  The large physical size of superconducting qubits and their associated
on-chip control structures presents a practical challenge towards building a
large-scale quantum computer. In particular, transmons require a
high-quality-factor shunting capacitance that is typically achieved by using a
large coplanar capacitor. Other components, such as superconducting microwave
resonators used for qubit state readout, are typically constructed from
coplanar waveguides which are millimeters in length. Here we use compact
superconducting through-silicon vias to realize lumped element capacitors in
both qubits and readout resonators to significantly reduce the on-chip
footprint of both of these circuit elements. We measure two types of devices to
show that TSVs are of sufficient quality to be used as capacitive circuit
elements and provide a significant reductions in size over existing approaches.
