  It is shown that the critical current density of high-Tc wires can be greatly
enhanced by using a threefold approach, which consists of grain alignment,
doping, and optimization of the grain architecture. According to model
calculations, current densities of 4x10^6 A/cm2 can be achieved for an average
grain alignment of 10 degree at 77K. Based on this approach, a road to
competitive high-Tc cables is proposed.
