  Modularity is a promising approach for scaling up quantum computers and
therefore integrating higher qubit counts. The essence of such architectures
lies in their reliance on high-fidelity and fast quantum state transfers
enabled by generating entanglement between chips. In addressing the challenge
of implementing quantum coherent communication channels to interconnect quantum
processors, various techniques have been proposed to account for qubit
technology specifications and the implemented communication protocol. By
employing Design Space Exploration (DSE) methodologies, this work presents a
comparative analysis of the cavity-mediated interconnect technologies according
to a defined figure of merit, and we identify the configurations related to the
cavity and atomic decay rates as well as the qubit-cavity coupling strength
that meet the efficiency thresholds. We therefore contribute to benchmarking
contemporary cavity-mediated quantum interconnects and guide the development of
reliable and scalable chip-to-chip links for modular quantum computers.
