  Aluminum single crystals are tested using X-Ray Bragg diffraction, which may
have applications in microscopy and electronics fabrication industry. Yet,
their efficiency for x- ray beam diffraction depends on the accurate crystal
orientation, the microstructure and imperfections. Moreover, the final sample
that is formed from the as-grown crystal by cutting, grinding, polishing and
chemical etching, introduces various surface defects that penetrate deep into
the crystal affecting its natural structure. Defect penetration is attributed
to the fact that ultra-pure aluminum single crystals are soft and ductile with
a hardness in the range of 2~2.5 mho. This leads to lattice deformation,
resulting in a deviation from the crystallographic orientation of the final
device, affecting the diffraction intensity and an apparent shift in the Bragg
angle. In this work we investigate the influence of processing aluminum single
crystals by mechanical and chemical means using XRD and Rocking-Curve
broadening as a quantitative indication concerning the depth of the damage.
This is a preliminary step in supporting future work on the study of electrical
conduction in aluminum single crystals. Supplementing electrical conductivity
measurements of aluminum, quality assessment of defects in front cell aluminum
conductors can assist in designing novel low resistance aluminum conductors
replacing the currently widely used and relatively rare silver.
