  As the field of superconducting quantum computing advances from the few-qubit
stage to larger-scale processors, qubit addressability and extensibility will
necessitate the use of 3D integration and packaging. While 3D integration is
well-developed for commercial electronics, relatively little work has been
performed to determine its compatibility with high-coherence solid-state
qubits. Of particular concern, qubit coherence times can be suppressed by the
requisite processing steps and close proximity of another chip. In this work,
we use a flip-chip process to bond a chip with superconducting flux qubits to
another chip containing structures for qubit readout and control. We
demonstrate that high qubit coherence ($T_1$, $T_{2,\rm{echo}} > 20\,\mu$s) is
maintained in a flip-chip geometry in the presence of galvanic, capacitive, and
inductive coupling between the chips.
