  Heat pipe is one of the most efficient tools for heat dissipation in
electronics and power systems. Currently, heat pipes are usually made of
copper, aluminum or stainless steel. Due to their relatively high density and
limited heat transmission capacity, heat pipes are facing urgent challenges in
power electronics and power modules. In this paper, we report a new class of
graphene enhanced heat pipes that can cope with these issues. The graphene
enhanced heat pipes are made of high thermal conductivity graphene assembled
film and graphene laminated copper films with nanostructure enhanced inner
surfaces. The study shows that the dramatically improved heat dissipation
capacity, 6100 W m-2 K-1 g-1, about 3 times higher than that of copper based
commercial heat pipes can be achieved. This paves the way for using graphene
enhanced heat pipes in light-weight and large capacity cooling applications, as
required in many systems such as avionics, automotive electronics, laptop
computers, handsets and space electronics.
