  Wafer-level performance prediction has been attracting attention to reduce
measurement costs without compromising test quality in production tests.
Although several efficient methods have been proposed, the site-to-site
variation, which is often observed in multi-site testing for radio frequency
circuits, has not yet been sufficiently addressed. In this paper, we propose a
wafer-level performance prediction method for multi-site testing that can
consider the site-to-site variation. The proposed method is based on the
Gaussian process, which is widely used for wafer-level spatial correlation
modeling, improving the prediction accuracy by extending hierarchical modeling
to exploit the test site information provided by test engineers. In addition,
we propose an active test-site sampling method to maximize measurement cost
reduction. Through experiments using industrial production test data, we
demonstrate that the proposed method can reduce the estimation error to 1/19 of
that obtained using a conventional method. Moreover, we demonstrate that the
proposed sampling method can reduce the number of the measurements by 97% while
achieving sufficient estimation accuracy.
