  This whitepaper summarizes the status, plans, and challenges in the area of
integrated circuit design in the United States for future High Energy Physics
(HEP) experiments. It has been submitted to CPAD (Coordinating Panel for
Advanced Detectors) and the HEP Community Summer Study 2013(Snowmass on the
Mississippi) held in Minnesota July 29 to August 6, 2013. A workshop titled: US
Workshop on IC Design for High Energy Physics, HEPIC2013 was held May 30 to
June 1, 2013 at Lawrence Berkeley National Laboratory (LBNL). A draft of the
whitepaper was distributed to the attendees before the workshop, the content
was discussed at the meeting, and this document is the resulting final product.
The scope of the whitepaper includes the following topics: Needs for IC
technologies to enable future experiments in the three HEP frontiers Energy,
Cosmic and Intensity Frontiers; Challenges in the different technology and
circuit design areas and the related R&D needs; Motivation for using different
fabrication technologies; Outlook of future technologies including 2.5D and 3D;
Survey of ICs used in current experiments and ICs targeted for approved or
proposed experiments; IC design at US institutes and recommendations for
collaboration in the future.
