  The influence of defects on electron transport in single-wall carbon nanotube
field effect transistors (CNFETs) is probed by combined scanning gate
microscopy (SGM) and scanning impedance microscopy (SIM). SGM reveals a
localized field effect at discrete defects along the CNFET length. The
depletion surface potential of individual defects is quantified from the
SGM-imaged radius of the defect as a function of tip bias voltage. This
provides a measure of the Fermi level at the defect with zero tip voltage,
which is as small as 20 meV for the strongest defects. The effect of defects on
transport is probed by SIM as a function of backgate and tip-gate voltage. When
the backgate voltage is set so the CNFET is "on" (conducting), SIM reveals a
uniform potential drop along its length, consistent with diffusive transport.
In contrast, when the CNFET is "off", potential steps develop at the position
of depleted defects. Finally, high-resolution imaging of a second set of weak
defects is achieved in a new "tip-gated" SIM mode.
