  While parallel microchannel based cooling systems have been around for quite
a period of time, employing the same and incorporating them for near active
cooling of microelectronic devices is yet to be implemented and the
implications of the same on thermal mitigation to be understood. The present
article focusses on a specific design of the PMCS such that it can be
implemented at ease on the heat spreader of a modern microprocessor to obtain
near active cooling. Extensive experimental and numerical studies have been
carried out to comprehend the same and three different flow configurations of
PMCS have been adopted for the present investigations. Additional to focussing
on the thermofluidics due to flow configuration, nanofluids have also been
employed to achieve the desired essentials of mitigation of overshoot
temperatures and improving uniformity of cooling. Two modelling methods,
Discrete Phase Modelling and Effective Property Modelling have been employed
for numerical study to model nanofluids as working fluid in micro flow paths
and the DPM predictions have been observed to match accurately with
experiments. To quantify the thermal performance of PMCS, an appropriate Figure
of Merit has been proposed. From the FoM It has been perceived that the Z
configuration employing nanofluid is the best suitable solutions for uniform
thermal loads to achieve uniform cooling as well as reducing maximum
temperature produced with in the device. The present results are very promising
and viable approach for futuristic thermal mitigation of microprocessor
systems.
