  Thin film 4H-silicon carbide (4H-SiC) is emerging as a contender for
realizing large-scale optical quantum circuits due to its high CMOS technology
compatibility and large optical nonlinearities. Though, challenges remain in
producing wafer-scale 4H-SiC thin film on insulator (4H-SiCOI) for dense
integration of photonic circuits, and in efficient coupling of deterministic
quantum emitters that are essential for scalable quantum photonics. Here we
demonstrate hybrid integration of self-assembled InGaAs quantum dots (QDs)
based single-photon sources (SPSs) with wafer-scale 4H-SiC photonic chips
prepared by ion slicing technique. By designing a bilayer vertical coupler, we
realize generation and highly efficient routing of single-photon emission in
the hybrid quantum photonic chip. Furthermore, we realize a chip-integrated
beamsplitter operation for triggered single photons through fabricating a 1x2
multi-mode interferometer (MMI) with a symmetric power splitting ratio of
50:50. The successful demonstration of heterogeneously integrating QDs-based
SPSs on 4H-SiC photonic chip prepared by ion slicing technique constitutes an
important step toward CMOS-compatible, fast reconfigurable quantum photonic
circuits with deterministic SPSs.
