  Recently, we demonstrated controllable 3D self-folding by means of capillary
forces of silicon-nitride micro-objects made of rigid plates connected to each
other by flexible hinges [1]. In this paper, we introduce platinum electrodes
running from the substrate to the plates over these bendable hinges. The
fabrication yield is as high as (77 +/- 2) % for hinges with a length less than
75 {\mu}m. The yield reduces to (18 +/- 2) % when the length increases above
100 {\mu}m. Most of the failures in conductivity are due to degradation of the
platinum/chromium layer stack during the final plasma cleaning step. The
bi-layer hinges survive the capillary folding process, even for extremely small
bending radii of 5 {\mu}m, nor does the bending have any impact on the
conductivity. Stress in the different layers deforms the hinges, which does not
affect the conductivity. Once assembled, the conductive hinges can withstand a
current density of (1.6 +/- 0.4) $10^6$ A/cm$^2$ . This introduction of
conductive electrodes to elastocapillary self-folded silicon-based
micro-objects extends the range of their possible applications by allowing an
electronic functionality of the folded parts.
