  Vertical cavity surface emitting lasers (VCSELs) have made indispensable
contributions to the development of modern optoelectronic technologies.
However, arbitrary beam shaping of VCSELs within a compact system still remains
inaccessible till now. The emerging ultra-thin flat optical structures, namely
metasurfaces, offer a powerful technique to manipulate electromagnetic fields
with subwavelength spatial resolution. Here, we show that the monolithic
integration of dielectric metasurfaces with VCSELs enables remarkable arbitrary
control of the laser beam profiles, including self-collimation, Bessel and
Vortex lasers, with high efficiency. Such wafer-level integration of
metasurface through VCSELs-compatible technology simplifies the assembling
process and preserves the high performance of the VCSELs. We envision that our
approach can be implemented in various wide-field applications, such as optical
fibre communications, laser printing, smartphones, optical sensing, face
recognition, directional displays and ultra-compact light detection and ranging
(LiDAR).
