Using Solder Fountains
- Death of a Battery. Munson, Terry // Circuits Assembly;Nov2001, Vol. 12 Issue 11, p61
Focuses on hand soldering process. Causes of faults in the soldered product; Usage of weal organic acids as fluxes; Appropriate amount of flux to be used in soldering.
- Concerned About Stencil Life? Hymes, Les // Circuits Assembly;Jan2003, Vol. 14 Issue 1, p20
Presents guidelines for determining the estimated lifetime of solder paste stencils. Causes of damage of the stencils; Tips on cleaning of the stencils.
- A Manufacturable Lead-Free Surface-Mount Process? Bath, Jasbir // Circuits Assembly;Jan2003, Vol. 14 Issue 1, p26
Focuses on Lead-Free Assembly Project launched by the National Electronics Manufacturing Initiative. Possible demonstration of the manufacturing process with soldering; Reliability of the lead-free solder paste; Techniques used in evaluation of the manufacturing process.
- Solder Sphere Size. HUNT, CHRIS // Printed Circuit Design & Fab: Circuits Assembly;Mar2012, Vol. 29 Issue 3, p39
The article stresses the importance of running simple trials on the solder paste product used or under evaluation in order to maintain solder consistency and avoid improperly sized spherical particles that cause print defects.
- Peeling Back Graping. HUNT, CHRIS // Printed Circuit Design & Fab: Circuits Assembly;Sep2014, Vol. 31 Issue 9, p51
The article discusses the usefulness of viewing parts of a solder paste deposit after placement to check reflow profile for defects.
- Solder Paste Powder: When to Downsize. O'NEILL, TIM; SEELIG, KARL // Printed Circuit Design & Fab: Circuits Assembly;Jun2015, Vol. 32 Issue 6, p37
The article offers step-by-step instructions on when and how to downsize solder paste powder use in the solder powder manufacturing process.
- Reflow Atmospheres in the Lead-Free Era. Mackie, Andy C. // Circuits Assembly;Mar2003, Vol. 14 Issue 3, p26
Examines effects of several process variables on lead free solder pastes. Need for a consistent joint quality across a printed circuit board (PCB) in implementation of lead-free assembly; Four variables that were tested in the examination of damage sensitivity; Two factors that limit maximum...
- Hot and Cold. HUNT, CHRIS // Printed Circuit Design & Fab: Circuits Assembly;Jan2012, Vol. 29 Issue 1, p49
The author reflects on the factors that can cause solder paste slump in electronic machines and suggests tips on how to resolve the problem.
- Copper Dissolution in Tin. Turbini, Laura J. // SMT: Surface Mount Technology;Feb2007, Vol. 21 Issue 2, p8
The article reflects on substitution of lead solders with tin concentrated solders that require high processing temperatures. It observes that in the lead-free solders, the percentage of tin is almost 95 to 99% and at such high tin concentration, the amount of copper diffuses into the solder...