  High power light emitting diodes (LEDs) suffer from heating effects that have
a detrimental impact on the devices characteristics. The use LED carriers with
high thermal conductivity promotes the extraction of heat away from the LED
junction. Different materials can be used for this purpose, such as alumina,
aluminium nitride, and silicon. Diamond has also been gaining momentum for
demanding heat management applications. In order to evaluate the impact of the
different carriers on the reliability of the devices, the junction temperature
of Cree white Xamp XB-D LEDs was obtained with Ansys for various carrier at
different LED current levels. The impact of the junction temperature on the
LEDs lifetime, emission intensity, footprint and wavelength stability was then
evaluated for each carrier based on the datasheet of the devices. The results
provide additional knowledge regarding the impact of the carrier on the
performance of the LED.
