  Issues of morphology, nucleation and growth of Ge cluster arrays deposited by
ultrahigh vacuum molecular beam epitaxy on the Si(001) surface are considered.
Difference in nucleation of quantum dots during Ge deposition at low (<600 deg
C) and high (>600 deg. C) temperatures is studied by high resolution scanning
tunneling microscopy. The atomic models of growth of both species of Ge
huts---pyramids and wedges---are proposed. The growth cycle of Ge QD arrays at
low temperatures is explored. A problem of lowering of the array formation
temperature is discussed with the focus on CMOS compatibility of the entire
process; a special attention is paid upon approaches to reduction of treatment
temperature during the Si(001) surface pre-growth cleaning, which is at once a
key and the highest-temperature phase of the Ge/Si(001) quantum dot dense array
formation process. The temperature of the Si clean surface preparation, the
final high-temperature step of which is, as a rule, carried out directly in the
MBE chamber just before the structure deposition, determines the compatibility
of formation process of Ge-QD-array based devices with the CMOS manufacturing
cycle. Silicon surface hydrogenation at the final stage of its wet chemical
etching during the preliminary cleaning is proposed as a possible way of
efficient reduction of the Si wafer pre-growth annealing temperature.
