  The LHC is expected to reach luminosities up to 3000fb-1 and the innermost
layer of the ATLAS upgrade plans to cope with higher occupancy and to decrease
the pixel size. 3D-Si sensors are a good candidate for the innermost layer of
the ATLAS pixel upgrade since they exhibit good performance under high fluences
and the new designs will have smaller pixel size to fulfill the electronics
expectations. This paper reports TCAD simulations of the 3D-Si sensors designed
at IMB-CNM with non passing-through columns that are being fabricated for the
next innermost layer of the ATLAS pixel upgrade, shows the charge collection
response before and after irradiation, and the response of 3D-Si sensors
located at large $\eta$ angles.
