  The Belle II experiment, which is situated at the interaction point of the
SuperKEKB $e^+e^{-}$ collider at KEK, Tsukuba, Japan, is expected to collect
data corresponding to an integrated luminosity of 50~ab$^{- 1}$. This data set
will be sensitive to beyond-the-standard-model physics via precision
measurements and searches for very rare decays. At its heart lies a six-layer
vertex detector consisting of two layers of pixel detectors (PXD) and four
layers of double-sided silicon microstrip detectors (SVD). Precise vertexing as
provided by this device is essential for measurements of time-dependent $CP$
violation. Crucial aspects of the SVD assembly are precise alignment, as well
as rigorous electrical and geometrical quality assurance. We present an
overview of the construction of the SVD, including the precision gluing of SVD
component modules and the wire-bonding of various electrical components. We
also discuss the electrical and geometrical quality assurance tests.
