  The present work illustrates a novel approach for the maskless and resistless
fabrication of nanopatterned metal layers on Si substrates, based on the
combination of nanomechanical surface modification techniques (such as
nanoindentation and nanoscratching) and electrodeposition. Single crystal (100)
n-doped Si substrates were first cleaned from native oxide. Nanoindentation and
nanoscratching were then used to locally change the substrate microstructure
and create regions with reduced electrical conductivity. The substrates were
finally mounted as cathode electrodes in a three electrode electrochemical cell
to potentiostatically deposit a Ni layer. Electrodeposition was prevented in
regions with modified microstructure, enabling the formation of a patterned Ni
layer. The fabrication of several patterns including continuous Ni lines of 200
nm width and several microns length was obtained.
