  We report on the dielectric degradation of Rare-Earth Oxides (REOs), when
used as interfacial buffer layers together with HfO2 high-k films (REOs/HfO2)
on high mobility Ge substrates. Metal-Oxide-Semiconductor (MOS) devices with
these stacks,show dissimilar charge trapping phenomena under varying levels of
Constant- Voltage-Stress (CVS) conditions, which also influences the measured
densities of the interface (Nit) and border (NBT) traps. In the present study
we also report on C-Vg hysteresis curves related to Nit and NBT. We also
propose a new model based on Maxwell-Wagner instabilities mechanism that
explains the dielectric degradations (current decay transient behavior) of the
gate stack devices grown on high mobility substrates under CVS bias from low to
higher fields, and which is unlike to those used for other MOS devices.
Finally, the time dependent degradation of the corresponding devices revealed
an initial current decay due to relaxation, followed by charge trapping and
generation of stress-induced leakage which eventually lead to hard breakdown
after long CVS stressing.
