  Microfabricated ion-trap devices offer a promising pathway towards scalable
quantum computing. Research efforts have begun to focus on the engineering
challenges associated with developing large-scale ion-trap arrays and networks.
However, increasing the size of the array and integrating on-chip electronics
can drastically increase the power dissipation within the ion-trap chips. This
leads to an increase in the operating temperature of the ion-trap and limits
the device performance. Therefore, effective thermal management is an essential
consideration for any large-scale architecture. Presented here is the
development of a modular cooling system designed for use with multiple
ion-trapping experiments simultaneously. The system includes an extensible
cryostat that permits scaling of the cooling power to meet the demands of a
large network. Following experimental testing on two independent ion-trap
experiments, the cooling system is expected to deliver a net cooling power of
111 W at ~70 K to up to four experiments. The cooling system is a step towards
meeting the practical challenges of operating large-scale quantum computers
with many qubits.
