  A new cryogenic packaging methodology that is widely applicable to packaging
any integrated photonics circuit for operation at both room temperature and
cryogenic temperature is reported. The method requires only equipment and
techniques available in any integrated optics lab and works on standard
integrated photonic chips. Our methodology is then used to enable the
measurement of a single photon pair sourced based on a silicon ring resonator
at cryogenic temperatures. When operating at 5.9 K, this source is measured to
have a peak pair generation rate 183 times greater then at room temperature in
the CL-band.
