  This work describes the architecture and implementation of a high-data-rate,
energy-efficient millimeter-wave (mm-wave) waveguide solution for integration
inside an Integrated Circuit (IC) package. The complete waveguide solution
(together with couplers) has been designed to fit into the tight dimensional
requirements of a wafer bonded 3D package and provides an extremely wide
bandwidth in the mm-wave spectrum. To achieve this, we investigate the use of
new high-permittivity materials. To be able to fulfill the data-rate demands of
modern System-in-Packages (SiPs), Monolithic Microwave Integrated
Circuits(MMICs) and integrated high performance analog ICs together with
Digital Signal Processing (DSP), our solution is inherently scalable and
adaptable in several ways. The work is novel and also discusses the various
opportunities and challenges associated with the solution.
