  The chiplet-based System-in-Package~(SiP) technology enables more design
flexibility via various inter-chiplet connection and heterogeneous integration.
However, it is not known how to convert such flexibility into cost efficiency,
which is critical when making a design decision. In this paper, we develop an
analytical cost model that can estimate the cost of the 2.5D chiplet-based SiP
systems under various interconnection options and technology nodes. We
conducted two case studies using our cost model to explore the cost
characteristics of the 2.5D chiplet-based SiP system. Based on the case
studies, we made several observations on the interposer selection, design
partition granularity, and technology node adoption for cost-efficient
chiplet-based SiP design.
