  In view of the LHC upgrade phases towards HL-LHC, the ATLAS experiment plans
to upgrade the Inner Detector with an all-silicon system. The n-on-p silicon
technology is a promising candidate for the pixel upgrade thanks to its
radiation hardness and cost effectiveness, that allow for enlarging the area
instrumented with pixel detectors. We report on the development of novel n-in-p
edgeless planar pixel sensors fabricated at FBK (Trento, Italy), making use of
the "active edge" concept for the reduction of the dead area at the periphery
of the device. After discussing the sensor technology and fabrication process,
we present device simulations (pre- and post-irradiation) performed for
different sensor configurations. First preliminary results obtained with the
test-structures of the production are shown.
