  Josephson tunnel junctions are the centerpiece of almost any superconducting
electronic circuit, including qubits. Typically, the junctions for qubits are
fabricated using shadow evaporation techniques to reduce dielectric loss
contributions from the superconducting film interfaces. In recent years,
however, sub-micron scale overlap junctions have started to attract attention.
Compared to shadow mask techniques, neither an angle dependent deposition nor
free-standing bridges or overlaps are needed, which are significant limitations
for wafer-scale processing. This comes at the cost of breaking the vacuum
during fabrication, but simplifies integration in multi-layered circuits,
implementation of vastly different junction sizes, and enables fabrication on a
larger scale in an industrially-standardized process. In this work, we
demonstrate the feasibility of a subtractive process for fabrication of overlap
junctions. In an array of test contacts, we find low aging of the average
normal state resistance of only 1.6\% over 6 months. We evaluate the coherence
properties of the junctions by employing them in superconducting transmon
qubits. In time domain experiments, we find that both, the qubit life- and
coherence time of our best device, are on average greater than
$20\,\si{\micro\second}$. Finally, we discuss potential improvements to our
technique. This work paves the way towards a more standardized process flow
with advanced materials and growth processes, and constitutes an important step
for large scale fabrication of superconducting quantum circuits.
