  The next generation of collider experiments require tracking detectors with
extreme performance capabilities in terms of spatial resolution (tens of $\mu
\text{m}$), radiation hardness ($10^{17}~1~$MeV n$_{eq}/$cm$^2$) and timing
resolution (tens of ps). 3D silicon sensors, recently developed within the
TimeSPOT initiative, offer a viable solution to cope with such demanding
requirements. In order to accurately characterize the timing performance of
these new sensors, several read-out boards, based on discrete active
components, have been designed, assembled, and tested. The same electronics is
also suitable for characterization of similar pixel sensors whenever timing
performance in the order and below 10 ps is a requirement. This paper describes
the general characteristics needed by front-end electronics to exploit
solid-state sensors with fast timing capabilities and in particular, showcases
the performance of the developed electronics in the testing and
characterization of fast 3D silicon sensors.
