  This work deals with the modelling and simulation of curing phenomena in
adhesively bonded piezo metal composites which consist of an adhesive layer
with integrated piezoelectric module and two surrounding metal sheet layers. In
a first step, a general modelling framework is proposed which is able to
represent curing phenomena in polymers at finite strains. Based on this
formulation, a concretized model is deduced for the simulation of curing in one
specific epoxy based adhesive. Here, appropriate material functions are
specified and the thermodynamic consistency is proved. Regarding the finite
element implementation, a numerical integration scheme and a new approach for
the consideration of different initial conditions are provided. Finally, finite
element simulations of a newly proposed manufacturing process for the
production of bonded piezo metal composite structures are conducted. A deep
drawing process of the composite with uncured adhesive layer and the subsequent
adhesive curing are investigated.
