  This paper reports an effective method of stabilizing ultrathin Silver (Ag)
films on substrates using a filler metal (Zn). Ag films with a thickness < 15
nm were deposited by DC magnetron sputtering above a Zn filler metal on glass,
quartz, silicon and PET (polyethylene terephthalate) substrates. Zinc is
expected to partially or fully fill the roughness associated with the
substrates. The Zn filler material and ultrathin Ag film form a 3-D augmented
atomically chemically graded interface. 3-D interfaces have smoothly varying
chemistry. The ability of Zn to partially or fully fill the substrate roughness
improves the adhesion of Zn along with the Ag to the substrate. Also, Zn acts
as a barrier layer against the diffusion of Ag into the substrate. This
technique leads to ultrathin Ag films with low sheet resistance (~ 3
{\Omega}/Sq.), low mean absolute surface roughness (~1 nm), good optical
transparency (~ 65 %), better stability and compatibility with the environment.
The results indicate significant potential for applying stable ultrathin Ag
film/electrode as a practical and economically feasible design solution for
optoelectronic (transparent and conductive electrodes for solar cells and LEDs)
and plasmonic devices. This film shows good conductivity, transparency,
stability, and flexibility.
