  We present the required techniques for the successful low loss packaging of
integrated photonic devices capable of operating down to 970 mK utilizing
photonic wire bonds. This scalable technique is shown to have an insertion loss
of less than 2 dB per connection between a SMF-28 single mode fibre and a
silicon photonic chip at these temperatures. This technique has shown
robustness to thermal cycling and is ultra-high vacuum compatible without the
need for any active alignment.
