  In the context of the ATHENA X-IFU Cryogenic AntiCoincidence Detector
(CryoAC) development, we have studied the thermalization properties of a 2mm x
2mm SQUID chip. The chip is glued on a front-end PCB and operated on the cold
stage of a dilution refrigerator (TBASE < 20 mK). We performed thermal
conductance measurements by using different materials to glue the SQUID chip on
the PCB. These have been repeated in subsequent cryostat runs, to highlight
degradation effects due to thermal cycles. Here, we present the results
obtained by glues and greases widely used in cryogenic environments, i.e. GE
7031 Varnish Glue, Apiezon N Grease and Rubber Cement.
