  Superconducting junctions are widely used in multitude of applications
ranging from quantum information science and sensing to solid-state cooling.
Traditionally, such devices must be fabricated on flat substrates using
standard lithographic techniques. In this study, we demonstrate a highly
versatile method that allows for superconducting junctions to be fabricated on
a more complex topography. It is based on maskless direct laser writing (DLW)
two-photon lithography, which allows writing in 3D space. We show that
high-quality normal metal-insulator-superconductor (NIS) tunnel junctions can
be fabricated on top of a 20 $\mu$m tall three-dimensional topography. Combined
with more advanced resist coating methods, this technique could allow
sub-micron device fabrication on almost any type of topography in the future.
