  On the advent of the slow death of Moore's law, the silicon industry is
moving towards a new era of chiplets. The automotive industry is experiencing a
profound transformation towards software-defined vehicles, fueled by the
surging demand for automotive compute chips, expected to reach 20-22 billion by
2030. High-performance compute (HPC) chips become instrumental in meeting the
soaring demand for computational power. Various strategies, including
centralized electrical and electronic architecture and the innovative Chiplet
Systems, are under exploration. The latter, breaking down System-on-Chips
(SoCs) into functional units, offers unparalleled customization and integration
possibilities. The research accentuates the crucial open Chiplet ecosystem,
fostering collaboration and enhancing supply chain resilience. In this paper,
we address the unique challenges that arise when attempting to leverage
chiplet-based architecture to design a holistic silicon solution for the
automotive industry. We propose a throughput-oriented micro-architecture for
ADAS and infotainment systems alongside a novel methodology to evaluate chiplet
architectures. Further, we develop in-house simulation tools leveraging the
gem5 framework to simulate latency and throughput. Finally, we perform an
extensive design of thermally-aware chiplet placement and develop a
micro-fluids-based cooling design.
