  Technological progress in electronics usually requires their use in
increasingly aggressive environments, such as rapid thermal cycling and high
power density. Thermal diodes appear as excellent candidates to thermally
protect critical electronic components and ensure durability and reliability.
We model the heat transport across a square plate with a hole subjected to an
oscillating external temperature, such spatial and temporal symmetries are
broken. We find rectification of the heat current that strongly depends on the
frequency and the geometry of the hole. This system behaves as a thermal diode
that could be used as part of a thermal architecture to dissipate heat under
cycling temperature conditions.
