  The application of low-dimensional materials for heat dissipation requires a
comprehensive understanding of the thermal transport at the cross interface,
which widely exists in various composite materials and electronic devices. In
this work, we proposed an analytical model, named as cross interface model
(CIM), to accurately reveal the essential mechanism of the two-dimensional
thermal transport at the cross interface. The applicability of CIM is validated
through the comparison of the analytical results with molecular dynamics
simulations for a typical cross interface of two overlapped boron nitride
nanoribbons. Besides, it is figured out that the factor ({\eta}) has important
influence on the thermal transport besides the thermal resistance inside and
between the materials, which is found to be determined by two dimensionless
parameters from its expression. Our investigations deepen the understanding of
the thermal transport at the cross interface and also facilitate to guide the
applications of low-dimensional materials in thermal management.
