  Pixel Array Detectors (PADs) consist of an x-ray sensor layer bonded
pixel-by-pixel to an underlying readout chip. This approach allows both the
sensor and the custom pixel electronics to be tailored independently to best
match the x-ray imaging requirements. Here we present characterizations of CdTe
sensors hybridized with two different charge-integrating readout chips, the
Keck PAD and the Mixed-Mode PAD (MM-PAD), both developed previously in our
laboratory. The charge-integrating architecture of each of these PADs extends
the instantaneous counting rate by many orders of magnitude beyond that
obtainable with photon counting architectures. The Keck PAD chip consists of
rapid, 8-frame, in-pixel storage elements with framing periods $<$150 ns. The
second detector, the MM-PAD, has an extended dynamic range by utilizing an
in-pixel overflow counter coupled with charge removal circuitry activated at
each overflow. This allows the recording of signals from the single-photon
level to tens of millions of x-rays/pixel/frame while framing at 1 kHz. Both
detector chips consist of a 128$\times$128 pixel array with (150 $\mu$m)$^2$
pixels.
