  Although 3D IC technology can provide very high integration density, they
suffer from having hotspots that may reach thousands of degrees. To manage this
heat, it is necessary to study the dynamics of cooling and thermal behavior of
the ICs. In this study, we report on the dynamics of microchannel liquid
cooling using water, R22, and liquid nitrogen. The study shows that using
diamond cooling blocks ensures normal operating temperature of 60 degrees
centigrade or less, using any of the above coolants. Using SiO2 blocks, only
liquid nitrogen can provide acceptable operating temperatures. The study shows
also that liquid latent energy and inlet velocity play a major role in the
cooling dynamics.
