  Strip and pixels sensors, fabricated on high resistivity silicon substrate,
normally of p-type, are used in detectors for High Energy Physics (HEP)
typically in a hybrid detector assembly. Furthermore, and owing to their
inherent advantages over hybrid sensors, Monolithic Active Pixel Sensors (MAPS)
fabricated in CMOS technology have been increasingly implemented in HEP
experiments. In all cases, their use in higher radiation areas (HL-LHC and
beyond) will require options to improve their radiation hardness and time
resolution. These aspects demand a deep understanding of their radiation damage
and reliable models to predict their behaviours at high fluences. As a first
step, we fabricated several Schottky and n-on-p diodes, to allow a comparison
of results and provide a backup solution for test devices, on 6 or 4-inch
p-type silicon wafers with 50 {\mu}m epitaxial thickness and of doping
concentration as they are normally used in HEP detectors and CMOS MAPS devices.
In this paper, details of the design and fabrication process, along with test
results of the fabricated devices before irradiation, will be provided.
Additional test results on irradiated devices will be provided in subsequent
publications.
