  We present a general transfer method for the heterogeneous integration of
different photonic and electronic materials systems and devices onto a single
substrate. Called BLAST, for Bond, Lift, Align, and Slide Transfer, the process
works at wafer scale and offers precision alignment, high yield, varying
topographies, and suitability for subsequent lithographic processing. We
demonstrate BLAST's capabilities by integrating both GaAs and GaN microLEDs
with silicon photovoltaics to fabricate optical wireless integrated circuits
that up-convert photons from the red to the blue. We also show that BLAST can
be applied to a variety of other devices and substrates, including CMOS
electronics, vertical cavity surface emitting lasers (VCSELs), and 2D
materials. BLAST further enables the modularization of optoelectronic
microsystems, where optical devices fabricated on one material substrate can be
lithographically integrated with electronic devices on a different substrate in
a scalable process.
