  3D integration, i.e., stacking of integrated circuit layers using parallel or
sequential processing is gaining rapid industry adoption with the slowdown of
Moore's law scaling. 3D stacking promises potential gains in performance, power
and cost but the actual magnitude of gains varies depending on end-application,
technology choices and design. In this talk, we will discuss some key
challenges associated with 3D design and how design-for-3D will require us to
break traditional silos of micro-architecture, circuit/physical design and
manufacturing technology to work across abstractions to enable the gains
promised by 3D technologies.
