Daily Papers

It is well established that the spectral analysis of canonically quantized four-dimensional Seiberg-Witten curves can be systematically studied via the Nekrasov-Shatashvili functions. In this paper, we explore another aspect of the relation between N=2 supersymmetric gauge theories in four dimensions and operator theory. Specifically, we study an example of an integral operator associated with Painlev\'e equations and whose spectral traces are related to correlation functions of the 2d Ising model. This operator does not correspond to a canonically quantized Seiberg-Witten curve, but its kernel can nevertheless be interpreted as the density matrix of an ideal Fermi gas. Adopting the approach of Tracy and Widom, we provide an explicit expression for its eigenfunctions via an O(2) matrix model. We then show that these eigenfunctions are computed by surface defects in SU(2) super Yang-Mills in the self-dual phase of the Omega-background. Our result also yields a strong coupling expression for such defects which resums the instanton expansion. Even though we focus on one concrete example, we expect these results to hold for a larger class of operators arising in the context of isomonodromic deformation equations.

Surface defects are a primary source of yield loss in manufacturing, yet existing anomaly detection methods often fail in real-world deployment due to limited and unrepresentative datasets. To overcome this, we introduce 3D-ADAM, a 3D Anomaly Detection in Additive Manufacturing dataset, that is the first large-scale, industry-relevant dataset for RGB+3D surface defect detection in additive manufacturing. 3D-ADAM comprises 14,120 high-resolution scans of 217 unique parts, captured with four industrial depth sensors, and includes 27,346 annotated defects across 12 categories along with 27,346 annotations of machine element features in 16 classes. 3D-ADAM is captured in a real industrial environment and as such reflects real production conditions, including variations in part placement, sensor positioning, lighting, and partial occlusion. Benchmarking state-of-the-art models demonstrates that 3D-ADAM presents substantial challenges beyond existing datasets. Validation through expert labelling surveys with industry partners further confirms its industrial relevance. By providing this benchmark, 3D-ADAM establishes a foundation for advancing robust 3D anomaly detection capable of meeting manufacturing demands.

In industrial anomaly detection (IAD), accurately identifying defects amidst diverse anomalies and under varying imaging conditions remains a significant challenge. Traditional approaches often struggle with high false-positive rates, frequently misclassifying normal shadows and surface deformations as defects, an issue that becomes particularly pronounced in products with complex and intricate surface features. To address these challenges, we introduce PA-CLIP, a zero-shot anomaly detection method that reduces background noise and enhances defect detection through a pseudo-anomaly-based framework. The proposed method integrates a multiscale feature aggregation strategy for capturing detailed global and local information, two memory banks for distinguishing background information, including normal patterns and pseudo-anomalies, from true anomaly features, and a decision-making module designed to minimize false positives caused by environmental variations while maintaining high defect sensitivity. Demonstrated on the MVTec AD and VisA datasets, PA-CLIP outperforms existing zero-shot methods, providing a robust solution for industrial defect detection.

This paper presents PyResBugs, a curated dataset of residual bugs, i.e., defects that persist undetected during traditional testing but later surface in production, collected from major Python frameworks. Each bug in the dataset is paired with its corresponding fault-free (fixed) version and annotated with multi-level natural language (NL) descriptions. These NL descriptions enable natural language-driven fault injection, offering a novel approach to simulating real-world faults in software systems. By bridging the gap between software fault injection techniques and real-world representativeness, PyResBugs provides researchers with a high-quality resource for advancing AI-driven automated testing in Python systems.

Detecting surface anomalies of industrial materials poses a significant challenge within a myriad of industrial manufacturing processes. In recent times, various methodologies have emerged, capitalizing on the advantages of employing a network pre-trained on natural images for the extraction of representative features. Subsequently, these features are subjected to processing through a diverse range of techniques including memory banks, normalizing flow, and knowledge distillation, which have exhibited exceptional accuracy. This paper revisits approaches based on pre-trained features by introducing a novel method centered on target-specific embedding. To capture the most representative features of the texture under consideration, we employ a variant of a contrastive training procedure that incorporates both artificially generated defective samples and anomaly-free samples during training. Exploiting the intrinsic properties of surfaces, we derived a meaningful representation from the defect-free samples during training, facilitating a straightforward yet effective calculation of anomaly scores. The experiments conducted on the MVTEC AD and TILDA datasets demonstrate the competitiveness of our approach compared to state-of-the-art methods.

Visual surface anomaly detection aims to detect local image regions that significantly deviate from normal appearance. Recent surface anomaly detection methods rely on generative models to accurately reconstruct the normal areas and to fail on anomalies. These methods are trained only on anomaly-free images, and often require hand-crafted post-processing steps to localize the anomalies, which prohibits optimizing the feature extraction for maximal detection capability. In addition to reconstructive approach, we cast surface anomaly detection primarily as a discriminative problem and propose a discriminatively trained reconstruction anomaly embedding model (DRAEM). The proposed method learns a joint representation of an anomalous image and its anomaly-free reconstruction, while simultaneously learning a decision boundary between normal and anomalous examples. The method enables direct anomaly localization without the need for additional complicated post-processing of the network output and can be trained using simple and general anomaly simulations. On the challenging MVTec anomaly detection dataset, DRAEM outperforms the current state-of-the-art unsupervised methods by a large margin and even delivers detection performance close to the fully-supervised methods on the widely used DAGM surface-defect detection dataset, while substantially outperforming them in localization accuracy.

The aim of surface defect detection is to identify and localise abnormal regions on the surfaces of captured objects, a task that's increasingly demanded across various industries. Current approaches frequently fail to fulfil the extensive demands of these industries, which encompass high performance, consistency, and fast operation, along with the capacity to leverage the entirety of the available training data. Addressing these gaps, we introduce SuperSimpleNet, an innovative discriminative model that evolved from SimpleNet. This advanced model significantly enhances its predecessor's training consistency, inference time, as well as detection performance. SuperSimpleNet operates in an unsupervised manner using only normal training images but also benefits from labelled abnormal training images when they are available. SuperSimpleNet achieves state-of-the-art results in both the supervised and the unsupervised settings, as demonstrated by experiments across four challenging benchmark datasets. Code: https://github.com/blaz-r/SuperSimpleNet .

Surface defect detection is a critical task across numerous industries, aimed at efficiently identifying and localising imperfections or irregularities on manufactured components. While numerous methods have been proposed, many fail to meet industrial demands for high performance, efficiency, and adaptability. Existing approaches are often constrained to specific supervision scenarios and struggle to adapt to the diverse data annotations encountered in real-world manufacturing processes, such as unsupervised, weakly supervised, mixed supervision, and fully supervised settings. To address these challenges, we propose SuperSimpleNet, a highly efficient and adaptable discriminative model built on the foundation of SimpleNet. SuperSimpleNet incorporates a novel synthetic anomaly generation process, an enhanced classification head, and an improved learning procedure, enabling efficient training in all four supervision scenarios, making it the first model capable of fully leveraging all available data annotations. SuperSimpleNet sets a new standard for performance across all scenarios, as demonstrated by its results on four challenging benchmark datasets. Beyond accuracy, it is very fast, achieving an inference time below 10 ms. With its ability to unify diverse supervision paradigms while maintaining outstanding speed and reliability, SuperSimpleNet represents a promising step forward in addressing real-world manufacturing challenges and bridging the gap between academic research and industrial applications. Code: https://github.com/blaz-r/SuperSimpleNet

Understanding electron irradiation effects is vital not only for reliable transmission electron microscopy characterization, but increasingly also for the controlled manipulation of two-dimensional materials. The displacement cross sections of monolayer hBN are measured using aberration-corrected scanning transmission electron microscopy in near ultra-high vacuum at primary beam energies between 50 and 90 keV. Damage rates below 80 keV are up to three orders of magnitude lower than previously measured at edges under poorer residual vacuum conditions where chemical etching appears to have been dominant. Notably, is possible to create single vacancies in hBN using electron irradiation, with boron almost twice as likely as nitrogen to be ejected below 80 keV. Moreover, any damage at such low energies cannot be explained by elastic knock-on, even when accounting for vibrations of the atoms. A theoretical description is developed to account for lowering of the displacement threshold due to valence ionization resulting from inelastic scattering of probe electrons, modelled using charge-constrained density functional theory molecular dynamics. Although significant reductions are found depending on the constrained charge, quantitative predictions for realistic ionization states are currently not possible. Nonetheless, there is potential for defect-engineering of hBN at the level of single vacancies using electron irradiation.

The presence of point defects such as vacancies plays an important role in material design. Here, we demonstrate that a graph neural network (GNN) model trained only on perfect materials can also be used to predict vacancy formation energies (E_{vac}) of defect structures without the need for additional training data. Such GNN-based predictions are considerably faster than density functional theory (DFT) calculations with reasonable accuracy and show the potential that GNNs are able to capture a functional form for energy predictions. To test this strategy, we developed a DFT dataset of 508 E_{vac} consisting of 3D elemental solids, alloys, oxides, nitrides, and 2D monolayer materials. We analyzed and discussed the applicability of such direct and fast predictions. We applied the model to predict 192494 E_{vac} for 55723 materials in the JARVIS-DFT database.

Anomaly detection is a crucial process in industrial manufacturing and has made significant advancements recently. However, there is a large variance between the data used in the development and the data collected by the production environment. Therefore, we present the Texture-AD benchmark based on representative texture-based anomaly detection to evaluate the effectiveness of unsupervised anomaly detection algorithms in real-world applications. This dataset includes images of 15 different cloth, 14 semiconductor wafers and 10 metal plates acquired under different optical schemes. In addition, it includes more than 10 different types of defects produced during real manufacturing processes, such as scratches, wrinkles, color variations and point defects, which are often more difficult to detect than existing datasets. All anomalous areas are provided with pixel-level annotations to facilitate comprehensive evaluation using anomaly detection models. Specifically, to adapt to diverse products in automated pipelines, we present a new evaluation method and results of baseline algorithms. The experimental results show that Texture-AD is a difficult challenge for state-of-the-art algorithms. To our knowledge, Texture-AD is the first dataset to be devoted to evaluating industrial defect detection algorithms in the real world. The dataset is available at https://XXX.

Point defects play a central role in driving the properties of materials. First-principles methods are widely used to compute defect energetics and structures, including at scale for high-throughput defect databases. However, these methods are computationally expensive, making machine-learning force fields (MLFFs) an attractive alternative for accelerating structural relaxations. Most existing MLFFs are based on graph neural networks (GNNs), which can suffer from oversmoothing and poor representation of long-range interactions. Both of these issues are especially of concern when modeling point defects. To address these challenges, we introduce the Accelerated Deep Atomic Potential Transformer (ADAPT), an MLFF that replaces graph representations with a direct coordinates-in-space formulation and explicitly considers all pairwise atomic interactions. Atoms are treated as tokens, with a Transformer encoder modeling their interactions. Applied to a dataset of silicon point defects, ADAPT achieves a roughly 33 percent reduction in both force and energy prediction errors relative to a state-of-the-art GNN-based model, while requiring only a fraction of the computational cost.

Defect inspection is paramount within the closed-loop manufacturing system. However, existing datasets for defect inspection often lack precision and semantic granularity required for practical applications. In this paper, we introduce the Defect Spectrum, a comprehensive benchmark that offers precise, semantic-abundant, and large-scale annotations for a wide range of industrial defects. Building on four key industrial benchmarks, our dataset refines existing annotations and introduces rich semantic details, distinguishing multiple defect types within a single image. Furthermore, we introduce Defect-Gen, a two-stage diffusion-based generator designed to create high-quality and diverse defective images, even when working with limited datasets. The synthetic images generated by Defect-Gen significantly enhance the efficacy of defect inspection models. Overall, The Defect Spectrum dataset demonstrates its potential in defect inspection research, offering a solid platform for testing and refining advanced models.

Manufacturing wafers is an intricate task involving thousands of steps. Defect Pattern Recognition (DPR) of wafer maps is crucial for determining the root cause of production defects, which may further provide insight for yield improvement in wafer foundry. During manufacturing, various defects may appear standalone in the wafer or may appear as different combinations. Identifying multiple defects in a wafer is generally harder compared to identifying a single defect. Recently, deep learning methods have gained significant traction in mixed-type DPR. However, the complexity of defects requires complex and large models making them very difficult to operate on low-memory embedded devices typically used in fabrication labs. Another common issue is the unavailability of labeled data to train complex networks. In this work, we propose an unsupervised training routine to distill the knowledge of complex pre-trained models to lightweight deployment-ready models. We empirically show that this type of training compresses the model without sacrificing accuracy despite being up to 10 times smaller than the teacher model. The compressed model also manages to outperform contemporary state-of-the-art models.

The usage of electronic devices increases, and becomes predominant in most aspects of life. Surface Mount Technology (SMT) is the most common industrial method for manufacturing electric devices in which electrical components are mounted directly onto the surface of a Printed Circuit Board (PCB). Although the expansion of electronic devices affects our lives in a productive way, failures or defects in the manufacturing procedure of those devices might also be counterproductive and even harmful in some cases. It is therefore desired and sometimes crucial to ensure zero-defect quality in electronic devices and their production. While traditional Image Processing (IP) techniques are not sufficient to produce a complete solution, other promising methods like Deep Learning (DL) might also be challenging for PCB inspection, mainly because such methods require big adequate datasets which are missing, not available or not updated in the rapidly growing field of PCBs. Thus, PCB inspection is conventionally performed manually by human experts. Unsupervised Learning (UL) methods may potentially be suitable for PCB inspection, having learning capabilities on the one hand, while not relying on large datasets on the other. In this paper, we introduce ChangeChip, an automated and integrated change detection system for defect detection in PCBs, from soldering defects to missing or misaligned electronic elements, based on Computer Vision (CV) and UL. We achieve good quality defect detection by applying an unsupervised change detection between images of a golden PCB (reference) and the inspected PCB under various setting. In this work, we also present CD-PCB, a synthesized labeled dataset of 20 pairs of PCB images for evaluation of defect detection algorithms.

Shrinking pattern dimensions leads to an increased variety of defect types in semiconductor devices. This has spurred innovation in patterning approaches such as Directed self-assembly (DSA) for which no traditional, automatic defect inspection software exists. Machine Learning-based SEM image analysis has become an increasingly popular research topic for defect inspection with supervised ML models often showing the best performance. However, little research has been done on obtaining a dataset with high-quality labels for these supervised models. In this work, we propose a method for obtaining coherent and complete labels for a dataset of hexagonal contact hole DSA patterns while requiring minimal quality control effort from a DSA expert. We show that YOLOv8, a state-of-the-art neural network, achieves defect detection precisions of more than 0.9 mAP on our final dataset which best reflects DSA expert defect labeling expectations. We discuss the strengths and limitations of our proposed labeling approach and suggest directions for future work in data-centric ML-based defect inspection.

Surface anomaly detection is a vital component in manufacturing inspection. Current discriminative methods follow a two-stage architecture composed of a reconstructive network followed by a discriminative network that relies on the reconstruction output. Currently used reconstructive networks often produce poor reconstructions that either still contain anomalies or lack details in anomaly-free regions. Discriminative methods are robust to some reconstructive network failures, suggesting that the discriminative network learns a strong normal appearance signal that the reconstructive networks miss. We reformulate the two-stage architecture into a single-stage iterative process that allows the exchange of information between the reconstruction and localization. We propose a novel transparency-based diffusion process where the transparency of anomalous regions is progressively increased, restoring their normal appearance accurately while maintaining the appearance of anomaly-free regions using localization cues of previous steps. We implement the proposed process as TRANSparency DifFUSION (TransFusion), a novel discriminative anomaly detection method that achieves state-of-the-art performance on both the VisA and the MVTec AD datasets, with an image-level AUROC of 98.5% and 99.2%, respectively. Code: https://github.com/MaticFuc/ECCV_TransFusion

The presence of strong electron clouds in the quadrupole magnetic field regions of the Large Hadron Collider (LHC) leads to considerable heating that poses challenges for the cryogenic cooling system, and under certain conditions to proton beam quality deterioration. Research is being conducted on laser-treated inner beam screen surfaces for the upgraded High-Luminosity LHC to mitigate this issue. Laser-induced surface structuring, a technique that effectively roughens surfaces, has been shown to reduce secondary electron emission; an essential factor in controlling electron cloud formation. Conversely, the resulting surface roughening also alters the material's surface impedance, potentially impacting beam stability and increasing beam-induced resistive wall heating. Different laser treatment patterns have been applied to LHC beam screens to estimate this potential impact and assessed for their microwave responses.

Quality control is of vital importance during electronics production. As the methods of producing electronic circuits improve, there is an increasing chance of solder defects during assembling the printed circuit board (PCB). Many technologies have been incorporated for inspecting failed soldering, such as X-ray imaging, optical imaging, and thermal imaging. With some advanced algorithms, the new technologies are expected to control the production quality based on the digital images. However, current algorithms sometimes are not accurate enough to meet the quality control. Specialists are needed to do a follow-up checking. For automated X-ray inspection, joint of interest on the X-ray image is located by region of interest (ROI) and inspected by some algorithms. Some incorrect ROIs deteriorate the inspection algorithm. The high dimension of X-ray images and the varying sizes of image dimensions also challenge the inspection algorithms. On the other hand, recent advances on deep learning shed light on image-based tasks and are competitive to human levels. In this paper, deep learning is incorporated in X-ray imaging based quality control during PCB quality inspection. Two artificial intelligence (AI) based models are proposed and compared for joint defect detection. The noised ROI problem and the varying sizes of imaging dimension problem are addressed. The efficacy of the proposed methods are verified through experimenting on a real-world 3D X-ray dataset. By incorporating the proposed methods, specialist inspection workload is largely saved.

A key step in any scanning-based asset creation workflow is to convert unordered point clouds to a surface. Classical methods (e.g., Poisson reconstruction) start to degrade in the presence of noisy and partial scans. Hence, deep learning based methods have recently been proposed to produce complete surfaces, even from partial scans. However, such data-driven methods struggle to generalize to new shapes with large geometric and topological variations. We present Points2Surf, a novel patch-based learning framework that produces accurate surfaces directly from raw scans without normals. Learning a prior over a combination of detailed local patches and coarse global information improves generalization performance and reconstruction accuracy. Our extensive comparison on both synthetic and real data demonstrates a clear advantage of our method over state-of-the-art alternatives on previously unseen classes (on average, Points2Surf brings down reconstruction error by 30\% over SPR and by 270\%+ over deep learning based SotA methods) at the cost of longer computation times and a slight increase in small-scale topological noise in some cases. Our source code, pre-trained model, and dataset are available on: https://github.com/ErlerPhilipp/points2surf

Industrial anomaly detection is generally addressed as an unsupervised task that aims at locating defects with only normal training samples. Recently, numerous 2D anomaly detection methods have been proposed and have achieved promising results, however, using only the 2D RGB data as input is not sufficient to identify imperceptible geometric surface anomalies. Hence, in this work, we focus on multi-modal anomaly detection. Specifically, we investigate early multi-modal approaches that attempted to utilize models pre-trained on large-scale visual datasets, i.e., ImageNet, to construct feature databases. And we empirically find that directly using these pre-trained models is not optimal, it can either fail to detect subtle defects or mistake abnormal features as normal ones. This may be attributed to the domain gap between target industrial data and source data.Towards this problem, we propose a Local-to-global Self-supervised Feature Adaptation (LSFA) method to finetune the adaptors and learn task-oriented representation toward anomaly detection.Both intra-modal adaptation and cross-modal alignment are optimized from a local-to-global perspective in LSFA to ensure the representation quality and consistency in the inference stage.Extensive experiments demonstrate that our method not only brings a significant performance boost to feature embedding based approaches, but also outperforms previous State-of-The-Art (SoTA) methods prominently on both MVTec-3D AD and Eyecandies datasets, e.g., LSFA achieves 97.1% I-AUROC on MVTec-3D, surpass previous SoTA by +3.4%.

As the globalization of semiconductor design and manufacturing processes continues, the demand for defect detection during integrated circuit fabrication stages is becoming increasingly critical, playing a significant role in enhancing the yield of semiconductor products. Traditional wafer map defect pattern detection methods involve manual inspection using electron microscopes to collect sample images, which are then assessed by experts for defects. This approach is labor-intensive and inefficient. Consequently, there is a pressing need to develop a model capable of automatically detecting defects as an alternative to manual operations. In this paper, we propose a method that initially employs a pre-trained VAE model to obtain the fault distribution information of the wafer map. This information serves as guidance, combined with the original image set for semi-supervised model training. During the semi-supervised training, we utilize a teacher-student network for iterative learning. The model presented in this paper is validated on the benchmark dataset WM-811K wafer dataset. The experimental results demonstrate superior classification accuracy and detection performance compared to state-of-the-art models, fulfilling the requirements for industrial applications. Compared to the original architecture, we have achieved significant performance improvement.

The science of fractography revolves around the correlation between topographic characteristics of the fracture surface and the mechanisms and external conditions leading to their creation. While being a topic of investigation for centuries, it has remained mostly qualitative to date. A quantitative analysis of fracture surfaces is of prime interest for both the scientific community and the industrial sector, bearing the potential for improved understanding on the mechanisms controlling the fracture process and at the same time assessing the reliability of computational models currently being used for material design. With new advances in the field of image analysis, and specifically with machine learning tools becoming more accessible and reliable, it is now feasible to automate the process of extracting meaningful information from fracture surface images. Here, we propose a method of identifying and quantifying the relative appearance of intergranular and transgranular fracture events from scanning electron microscope images. The newly proposed method is based on a convolutional neural network algorithm for semantic segmentation. The proposed method is extensively tested and evaluated against two ceramic material systems (Al_2O_3,MgAl_2O_4) and shows high prediction accuracy, despite being trained on only one material system (MgAl_2O_4). While here attention is focused on brittle fracture characteristics, the method can be easily extended to account for other fracture morphologies, such as dimples, fatigue striations, etc.

3D anomaly detection plays a crucial role in monitoring parts for localized inherent defects in precision manufacturing. Embedding-based and reconstruction-based approaches are among the most popular and successful methods. However, there are two major challenges to the practical application of the current approaches: 1) the embedded models suffer the prohibitive computational and storage due to the memory bank structure; 2) the reconstructive models based on the MAE mechanism fail to detect anomalies in the unmasked regions. In this paper, we propose R3D-AD, reconstructing anomalous point clouds by diffusion model for precise 3D anomaly detection. Our approach capitalizes on the data distribution conversion of the diffusion process to entirely obscure the input's anomalous geometry. It step-wisely learns a strict point-level displacement behavior, which methodically corrects the aberrant points. To increase the generalization of the model, we further present a novel 3D anomaly simulation strategy named Patch-Gen to generate realistic and diverse defect shapes, which narrows the domain gap between training and testing. Our R3D-AD ensures a uniform spatial transformation, which allows straightforwardly generating anomaly results by distance comparison. Extensive experiments show that our R3D-AD outperforms previous state-of-the-art methods, achieving 73.4% Image-level AUROC on the Real3D-AD dataset and 74.9% Image-level AUROC on the Anomaly-ShapeNet dataset with an exceptional efficiency.

Being able to spot defective parts is a critical component in large-scale industrial manufacturing. A particular challenge that we address in this work is the cold-start problem: fit a model using nominal (non-defective) example images only. While handcrafted solutions per class are possible, the goal is to build systems that work well simultaneously on many different tasks automatically. The best performing approaches combine embeddings from ImageNet models with an outlier detection model. In this paper, we extend on this line of work and propose PatchCore, which uses a maximally representative memory bank of nominal patch-features. PatchCore offers competitive inference times while achieving state-of-the-art performance for both detection and localization. On the challenging, widely used MVTec AD benchmark PatchCore achieves an image-level anomaly detection AUROC score of up to 99.6%, more than halving the error compared to the next best competitor. We further report competitive results on two additional datasets and also find competitive results in the few samples regime.^* Work done during a research internship at Amazon AWS. Code: github.com/amazon-research/patchcore-inspection.

The chips contained in any electronic device are manufactured over circular silicon wafers, which are monitored by inspection machines at different production stages. Inspection machines detect and locate any defect within the wafer and return a Wafer Defect Map (WDM), i.e., a list of the coordinates where defects lie, which can be considered a huge, sparse, and binary image. In normal conditions, wafers exhibit a small number of randomly distributed defects, while defects grouped in specific patterns might indicate known or novel categories of failures in the production line. Needless to say, a primary concern of semiconductor industries is to identify these patterns and intervene as soon as possible to restore normal production conditions. Here we address WDM monitoring as an open-set recognition problem to accurately classify WDM in known categories and promptly detect novel patterns. In particular, we propose a comprehensive pipeline for wafer monitoring based on a Submanifold Sparse Convolutional Network, a deep architecture designed to process sparse data at an arbitrary resolution, which is trained on the known classes. To detect novelties, we define an outlier detector based on a Gaussian Mixture Model fitted on the latent representation of the classifier. Our experiments on a real dataset of WDMs show that directly processing full-resolution WDMs by Submanifold Sparse Convolutions yields superior classification performance on known classes than traditional Convolutional Neural Networks, which require a preliminary binning to reduce the size of the binary images representing WDMs. Moreover, our solution outperforms state-of-the-art open-set recognition solutions in detecting novelties.

The surface code family is a promising approach to implementing fault-tolerant quantum computations. Universal fault-tolerance requires error-corrected non-Clifford operations, in addition to Clifford gates, and for the former, it is imperative to experimentally demonstrate additional resources known as magic states. Another challenge is to efficiently embed surface codes into quantum hardware with connectivity constraints. This work simultaneously addresses both challenges by employing a qubit-efficient rotated heavy-hexagonal surface code for IBM quantum processors (ibm\_fez) and implementing the magic state injection protocol. Our work reports error thresholds for both logical bit- and phase-flip errors, of approx0.37% and approx0.31%, respectively, which are higher than the threshold values previously reported with traditional embedding. The post-selection-based preparation of logical magic states |H_Lrangle and |T_Lrangle achieve fidelities of 0.8806pm0.0002 and 0.8665pm0.0003, respectively, which are both above the magic state distillation threshold. Additionally, we report the minimum fidelity among injected arbitrary single logical qubit states as 0.8356pm0.0003. Our work demonstrates the potential for realising non-Clifford logical gates by producing high-fidelity logical magic states on IBM quantum devices.

In recent years, Printed Circuit Boards (PCB) have become the backbone of a large number of consumer electronic devices leading to a surge in their production. This has made it imperative to employ automatic inspection systems to identify manufacturing defects in PCB before they are installed in the respective systems. An important task in this regard is the classification of defects as either true or pseudo defects, which decides if the PCB is to be re-manufactured or not. This work proposes a novel approach to detect most common defects in the PCBs. The problem has been approached by employing highly discriminative features based on multi-scale wavelet transform, which are further boosted by using a kernalized version of the support vector machines (SVM). A real world printed circuit board dataset has been used for quantitative analysis. Experimental results demonstrated the efficacy of the proposed method.

Printed Circuit Boards are the foundation for the functioning of any electronic device, and therefore are an essential component for various industries such as automobile, communication, computation, etc. However, one of the challenges faced by the PCB manufacturers in the process of manufacturing of the PCBs is the faulty placement of its components including missing components. In the present scenario the infrastructure required to ensure adequate quality of the PCB requires a lot of time and effort. The authors present a novel solution for detecting missing components and classifying them in a resourceful manner. The presented algorithm focuses on pixel theory and object detection, which has been used in combination to optimize the results from the given dataset.