  We generalize the conditions for stable electrodeposition at isotropic
solid-solid interfaces using a kinetic model which incorporates the effects of
stresses and surface tension at the interface. We develop a stability diagram
that shows two regimes of stability: previously known pressure-driven mechanism
and a new density-driven stability mechanism that is governed by the relative
density of metal in the two phases. We show that inorganic solids and solid
polymers generally do not lead to stable electrodeposition, and provide design
guidelines for achieving stable electrodeposition.
