NIST Lead-Free Solder database
|What is it?||Data from NIST covering solder materials.|
|What is in it?||
Composition, economic, mechanical, electrical, and thermal properties, manufacturability, wetting, and test results for 350 lead-free and lead-based solder materials.
|What is it used for?||Selecting and substituting materials - particularly, replacing solders impacted by regulation.|
|Where does it come from?||The book "Properties of Lead-Free Solders" by Sieward, Liu, Smith & Madeni (National Institute of Standards and Technology and Colorado School of Mines) v4.0 (2002). Additionally, NIST test data.|
|How can I access it?||Available as a standalone database in the GRANTA MI software.|
RoHS (restriction on hazardous substances) legislation around the world has accelerated the move from leaded to lead-free solders. However, these materials are relatively new - design data and long-term experience is lacking.
This data module of approximately 350 lead-free and lead-based solder materials is the most important publicly available repository of lead-free solder properties. Some intermetallics and pure metals are also included.
Properties listed include composition, economics, standard mechanical, electrical, and thermal data, manufacturability, wetting, and test results on fracture, plastic rupture and deformation, creep rupture and deformation, and fatigue. There are up to 40 property attributes per material.The principal data source is: “Properties of Lead-Free Solders” by Sieward, Liu, Smith & Madeni (National Institute of Standards and Technology and Colorado School of Mines) v4.0 (2002). Additionally, NIST test data for fatigue and rupture properties have also been included.
The data module contains links to the references mentioned in this paper. No attempt has been made to fill "holes" in this data or to normalize properties.