  This paper reports on an approach for fabrication of micro-channels with
nanometer thickness achieved by optimization of UV lithography processes.
Rectangular micro-channels with a staple edge are fabricated over the surface
of a silicon wafer substrate in which a sub-micron layer of diluted SU-8 thin
film has been coated. The optimization of the process parameters including the
duration of a two-step pre- and post-baking process, UV exposure dosage, and
finally chemical developing time with constant agitation produces
micro-channels with high contrast edges and thickness below 100 nm is achieved.
The dimensions achieved using this approach has potential applications in
sub-micron optical waveguides and nanoelectromechanical (NEMS) devices.
