  We review the current state of the art of graphene-enhanced thermal interface
materials for the management of heat the next generation of electronics.
Increased integration densities, speed, and power of electronic and
optoelectronic devices require thermal interface materials with substantially
higher thermal conductivity, improved reliability, and lower cost. Graphene has
emerged as a promising filler material that can meet the demands of future
high-speed and high-powered electronics. This review describes the use of
graphene as a filler in curing and non-curing polymer matrices. Special
attention is given to strategies for achieving the thermal percolation
threshold with its corresponding characteristic increase in the overall thermal
conductivity. Many applications require high thermal conductivity of the
composites while simultaneously preserving electrical insulation. A hybrid
filler -- graphene and boron nitride -- approach is presented as possible
technology for independent control of electrical and thermal conduction.
Reliability and lifespan performance of thermal interface materials is an
important consideration towards the determination of appropriate practical
applications. The present review addresses these issues in detail,
demonstrating the promise of the graphene-enhanced thermal interface materials
as compared to alternative technologies.
