  A new approach for determining effective mechanical bondline properties using
a combined experimental-numerical modal analysis technique is proposed. After
characterizing clear spruce wood boards, an adhesive layer is applied to the
boards surfaces. The shift of the eigenfrequencies resulting from the adhesive
layer together with information on the bondline geometry can then be used to
inversely determine the mechanical properties of the adhesive layer using
Finite Element Models. The calculated values for clear wood as well as for the
adhesive layer lie within reasonable ranges, thus demonstrating the methods
potential.
