  At millimeter dimension or less, the conventional bonding technology in
electronic assembly relies heavily on reflow soldering and suffers from severe
performance and reliability degradation. Meanwhile, the traditional high
temperature bonding process (easily reach 220 oC) tends to result in undesired
thermal damage and residual stress at the bonding interface. It is therefore a
major challenge to find a means to preparing room-temperature connectors or
fasteners with good mechanical and electrical bonding. Very recently, composite
nanowire have been used to fabricate room-temperature fasteners. In this
chapter, we summarize the state-of-the-art progress on the use of composite
nanowires for room-temperature mechanical and electrical bonding. Using anodic
aluminum oxide (AAO) and polycarbonate (PC) membrane as template, the
fabrication of Cu/parylene and Cu/polystyrene nanowires were described.
Meanwhile, the fabrication of carbon nanotube (CNTs) array was summarized.
Then, the performances of the composite nanowires (Cu/parylene, Cu/polystyrene
and CNT-Cu/parylene) used as surface fastener for room-temperature mechanical
and electrical bonding were demonstrated.
