  Current integration, architectural design and manufacturing technologies are
not suited for the computing density and power efficiency requested by Exascale
computing. New approaches in hardware architecture are thus needed to overcome
the technological barriers preventing the transition to the Exascale era. In
that scope, we report successful fabrication of first ExaNoDe's MCM prototypes
dedicated to Exascale computing applications. Each MCM was composed of 2 Xilinx
Zynq Ultrascale+ MPSoC, assembled on advanced 68.5 mm x 55 mm laminate
substrates specifically designed and fabricated for the project. Acoustic
microscopy, x-ray, cross-section and Thermo-Moire investigations revealed no
voids, shorts, delamination, cracks or warpage issues. Two MCMs were mounted on
a daughter board by FORTH for testing purposes. The DDR memories on the 4
SODIMMs of the daughter board were successfully tested by running extensive
Xilinx memory tests with clock frequencies of 1866 MHz and 2133 MHz. All 4
FPGAs were programmed with the Xilinx integrated bit error ratio test (IBERT)
tailored for this board for links testing. All intra-board high-speed links
between all FPGAs were stable at 10 Gbps, even under the more demanding 31-bit
PRBS (Pseudorandom Binary Sequence) tests.
