  This work reports on a steady-state thermal analysis of a 160 GHz balanced
quadrupler, based on a quasi-vertical varactor Schottky diode process, for high
power applications. The chip is analyzed by solving the heat equation via the
3D finite element method. Time-Domain Thermoreflectance (TDTR) was used to
measure the thermal conductivity of the different materials used in the model.
A maximum anode temperature of 64.9 C was found from the simulation. The
addition of an extra beam lead connected to the block, for heat sinking, was
found to reduce this maximum temperature to 41.0 C.
