  Thermal convection based micro-electromechanical accelerometer is a
relatively new kind of acceleration sensor that does not require a solid proof
mass, yielding unique benefits like high shock survival rating, low production
cost, and integrability with CMOS integrated circuit technology. This article
provides a comprehensive survey of the research, development, and current
trends in the field of thermal acceleration sensors, with detailed enumeration
on the theory, operation, modeling, and numerical simulation of such devices.
Different reported varieties and structures of thermal accelerometers have been
reviewed highlighting key design, implementation, and performance aspects.
Materials and technologies used for fabrication of such sensors have also been
discussed. Further, the advantages and challenges for thermal accelerometers
vis-\`a-vis other prominent accelerometer types have been presented, followed
by an overview of associated signal conditioning circuitry and potential
applications.
