  Nb/Al_2O_3/Ni_{0.6}Cu_{0.4}/Nb based
superconductor-insulator-ferromagnet-superconductor (SIFS) Josephson tunnel
junctions with a thickness step in the metallic ferromagnetic
\Ni_{0.6}\Cu_{0.4} interlayer were fabricated. The step was defined by optical
lithography and controlled etching. The step height is on the scale of a few
angstroms. Experimentally determined junction parameters by current-voltage
characteristics and Fraunhofer pattern indicate an uniform F-layer thickness
and the same interface transparencies for etched and non-etched F-layers. This
technique could be used to tailor low-T_c Josephson junctions having controlled
critical current densities at defined parts of the junction area, as needed for
tunable resonators, magnetic-field driven electronics or phase modulated
devices.
