  Layout camouflaging can protect the intellectual property of modern circuits.
Most prior art, however, incurs excessive layout overheads and necessitates
customization of active-device manufacturing processes, i.e., the
front-end-of-line (FEOL). As a result, camouflaging has typically been applied
selectively, which can ultimately undermine its resilience. Here, we propose a
low-cost and generic scheme---full-chip camouflaging can be finally realized
without reservations. Our scheme is based on obfuscating the interconnects,
i.e., the back-end-of-line (BEOL), through design-time handling for real and
dummy wires and vias. To that end, we implement custom, BEOL-centric
obfuscation cells, and develop a CAD flow using industrial tools. Our scheme
can be applied to any design and technology node without FEOL-level
modifications. Considering its BEOL-centric nature, we advocate applying our
scheme in conjunction with split manufacturing, to furthermore protect against
untrusted fabs. We evaluate our scheme for various designs at the physical,
DRC-clean layout level. Our scheme incurs a significantly lower cost than most
of the prior art. Notably, for fully camouflaged layouts, we observe average
power, performance, and area overheads of 24.96%, 19.06%, and 32.55%,
respectively. We conduct a thorough security study addressing the threats
(attacks) related to untrustworthy FEOL fabs (proximity attacks) and malicious
end-users (SAT-based attacks). An empirical key finding is that only
large-scale camouflaging schemes like ours are practically secure against
powerful SAT-based attacks. Another key finding is that our scheme hinders both
placement- and routing-centric proximity attacks; correct connections are
reduced by 7.47X, and complexity is increased by 24.15X, respectively, for such
attacks.
