  The effect of stress-triaxiality on growth of a void in a three dimensional
single-crystal face-centered-cubic (FCC) lattice has been studied. Molecular
dynamics (MD) simulations using an embedded-atom (EAM) potential for copper
have been performed at room temperature and using strain controlling with high
strain rates ranging from 10^7/sec to 10^10/sec. Strain-rates of these
magnitudes can be studied experimentally, e.g. using shock waves induced by
laser ablation. Void growth has been simulated in three different conditions,
namely uniaxial, biaxial, and triaxial expansion. The response of the system in
the three cases have been compared in terms of the void growth rate, the
detailed void shape evolution, and the stress-strain behavior including the
development of plastic strain. Also macroscopic observables as plastic work and
porosity have been computed from the atomistic level. The stress thresholds for
void growth are found to be comparable with spall strength values determined by
dynamic fracture experiments. The conventional macroscopic assumption that the
mean plastic strain results from the growth of the void is validated. The
evolution of the system in the uniaxial case is found to exhibit four different
regimes: elastic expansion; plastic yielding, when the mean stress is nearly
constant, but the stress-triaxiality increases rapidly together with
exponential growth of the void; saturation of the stress-triaxiality; and
finally the failure.
