  The iterative prototyping process for printed circuit boards (PCBs)
frequently employs surface-mounted device (SMD) components, which are often
discarded rather than reused due to the challenges associated with desoldering,
leading to unnecessary electronic waste. This paper introduces SolderlessPCB, a
collection of techniques for solder-free PCB prototyping, specifically designed
to promote the recycling and reuse of electronic components. Central to this
approach are custom 3D-printable housings that allow SMD components to be
mounted onto PCBs without soldering. We detail the design of SolderlessPCB and
the experiments conducted to evaluate its design parameters, electrical
performance, and durability. To illustrate the potential for reusing SMD
components with SolderlessPCB, we discuss two scenarios: the reuse of
components from earlier design iterations and from obsolete prototypes. We also
provide examples demonstrating that SolderlessPCB can handle high-current
applications and is suitable for high-speed data transmission. The paper
concludes by discussing the limitations of our approach and suggesting future
directions to overcome these challenges.
