  Wireless Network-on-Chip (WNoC) appears as a promising alternative to
conventional interconnect fabrics for chip-scale communications. The WNoC
paradigm has been extensively analyzed from the physical, network and
architecture perspectives assuming mmWave band operation. However, there has
not been a comprehensive study at this band for realistic chip packages and,
thus, the characteristics of such wireless channel remain not fully understood.
This work addresses this issue by accurately modeling a flip-chip package and
investigating the wave propagation inside it. Through parametric studies, a
locally optimal configuration for 60 GHz WNoC is obtained, showing that
chip-wide attenuation below 32.6 dB could be achieved with standard processes.
Finally, the applicability of the methodology is discussed for higher bands and
other integrated environments such as a Software-Defined Metamaterial (SDM).
