  The room temperature liquid metal related electronics has been found
important in a wide variety of emerging areas over the past few years. However,
its failure features under high electrical current densities are not clear
until now. Here we show that a liquid metal thin film would break-up as the
applied current increases to a critical magnitude. The break-up phenomenon is
attributed to be caused by the so-called electromigration effect. This problem
could be one of the major hurdles that must be tackled with caution in the
research and application of future liquid metal film electronics.
