  Pt/Ti metallisation bilayers are used as bottom electrodes for ferroelectric
thin films. During deposition of the ferroelectric films, these electrodes are
exposed to elevated temperatures causing modifications of the Pt/Ti bottom
electrode. Diffusion and oxidation of the Ti adhesion layer have been studied
by the application of factor analysis to AES depth profile data and by RBS.
Factor analysis was employed to extract the chemical information from the
measured AES spectra and to derive semiquantitative depth profiles of the
identified material compounds. RBS was used to obtain the quantitative depth
distribution of the elements. By the combination of both methods, diffusion and
oxidation processes were observed and could be precisely describe.
