  The readout electronics of a Micromegas (MM) module consume nearly 26 W of
electric power, which causes the temperature of electronic board to increase
upto $70\,^{\circ}{\rm C}$. Increase in temperature results in damage of
electronics. Development of temperature gradient in the Time Projection Chamber
(TPC) may affect precise measurement as well. Two-phase CO$_2$ cooling has been
applied to remove heat from the MM modules during two test beam experiments at
DESY, Hamburg. Following the experimental procedure, a comprehensive study of
the cooling technique has been accomplished for a single MM module by means of
numerical simulation. This paper is focused to discuss the application of
two-phase CO$_2$ cooling to keep the temperature below $30\,^{\circ}{\rm C}$
and stabilized within $0.2\,^{\circ}{\rm C}$.
