  Solid-state cooling devices offer compact, quiet, reliable and
environmentally friendly solutions that currently rely primarily on the
thermoelectric (TE) effect. Despite more than two centuries of research,
classical thermoelectric coolers suffer from low efficiency which hampers wider
application. In this study, the less researched Anomalous Ettingshausen effect
(AEE), a transverse thermoelectric phenomenon, is presented as a new approach
for on-chip cooling. This effect can be boosted in materials with non-trivial
band topologies as demonstrated in the Heusler alloy $\text{Co}_2\text{MnGa}$.
Enabled by the high quality of our material, in situ scanning thermal
microscopy experiments reveal a record-breaking anomalous Ettingshausen
coefficient of $-2.1$~mV in $\mu$m-sized on-chip cooling devices at room
temperature. A significant 44\% of the effect is contributed by the intrinsic
topological properties, in particular the Berry curvature of
$\text{Co}_2\text{MnGa}$, emphasising the unique potential of magnetic Weyl
semimetals for high-performance spot cooling in nanostructures.
