  This contact line vicinity model is conceived as a subgrid model for the DNS
of bubble growth in boiling. The model is based on the hydrodynamic multiscale
theory and is suitable for the partial wetting case. On the smallest length
scale (distance from the contact line) $\sim$ 100 nm, the interface slope is
controlled by the Voinov angle. It is the static apparent contact angle (ACA)
that forms due to evaporation, similarly to previous models neglecting the
contact line motion. The calculation of the Voinov angle is performed with the
generalized lubrication approximation and includes several nanoscale effects
like those of Kelvin and Marangoni, vapor recoil, hydrodynamic slip length and
interfacial kinetic resistance. It provides the finite values of the heat flux,
pressure and temperature at the contact line. The dynamic ACA is obtained with
the Cox-Voinov formula. The microscopic length of the Cox-Voinov formula
(Voinov length) is controlled mainly by the hydrodynamic slip. The integral
heat flux passing through the contact line vicinity is almost independent of
the nanoscale phenomena, with the exception of the interfacial kinetic
resistance and is mostly defined by the dynamic ACA. Both the dynamic ACA and
the integral heat flux are the main output parameters of the subgrid model,
while the local superheating and the microscopic contact angle are the main
input parameters. The model is suitable for the grid sizes $\gt 1 \mu$ m.
