  We obtained the analytical expression for the effective thermoelectric
properties and dimensionless figure of merit of a composite with interfacial
electrical and thermal resistances using a micromechanics-based homogenisation.
For the first time, we derived the Eshelby tensor for a spherical inclusion as
a function of the interfacial resistances and obtained the solutions of the
effective Seebeck coefficient and the electrical and thermal conductivities of
a composite, which were validated against finite-element analysis (FEA). Our
analytical predictions well match the effective properties obtained from FEA
with an inclusion volume fraction up to 15%. Because the effective properties
were derived with the assumption of a small temperature difference, we discuss
a heuristic method for obtaining the effective properties in the case where a
thermoelectric composite is subjected to a large temperature difference.
