Copper alloys are important candidate materials for the life extension extending the life of the currently used elastic-conductor materials.TEM observations illuminated showed that δ-Ni2Si, β-Ni3Si, β-NiAl, and γ’-Ni3Al were formed, which was subjected to different annealing at different temperatures. ; and a detailed diagram for isothermal decompositions has been established. 3DAP collections revealed that Ni, Si, and Al were precipitated as clusters, while Cr and Mg elements were evenly distributed in the annealed sample. The high strength of the studied alloy was attributed to the solid solution strengthening, Orowan precipitation strengthening, Hall-Petch type grain boundary strengthening, and work hardening. Multi- precipitation phases played significantly into the strengthening effects, and the low electron diffraction influence of Mg and Cr contributed to a high electrical conductivity. Multi-phase precipitation strengthening and using many multi-alloying elements for solution strengthening may be a new method to develop high strength and high electrical conductivity copper alloys.