  In this work we study the role of the heat diffusion equation in simulating
the resistive state of superconducting films. By analyzing the current-voltage
and current-resistance characteristic curves for temperatures close to $T_c$
and various heat removal scenarios, we demonstrate that heat diffusion notably
influences the behavior of the resistive state, specially near the transition
to the normal state, where heat significantly changes the critical current and
the calculated resistance. Furthermore, we show how the efficiency of the
substrate has important effects in the dynamics of the system, particularly for
lower temperatures. Finally, we investigate the hysteresis loops, the role of
the film thickness and of the Ginzburg-Landau parameter, the findings
accounting for heat diffusion in accurately modeling the resistive state of
superconducting films and provide valuable insights into its complex dynamics.
To accomplish these findings, we have used the $3D$ generalized Ginzburg-Landau
equation coupled with the heat diffusion equation.
