  Three-dimensional (3D)-stacking technology, which enables the integration of
DRAM and logic dies, offers high bandwidth and low energy consumption. This
technology also empowers new memory designs for executing tasks not
traditionally associated with memories. A practical 3D-stacked memory is Hybrid
Memory Cube (HMC), which provides significant access bandwidth and low power
consumption in a small area. Although several studies have taken advantage of
the novel architecture of HMC, its characteristics in terms of latency and
bandwidth or their correlation with temperature and power consumption have not
been fully explored. This paper is the first, to the best of our knowledge, to
characterize the thermal behavior of HMC in a real environment using the AC-510
accelerator and to identify temperature as a new limitation for this
state-of-the-art design space. Moreover, besides bandwidth studies, we
deconstruct factors that contribute to latency and reveal their sources for
high- and low-load accesses. The results of this paper demonstrates essential
behaviors and performance bottlenecks for future explorations of
packet-switched and 3D-stacked memories.
