ALPHA EF-6100 was specifically developed to deliver high reliability and excellent soldering performance combined with outstanding board cosmetics and pin-testability. ALPHA EF-6100 exhibits a low tendency for solder ball generation over a wide variety of solder masks during wave soldering and Selective Soldering operations. ALPHA EF-6100 should be considered for use by any assembler who has board designs which require high reliability, good through-hole-fill, reduced component bridging and reduced skips. ALPHA EF-6100 is a high-reliability, IPC, Bellcore, and JIS compliant, low solids, no-clean flux. It has been designed with a wide thermal process window enabling best-in-class productivity with lead-free wave soldering applications, and is an excellent choice for remaining tin-lead production lines. ALPHA EF-6100 is formulated with a proprietary mixture of organic activators to give more thermal stability, thereby reducing the occurrence of solder bridging during lead-free dual wave soldering.
Bellcore SIR, Bellcore ECM, JIS ECM, and JIS SIR.
Thermally stable activators provide minimized solder bridging in a low-solids, no-clean flux for wave soldering and Selective Soldering in lead-free and tin-lead applications.
Reduces the surface tension between solder mask and solder to resist solder ball formation.
Very low level of non-tacky residue to reduce interference with pin testing and exhibit no visible residue.