Thermal problems can be specifically analyzed and remedied with different solutions.
With a PSpice simulation, components can be dimensioned (derating) so that they do not overheat.
Temperature increase due to voltage drop on printed circuit boards (IR drop) indicates weak points in the layout to the designer.
Concepts for cooling can be developed and refined concurrently with the design. Verification by CFD analysis of the entire system provides sign-off quality results.
The stress analysis is jokingly called Smoke Analysis, because if there is too much stress, the components "smoke up" due to thermal overload. With this simulation, the maximum de-rating of components can be determined and thus a statement can be made about the component load. The load can be specified as a percentage via the model parameters. The developer is interested in statements about the types of load: thermal at maximum current and highest possible voltage, line of the junction temperature in °C or the thermal contact resistances JC and JA, as shown in occur in the circuit.
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If current travels through a metal with a resistance, there will be a voltage drop. This effect is described by ohms law and is called on PCBs: IR-Drop. In this in-design analysis the resistance of pcb traces and planes will be calculated by a field solver. The results of this simulation, voltage drop, current and current density can be displayed in tables or as color overlays in the design. All this provides valuable information for the PCB designer to improve the design and avoid current hotspots.
Benefits: Stable supply voltage and less thermal issues. Whitepaper IR-Drop
Celsius Thermal Solver seamlessly integrates with Cadence IC, package, and Allegro PCB platforms. Fast and accurate parallel simulation enables new system analysis and design insights and empowers electrical design teams to detect and mitigate thermal issues early in the design process - reducing electronic system development iterations. Engineers can combine Cadence Celsius and Sigrity in an accurate electrical and thermal co-simulation (steady-state and transient) system-level thermal simulation for PCB and IC-Packaging based on the actual flow of electrical power.
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