  Given the constant rise in utilizing embedded devices in daily life, side
channels remain a challenge to information flow control and security in such
systems. One such important security flaw could be exploited through
temperature side-channel attacks, where heat dissipation and propagation from
the processing elements are observed over time in order to deduce security
flaws. In our proposed methodology, DATE: Defense Against TEmperature
side-channel attacks, we propose a novel approach of reducing spatial and
temporal thermal gradient, which makes the system more secure against
temperature side-channel attacks, and at the same time increases the
reliability of the device in terms of lifespan. In this paper, we have also
introduced a new metric, Thermal-Security-in-Multi-Processors (TSMP), which is
capable of quantifying the security against temperature side-channel attacks on
computing systems, and DATE is evaluated to be 139.24% more secure at the most
for certain applications than the state-of-the-art, while reducing thermal
cycle by 67.42% at the most.
