  We analyze the thermoelectric cooling properties of a Corbino device in the
quantum Hall regime on the basis of experimental data of electrical
conductance. We focus on the cooling power and the coefficient of performance
within and beyond linear response. Thermovoltage measurements in this device
reported in {\em Phys. Rev. Applied, {\bf 14} 034019 (2020)} indicated that the
transport takes place in the diffusive regime, without signatures of effects
due to the electron-phonon interaction in a wide range of temperatures and
filling factors. In this regime, the heat and charge currents by electrons can
be described by a single transmission function. We infer this function from
experimental data of conductance measurements and we calculate the cooling
power and the coefficient of performance for a wide range of filling factors
and temperatures, as functions of the thermal and electrical biases. We predict
an interesting cooling performance in several parameter regimes.
