  We report on the 3-year INFN ATLAS-CMS joint research activity in
collaboration with FBK, started in 2014, and aimed at the development of new
thin pixel detectors for the High Luminosity LHC Phase-2 upgrades. The program
is concerned with both 3D and planar active-edge pixel sensors to be made on
6-inch p-type wafers. The technology and the design will be optimized and
qualified for extreme radiation hardness (2e16 neq cm-2). Pixel layouts
compatible with present (for testing) and future (RD53 65nm) front-end chips of
ATLAS and CMS are considered. The paper covers the main aspects of the research
program, from the sensor design and fabrication technology, to the results of
initial tests performed on the first prototypes.
