  Exploring the mechanism of interfacial thermal transport and reducing the
interfacial thermal resistance is of great importance for thermal management
and modulation. Herein, the interfacial thermal resistance between overlapped
graphene nanoribbons is largely reduced by adding bonded carbon chains by
performing molecular dynamics simulations. And the analytical model
(cross-interface model, CIM) is utilized to analyze and explain the
two-dimensional thermal transport mechanism at cross-interface. An order of
magnitude reduction in interfacial thermal resistance is found as the graphene
nanoribbons are bonded by just one carbon chain. Interestingly, the decreasing
rate of interfacial thermal resistance slows down gradually with the increasing
of the number of carbon chains, which can be explained by the proposed
theoretical relationship based on CIM. Moreover, by the comparison of CIM and
traditional simplified model, the accuracy of CIM is verified and demonstrated
in overlapped graphene nanoribbons. This work provides a new way to improve the
interfacial thermal transport and reveal the essential mechanism for
low-dimensional materials applied in thermal management.
