  Quantum processing units will be modules of larger information processing
systems containing also digital and analog electronics modules. Silicon-based
quantum computing offers the enticing opportunity to manufacture all the
modules using the same technology platform. Here, we present a cryogenic
multi-module assembly for multiplexed readout of silicon quantum devices where
all modules have been fabricated using the same fully-depleted
silicon-on-insulator (FDSOI) CMOS process. The assembly is constituted by three
chiplets: (i) a low-noise amplifier (LNA), (ii) a single-pole eight-throw
switch (SP8T), and (iii) a silicon quantum dot (QD) array. We characterise each
module individually and show (i) a gain over 35 dB, a bandwidth of 118 MHz, a
minimum noise temperature of 4.2 K, (ii) an insertion loss smaller than 1.1 dB,
a noise temperature smaller than 1.1~K across 0-2 GHz, and (iii)
single-electron box (SEB) charge sensors. Finally, we combine all elements into
a single demonstration showing time-domain radio-frequency multiplexing of two
SEBs paving the way to an all-silicon quantum computing system.
