  In the electronic packaging and energy storage sectors, the study of Cu6Sn5
intermetallic compound (IMC) is getting more attention. At temperatures above
186 oC, this IMC exists in a hexagonal closed packed (HCP) crystalline
structure. Crystal plasticity finite element simulations are performed on
Cu6Sn5 IMC by taking the information about its lattice parameters and direction
dependent elastic properties. Three types of models corresponding to
deformations in basal, prismatic and pyramidal modes are developed. With the
same type of loading in the elastic regime and boundary conditions, the results
of the computations reveal the differences in displacement magnitudes among the
three model types.
