  The performance of pixel modules built from 75 micrometer thin silicon
sensors and ATLAS read-out chips employing the Solid Liquid InterDiffusion
(SLID) interconnection technology is presented. This technology, developed by
the Fraunhofer EMFT, is a possible alternative to the standard bump-bonding. It
allows for stacking of different interconnected chip and sensor layers without
destroying the already formed bonds. In combination with Inter-Chip-Vias (ICVs)
this paves the way for vertical integration. Both technologies are combined in
a pixel module concept which is the basis for the modules discussed in this
paper.
  Mechanical and electrical parameters of pixel modules employing both SLID
interconnections and sensors of 75 micrometer thickness are covered. The
mechanical features discussed include the interconnection efficiency, alignment
precision and mechanical strength. The electrical properties comprise the
leakage currents, tuning characteristics, charge collection, cluster sizes and
hit efficiencies. Targeting at a usage at the high luminosity upgrade of the
LHC accelerator called HL-LHC, the results were obtained before and after
irradiation up to fluences of $10^{16}$
$\mathrm{n}_{\mathrm{eq}}/\mathrm{cm}^2$ (1 MeV neutrons).
