of timers are started in response to the emitted photon pulse. Next the photon pulse impacts the target and a number of photons reflect off of the target. The reflected photons are received on a geometrically arranged array. The locations on the array where the photons are received, establishes a plurality of arrival positions. A number of timers are also stopped upon receipt of an emitted photon on the geometrically arranged array. The time between the timer starting and stopping establishes a reflection time for individual photons. Finally, the arrival positions of the photons are compiled to generate an outline of the target in the X-Y plane and the reflection times of the individual photons are associated with positions on the outline to define the Z-components of the target. Thus, the arrival positions define the X and Y positions of the three-dimensional image and the reflection times define the Z positions of the three-dimensional image.


A semiconductor laser element is specified in Japanese Patent Publication No. 2002-299763 A.
On account of their compactness and cost-effective production, semiconductor laser diodes are used in numerous areas of application, such as, for example, data transmission, data storage, projection, material processing, optical pumping, biosensor technology and the like. In particular semiconductor laser diodes having a ridge waveguide, so-called ridge laser diodes, are used in this case. Conventional ridge technology is encountering its limits here in the face of constantly increasing requirements regarding higher powers, improved mode behavior and the like, with regard to robustness, reliability and high radiation efficiency. Central problems here are the inadequate mechanical stability, the deficient electrical loading capacity and the unsatisfactory leakage current and aging behavior of the conventional ridge laser diodes. In particular, the manufacturing yield for mass market applications and the production costs associated therewith are not optimal.
FIGS. 6A and 6B illustrate two exemplary embodiments of a conventional ridge waveguide semiconductor laser diode in cross section. On a GaN substrate 100 there are arranged an n-conducting cladding layer 101, an n-conducting waveguide layer 102, an active semiconductor layer 2c, a p-conducting waveguide layer 103, a p-conducting cladding layer 104 and an ohmic contact layer 105. The p-conducting cladding layer 104 and the p-conducting waveguide layer 103 are etched in such a way that a ridge waveguide 200 is formed. The semiconductor laser diode thus has a main body 201 and a ridge waveguide 200.
Side faces of the ridge waveguide and of the main body are provided with a passivation layer 107. In this case, the passivation layer 107 is arranged uniformly on the side faces, such that this is embodied in a stepped fashion. In addition, the passivation layer has an opening on the surface of the ridge waveguide, such that an electrical contact connection is made possible at this surface of the ridge waveguide.
For making electrical contact with the semiconductor laser diode, an n-conducting connection layer 106 is arranged on that side of the substrate which faces away from the semiconductor layers and a p-conducting connection layer 5 is arranged on the passivation layer and the ridge waveguide.
However, laser diodes of this type have a deficient robustness since the ridge waveguide of the laser diode is susceptible to mechanical damage such as, for example, scratching, bond damage or external mechanical force effects. In addition, on account of the vertically formed side face of the ridge waveguide, uniform application of the p-side contact is difficult to carry out since, on account of shading effects, the contact feed at the base of the ridge waveguide is formed in a very thin fashion. However, these thinned contact regions constitute weak points in the current-carrying capacity and can lead to an electrical failure of the semiconductor laser diode. A further problem of the conventional laser diodes is a short-circuit risk. In particular on account of the passivation layer 107 having a thickness of only a few 100 μm, there is the risk of a short circuit in the region of the active layer 2c in the case where the etching process carried out for producing the ridge waveguide is implemented partially deeper, such that etching is effected near or even through the active layer 2c.