  A procedure and optical concept is introduced for ultrashort pulsed laser
cleaving of transparent materials with tailored edges in a single pass. The
procedure is based on holographically splitting a number of foci along the
desired edge geometry including C-shaped edges with local 45{\deg} tangential
angles to the surface. Single-pass, full thickness laser modifications are
achieved requiring single-side access to the workpiece only without inclining
the optical head. After having induced laser modifications with feed rates of 1
m/s actual separation is performed using a selective etching strategy.
