  The study of the Cu-Sn-In ternary system has become of great importance in
recent years, due to new environmental regulations forcing to eliminate the use
of Pb in bonding technologies for electronic devices. A key relevant issue
concerns the intermetallic phases which grow in the bonding zone and are
determining in their quality and performance. In this work, we focus in the
{\eta}-phase (Cu2In or Cu6Sn5) that exists in both end binaries and as a
ternary phase. We present a neutron diffraction study of the constitution and
crystallography of a series of alloys around the 60 at.% Cu composition, and
with In contents ranging from 0 to 25 at.%, quenched from 300\degreeC. The
alloys were characterized by scanning electron microscopy, probe microanalysis
and high-resolution neutron diffraction. The Rietveld refinement of neutron
diffraction data allowed to improve the currently available model for site
occupancies in the hexagonal {\eta}-phase in the binary Cu-Sn as well as in
ternary alloys. For the first time, structural data is reported in the ternary
Cu-Sn-In {\eta}-phase as a function of composition, information that is of
fundamental technological importance as well as valuable input data for ongoing
modelisations of the ternary phase diagram.
