  A photogrammetric method of stress analysis has been developed to test thin,
nonstandard windows designed for hydrogen absorbers, major components of a muon
cooling channel. The purpose of the absorber window tests is to demonstrate an
understanding of the window behavior and strength as a function of applied
pressure. This is done by comparing the deformation of the window, measured via
photogrammetry, to the deformation predicted by finite element analysis (FEA).
FEA analyses indicate a strong sensitivity of strain to the window thickness.
Photogrammetric methods were chosen to measure the thickness of the window,
thus providing data that are more accurate to the FEA. This, plus improvements
made in hardware and testing procedures, resulted in a precision of 5 microns
in all dimensions and substantial agreement with FEA predictions.
