  Recent advances in nanotechnology have provided new materials which have the
potential to surpass copper and aluminum alloys in electrical conductivity,
weight and ampacity [2-6]. Among these carbon nanotubes (CNTs) stand out due to
their remarkable thermal and electrical conductivity and ampacity (103 times of
copper), low density, abundance of precursor materials and supreme mechanical
properties. However, making these materials into a continuous fiber or
macrostructures has remained the main obstacle. A promising approach to tackle
this issue is employing CNTs as nanofillers in copper matrixes. Subramaniam et
al. [5] combined several simple fabrication to produce high density CNT (45
vol%)-Cu composite films with specific conductivity 26% greater than copper.
These results show that by improving the interfacial interactions between the
CNTs and the copper matrix strong and highly conductive nanocomposites can be
made. In this research continuous CNT-Cu nanocomposite is produced using
electrospinning method. For improving the interfacial interaction the surface
of the CNTs were first coated with a thin layer of copper using electroless
deposition methods (the process is explained in details in [7]).
