  The recent advancements in electronics manufacturing has necessitated the
demand for miniaturization of electronic components. In particular, the product
sizes for passive components have evolved from 1005 (1.0x0.5mm) which is
roughly the size of a grain of sand to 0201 (0.25x0.125mm) which is 1/16th the
size of a grain of sand. Grain size distribution and composition play a vital
role in tailoring the demands for reliably shrinking dimension of passives. The
study focuses on analyzing the effect of grain size and composition, which
plays a significant role in maintaining high yield output during the
manufacturing processes. The objective of this study is to compare the grain
morphology and its effect on defect generation mechanism for 0201 resistors.
The experimental setup was prepared to evaluate the grain structure as per ASTM
E112-3 test standards. The 0201 resistor samples from three different vendors
were assembled on test vehicle PCB (Printed Circuit Board). The resulting
observations of the study showed that tombstoning defect was observed during
the reflow process for Vendor A. Scanning Electron Microscope (SEM) results
showed the presence of microstructural difference in the tin grain size of
resistors. The tin grain size for Vendor A was observed to be 2 microns,
whereas the grain size for Vendors B and C were 4 and 5 microns, respectively.
Furthermore, the results of grain size measurements performed using the
intercept method showed that a grain size number of 13 and 13.6 was observed
for Vendors B and C, whereas a grain size number of 15 was observed for Vendor
A. The second phase of the study focuses on techniques for improving the grain
size number to mitigate the tombstoning defect. It was observed that using an
alternate plating solution during the manufacturing of passives resulted in
decreased grain size number while containing the tombstoning issue.
