  We demonstrate active embedded microfluidic cooling in $\beta$-Ga$_2$O$_3$.
We employ a cost-effective infra-red laser etch setup to achieve controlled
etching of micro-channels in 500 um thick $\beta$-Ga$_2$O$_3$ substrate. The
micro-channels are about 210 um deep and 340 um wide. Resistive heating is used
as proof-of-concept. At a water flow rate of 50 ml/min, a 50% reduction in
surface temperature from ~140$^\circ$C to ~72$^\circ$C is achieved for 3.5 W of
input power. The experimental observations are backed by thermal simulation.
This work is expected to lead to a new paradigm in thermal management in
emerging $\beta$-Ga$_2$O$_3$ devices.
