  The Phase-II upgrade of the ATLAS detector for the High Luminosity Large
Hadron Collider (HL-LHC) includes the replacement of the current Inner Detector
with an all-silicon tracker consisting of pixel and strip detectors. The
current Phase-II detector layout requires the construction of 20,000 strip
detector modules consisting of sensor, circuit boards and readout chips, which
are connected mechanically using adhesives. The adhesive between readout chips
and circuit board is a silver epoxy glue as was used in the current ATLAS
SemiConductor Tracker (SCT). This glue has several disadvantages, which
motivated the search for an alternative.
  This paper presents a study concerning the use of six ultra-violet (UV) cure
glues and a glue pad for use in the assembly of silicon strip detector modules
for the ATLAS upgrade. Trials were carried out to determine the ease of use,
the thermal conduction and shear strength, thermal cycling, radiation hardness,
corrosion resistance and shear strength tests. These investigations led to the
exclusion of three UV cure glues as well as the glue pad.
  Three UV cure glues were found to be possible better alternatives. Results
from electrical tests of first prototype modules constructed using these glues
are presented.
