  We present a method of embedding a Monolithic Active Pixel Sensor (MAPS) into
a flexible printed circuit board (FPC) and its interconnection by means of
through-hole copper plating. The resulting assembly, baptised "MAPS foil", is a
flexible, light, protected, and fully integrated detector module. By using
widely available printed circuit board manufacturing techniques, the production
of these devices can be scaled easily in size and volume, making it a
compelling candidate for future large-scale applications.
  A first series of prototypes that embed the ALPIDE chip has been produced,
functionally tested, and shown to be working.
