  Acquiring a portable high density charged particles trap might consist of an
array of micro-Penning-Malmberg traps (microtraps) with substantially lower end
barriers potential than conventional Penning-Malmberg traps [1]. We report on
the progress of the fabrication of these microtraps designed for antimatter
storage such as positrons. The fabrication of large length to radius aspect
ratio (1000:1) microtrap arrays involved advanced techniques including
photolithography, deep reactive ion etching (DRIE) of silicon wafers to achieve
through-vias, gold sputtering of the wafers on the surfaces and inside the
vias, and thermal compression bonding of the wafers. This paper describes the
encountered issues during fabrication and addresses geometry errors and
asymmetries. In order to minimize the patch effects on the lifetime of the
trapped positrons, the bonded stacks were gold electroplated to achieve a
uniform gold surface. We show by simulation and analytical calculation that how
positrons confinement time depends on trap imperfections.
